Flexible Circuit Electrode Array

• US 20120192416A1
• Filed: 03/16/2012
• Published: 08/02/2012
• Est. Priority Date: 04/28/2005
• Status: Active Grant

• Current Assignee: Cortigent Incorporated
• Original Assignee: Second Sight Medical Products, Inc. (Vivani Medical, Inc.)
• Inventors: Neysmith, Jordan Matthew, Talbot, Neil Hamilton, Little, James Singleton, Mech, Brian V., Greenberg, Robert J., Yao, Qingfang, Zhou, Dao Min
• Granted Patent: US 9,314,615 B2
• Time in Patent Office: Days
• US Class Current: 29/847
• CPC Class Codes: A61N 1/0541 Cochlear electrodes
• CPC Class Codes: A61N 1/0543 Retinal electrodes
• CPC Class Codes: A61N 1/36046 of the eye
• CPC Class Codes: H05K 1/028 Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence
• CPC Class Codes: H05K 1/0353 consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/0133 Elastomeric or compliant polymer
• CPC Class Codes: H05K 2201/0141 Liquid crystal polymer [LCP]
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/0017 Etching of the substrate by chemical or physical means
• CPC Class Codes: H05K 3/0041 by plasma etching
• CPC Class Codes: H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: H05K 3/188 by direct electroplating
• CPC Class Codes: H05K 3/22 Secondary treatment of printed circuits H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107
• CPC Class Codes: H05K 3/388 by the use of a metallic or inorganic thin film adhesion layer
• CPC Class Codes: H05K 3/4644 : by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: Y10T 29/49156 : with selective destruction of conductive paths
• CPC Class Codes: Y10T 29/49158 : with molding of insulated base

Abstract

A flexible circuit electrode array with more than one layer of metal traces comprising: a polymer base layer; more than one layer of metal traces, separated by polymer layers, deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; and a polymer top layer deposited on said polymer base layer and said metal traces. Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, or cortical stimulation many purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow.

Claims

1. A method of making a flexible circuit electrode array comprising:

depositing a polymer base layer;

depositing a first metal layer on said polymer base layer;

patterning said first metal to form first metal traces;

depositing a polymer interlayer on said polymer base layer and said metal traces;

patterning said polymer interlayer to provide vias;

depositing a second metal layer on said polymer interlayer;

patterning said second metal layer to form second metal traces;

depositing a polymer top layer on said polymer interlayer and said second metal traces forming a flexible circuit; and

embedding the flexible circuit in an curved body having a generally curved in the plane of a retina, the curved body curved to conform to a spherical curvature of the retina.

2. The method according to claim 1, further comprising repeating the steps of depositing metal layers patterning and depositing polymer interlayers to create additional trace layers.

3. The method according to claim 1, wherein vias are created by MEMS process.

4. The method according to claim 1, wherein the steps of patterning polymer are etching by reactive plasma.

5. The method according to claim 1, wherein the steps of patterning polymer are etching by RIE.

6. The method according to claim 1, wherein the steps of patterning polymer are etching by Ion milling.

7. The method according to claim 1, wherein the steps of patterning metal layers is wet etching

8. The method according to claim 1, wherein the steps of patterning metal layers is dry etching.

9. The method according to claim 1, further comprising plating electrodes through openings in the polymer top layer.

10. The method according to claim 9, wherein the step of plating is electroplating.

11. The method according to claim 10, wherein the step of plating is electroplating platinum grey.

12. The method according to claim 9, wherein the step of plating is plating electrodes to protrude above the polymer top layer.

13. The method according to claim 12, wherein the protruding electrodes are shaped as a circle, star, square, ring or other geometric arrangement.

14. The method according to claim 1, further comprising creating openings in the polymer base layer to provide bond pads for attaching the flexible circuit electrode array to an electronic device.

15. The method according to claim 1, wherein the steps of depositing polymer are depositing polyimide, thermoplastic polyimide, silicone, parylene, LCP polymers, epoxy resin, PEEK, TPE, or mixtures thereof.

16. The method according to claim 1, wherein the steps of depositing metal are depositing titanium, platinum, palladium, iridium, gold, silver, niobium, titanium nitride, iridium oxide, ruthenium, ruthenium oxide, rhodium or other biocompatible metals or metal alloys or metal layers.

17. The method according to claim 1, wherein the steps of depositing metal include depositing an adhesion layer and a conducting layer.

18. The method according to claim 17, wherein the adhesion layer contains titanium.

19. The method according to claim 17, wherein the conducting layer includes platinum.

20. A method of making a flexible circuit electrode array comprising:

depositing a polymer base layer;

depositing a first metal layer on said polymer base layer;

patterning said first metal to form first metal traces;

depositing a polymer interlayer on said polymer base layer and said metal traces;

patterning said polymer interlayer to provide vias;

depositing a second metal layer on said polymer interlayer;

patterning said second metal layer to form second metal traces;

depositing a polymer top layer on said polymer interlayer and said second metal traces forming a flexible circuit; and

thermoforming the flexible circuit electrode array in an approximately spherical shape curved to conform to a spherical curvature of a retina.