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LIGHT EMITTING DIE (LED) PACKAGES AND RELATED METHODS

  • US 20120187862A1
  • Filed: 07/20/2011
  • Published: 07/26/2012
  • Est. Priority Date: 10/31/2007
  • Status: Active Grant
First Claim
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1. A light-emitting die (LED) package comprising:

  • a ceramic submount;

    an LED disposed on the submount, the LED operable for emitting a dominant wavelength between approximately 610 nm and approximately 630 nm;

    a lens disposed over the LED; and

    the LED package configured to have a minimum luminous flux that is approximately 90 lm or greater when an electrical signal that is applied to the LED package comprises a current of approximately 350 mA.

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