Contact Arrangement For Establishing A Spaced, Electrically Conducting Connection Between Microstructured Components

• US 20120187509A1
• Filed: 09/15/2009
• Published: 07/26/2012
• Est. Priority Date: 09/26/2008
• Status: Abandoned Application

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Wiemer, Maik, Franke, Axel, Trautmann, Achim, Feyh, Ando, Knies, Sonja, Froemel, Joerg, Gottfried, Knut
• Application Number:
  US13/120,994
• Publication Number:
  US 20120187509A1
• Time in Patent Office: Days
• US Class Current: 257/417
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: B81C 2203/038 Bonding techniques not provided for in B81C2203/031 - B81C2203/037
• CPC Class Codes: H01L 2224/05099 Material
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/13599 Material
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/29599 Material
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 24/94 at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01024 Chromium [Cr]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/01327 : Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/1461 : MEMS

Abstract

A contact arrangement for establishing a spaced, electrically conducting connection between a first wafer and a second wafer includes an electrical connection contact, a passivation layer on the electrical connection contact, and a dielectric spacer layer arranged on the passivation layer, wherein the contact arrangement is arranged at least on one of the first wafer and the second wafer, wherein the contact arrangement comprises trenches at least partly filled with a first material capable of forming a metal-metal connection, wherein the trenches are continuous trenches from the dielectric spacer layer through the passivation layer as far as the electrical connection contact, and wherein the first material is arranged in the trenches from the electrical connection contact as far as the upper edge of the trenches.

Claims

1. A contact arrangement for establishing a spaced, electrically conducting connection between a first wafer and a second wafer, the contact arrangement comprising:

an electrical connection contact;

a passivation layer on the electrical connection contact; and

a dielectric spacer layer arranged on the passivation layer,

wherein the contact arrangement is arranged at least on one of the first wafer and the second wafer,

wherein the contact arrangement comprises trenches at least partly filled with a first material capable of forming a metal-metal connection,

wherein the trenches are continuous trenches from the dielectric spacer layer through the passivation layer as far as the electrical connection contact, and

wherein the first material is arranged in the trenches from the electrical connection contact as far as the upper edge of the trenches.

2. The contact arrangement as claimed in claim 1, wherein the first material is applied as a layer on the surfaces of the inner sides of the trenches and the outer side of the spacer layer facing away from the electrical connection contact.

3. The contact arrangement as claimed in claim 1, wherein the first material fills the trenches and is not applied on the surface of the outer side of the dielectric spacer layer facing away from the electrical connection contact.

4. The contact arrangement as claimed in claim 1, wherein the first material is selected from the group comprising gold, silicon, germanium, aluminum, copper, tin, and indium.

5. A component arrangement, comprising:

a first wafer; and

a second wafer connected to the first wafer,

wherein the first wafer comprises a first microstructured component and the second wafer comprises a second microstructured component,

wherein the first wafer comprises a first contact arrangement including (i) a first electrical connection contact, (ii) a first passivation layer on the first electrical connection contact, and (iii) a first dielectric spacer layer arranged on the first passivation layer,

wherein the first contact arrangement comprises first trenches at least partly filled with a first material capable of forming a metal-metal connection,

wherein the first trenches are continuous trenches from the first dielectric spacer layer through the first passivation layer as far as the first electrical connection contact,

wherein the first material is arranged in the first trenches from the first electrical connection contact as far as the upper edge of the first trenches,

wherein the second wafer comprises a first mating contact connected to the first contact arrangement and comprising a second material capable of the metal-metal connection, and

wherein the first and the second material capable of the metal-metal connection furthermore form a connection together with one another.

6. The component arrangement as claimed in claim 5, wherein:

the first contact arrangement circumferentially surrounds a section of the first wafer,

a correspondingly formed first mating contact circumferentially surrounds a section of the second wafer,

the circumferential first contact arrangement forms a connection together with the circumferential first mating contact with formation of an at least partly closed cavity,

a second contact arrangement is furthermore arranged within the circumferentially surrounded section on the first wafer, said second contact arrangement being connected to a first microstructured component within said section and being connected to a corresponding second mating contact on the second wafer

said second contact arrangement including (i) a second electrical connection contact, (ii) a second passivation layer on the second electrical connection contact, and (iii) a second dielectric spacer layer arranged on the second passivation layer,

said second contact arrangement comprises second trenches at least partly filled with the second material capable of forming a metal-metal connection,

said second trenches are continuous trenches from the second dielectric spacer layer through the second passivation layer as far as the second electrical connection contact, and

said second material is arranged in the second trenches from the second electrical connection contact as far as the upper edge of the second trenches.

7. The component arrangement as claimed in claim 5, wherein the second component is a microelectromechanical component and the first component comprises an integrated circuit for one or more of control and signal processing for the microelectromechanical component, and wherein the first component and the second component are furthermore present in a manner encapsulated by the connection between the first wafer and the second wafer.

8. The component arrangement as claimed in claim 7, wherein the microelectromechanical component is an inertial sensor.

9. The component arrangement as claimed in claim 5, wherein the connection between the first contact arrangement and a corresponding mating contact is achieved by means of a gold-silicon eutectic, an aluminum-germanium eutectic, a tin-indium eutectic, by means of solid-liquid interdiffusion bonding of copper and tin or thermocompression bonding of copper.

10. A method for producing a contact arrangement, comprising:

providing a connection contact on a wafer;

applying a passivation layer on the connection contact;

structuring a dielectric spacer layer deposited on the passivation layer, wherein trenches are formed; and

depositing a first material capable of forming a metal-metal connection at least partly into the trenches,

wherein the trenches are structured as continuous trenches from the dielectric spacer layer as far as the connection contact, and

wherein the first material is deposited in the trenches from the connection contact as far as the upper edge of the trenches.