PROVIDING A PRELOAD APPARATUS IN A TOUCH SENSITIVE ELECTRONIC DEVICE

• US 20120188194A1
• Filed: 01/20/2011
• Published: 07/26/2012
• Est. Priority Date: 01/20/2011
• Status: Abandoned Application

• Current Assignee: Blackberry Limited
• Original Assignee: Blackberry Limited
• Inventors: Sulem, Firmansyah Kuncoko, Infanti, James Carl
• Application Number:
  US13/009,984
• Publication Number:
  US 20120188194A1
• Time in Patent Office: Days
• US Class Current: 345/174
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 1/1643 the display being associated to a digitizer, e.g. laptops that can be used as penpads details related to the relative motion of the display enclosure with respect to the body enclosure, e.g. to move between laptop and tablet PC configuration G06F1/1615
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: G06F 2203/04105 Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Abstract

A spring component used in an electronic device provides a preload force used to urge a touch input component against a force transducer. The spring also provides an electrostatic grounding between the touch input component and other components of the electronic device. The use of the spring in an electronic device achieves both grounding and preloading and provides improvements in touch sensitive electronic devices.

Claims

1. An electronic device, comprising:

a housing comprising at least a first portion and a second portion;

a base chassis attached to the first portion of the housing;

a touch input component moveable with respect to the base chassis;

a force transducer between the base chassis and the touch input component, wherein the force transducer has a characteristic that is variable relative to an amount of total force of the touch input component against the base chassis;

a spring coupled to the touch input component, wherein the spring exerts a preload force against the second portion of the housing, thereby causing the touch input component to be forced against the force transducer by a corresponding initial force; and

wherein the spring provides electrostatic grounding between the touch input component and the base chassis.

2. The electronic device of claim 1, wherein the force transducer is a force sensitive resistor (FSR) and the force sensitive characteristic is an electrical resistance characteristic.

3. The electronic device of claim 1, wherein the force transducer has a nonlinear response across various amounts of total force, and wherein the initial force caused by the spring is greater than a break force associated with the nonlinear response.

4. The electronic device of claim 1, wherein the force transducer has a nonlinear response across various amounts of total force, and wherein the initial force caused by the spring is associated with a beginning of a target range within the nonlinear response.

5. The electronic device of claim 1, wherein the touch input component comprises a support tray and a touch sensitive display.

6. The electronic device of claim 1, wherein said electrostatic grounding conducts electric charge between the touch input component and the base chassis.

7. The electronic device of claim 1, further comprising:

a communications subsystem for sending or receiving wireless communication signals.

8. A spring comprising:

a mounting portion configured to mount the spring to a first component;

a grounding portion comprising a conductive grounding arm that provides electrostatic grounding between the first component and a second component; and

a preload portion comprising at least one preload arm that provides a preload force in a direction opposite from the grounding portion.

9. The spring of claim 8, further comprising:

at least one side portion that aligns the spring with the first component.

10. The spring of claim 9, wherein said side portion comprises a side of said preload arm.

11. The spring of claim 8, wherein the preload portion comprises two preload arms positioned at opposite sides of the mounting portion.

12. The spring of claim 8, wherein the preload portion is coupled to the mounting portion by a bend.

13. The spring of claim 8, wherein the spring comprises an electrostatically conductive material fabricated as a single unit.

14. The spring of claim 8, wherein the mounting portion comprises a clip with a side portion that aligns the spring and the first component.

15. The spring of claim 8, wherein the mounting portion comprises a dimple for seating in a socket of the first component.