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METHODS FOR FORMING BACKSIDE ILLUMINATED IMAGE SENSORS WITH FRONT SIDE METAL REDISTRIBUTION LAYERS

  • US 20120193741A1
  • Filed: 05/20/2011
  • Published: 08/02/2012
  • Est. Priority Date: 01/31/2011
  • Status: Active Grant
First Claim
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1. An image sensor configured to capture image light, comprising:

  • a semiconductor substrate having opposing first and second sides, wherein the first side includes an array of photosensitive elements and associated control circuitry and wherein the second side includes an array of corresponding color filter elements, wherein the image light reaches the photosensitive elements by passing through the color filter elements on the second side;

    bond pads on the first side of the semiconductor substrate;

    at least one dielectric layer having openings; and

    .a patterned metallization layer that has portions in the openings and portions that form contacts with the bond pads.

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