LIGHT EMITTING DIE (LED) PACKAGES AND RELATED METHODS
First Claim
1. A light-emitting die (LED) package comprising:
- a ceramic submount;
an LED disposed on the submount, the LED operable for emitting a dominant wavelength between approximately 610 nm and approximately 630 nm;
a lens disposed over the LED; and
the LED package configured to have a minimum luminous flux that is approximately 90 lm or greater when an electrical signal that is applied to the LED package comprises a current of approximately 350 mA.
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Accused Products
Abstract
LED packages and related methods are provided. The LED packages can include a submount having a top and bottom surface and a plurality of top electrically conductive elements on the top surface of the submount. An LED can be disposed on one of the top electrically conductive elements. The LED can emit a dominant wavelength generally between approximately 600 nm and approximately 650 nm, and more particularly between approximately 610 nm and approximately 630 nm when an electrical signal is applied to the top electrically conductive elements. A bottom thermally conductive element can be provided on the bottom surface and is not in electrical contact with the top electrically conductive elements. A lens can be disposed over the LED. The LED packages can have improved lumen performances, lower thermal resistances, improved efficiencies, and longer operational lifetimes.
45 Citations
34 Claims
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1. A light-emitting die (LED) package comprising:
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a ceramic submount; an LED disposed on the submount, the LED operable for emitting a dominant wavelength between approximately 610 nm and approximately 630 nm; a lens disposed over the LED; and the LED package configured to have a minimum luminous flux that is approximately 90 lm or greater when an electrical signal that is applied to the LED package comprises a current of approximately 350 mA. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A light-emitting die (LED) package comprising:
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a ceramic submount; an LED disposed on the submount, the LED operable for emitting a dominant wavelength between approximately 610 nm and approximately 630 nm; a lens disposed over the LED; and wherein the LED package is configured to generate a light output of approximately 120 lumens per watt or greater. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21)
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22. A light-emitting die (LED) package comprising:
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a submount comprising aluminum nitride; an LED disposed on the submount, the LED operable for emitting a dominant wavelength between approximately 610 nm and approximately 630 nm; and a lens disposed over the LED. - View Dependent Claims (23, 24, 25)
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26. A method of operating a light-emitting die (LED) package comprising:
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providing an LED package comprising; a ceramic submount; an LED disposed on the submount, the LED operable for emitting a dominant wavelength between approximately 610 nm and approximately 630 nm; and a lens disposed over the LED; applying an electrical signal to the LED package; and generating a light output from the LED in the LED package that is approximately 120 lumens per watts or greater. - View Dependent Claims (27, 28, 29, 30, 31)
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32. A light-emitting die (LED) package comprising:
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a submount; an LED disposed on the submount, the LED operable for emitting a dominant wavelength between approximately 610 nm and approximately 630 nm; and a thermal resistance of approximately 3°
C./Watt or less. - View Dependent Claims (33, 34)
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Specification