OHMIC CONNECTION USING WIDENED CONNECTION ZONES IN A PORTABLE ELECTRONIC OBJECT

• US 20120193804A1
• Filed: 08/05/2010
• Published: 08/02/2012
• Est. Priority Date: 08/06/2009
• Status: Abandoned Application

• Current Assignee: Rfideal
• Original Assignee: Rfideal
• Inventors: Grasset, Yannick
• Application Number:
  US13/389,224
• Publication Number:
  US 20120193804A1
• Time in Patent Office: Days
• US Class Current: 257/773
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 2224/023 Redistribution layers [RDL] for bonding areas
• CPC Class Codes: H01L 2224/13016 in side view
• CPC Class Codes: H01L 2224/1411 the bump connectors being bonded to at least one common bonding area
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/81903 by means of a layer connector
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 2224/90 Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 23/482 consisting of lead-in layers inseparably applied to the semiconductor body electrodes H01L29/40
• CPC Class Codes: H01L 24/12 Structure, shape, material or disposition of the bump connectors prior to the connecting process
• CPC Class Codes: H01L 24/28 Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 24/90 Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/3011 : Impedance

Abstract

The invention relates to portable electronic objects comprising an integrated circuit chip, and a mounting having two connection terminals for a circuit, as well as to a method for manufacturing such objects. The invention is characterized in that the chip is provided, on the active surface thereof, with two widened connection zones, in particular connection plates, said connection plates being positioned opposite said terminals and electrically connected, by ohmic contact, to the latter, and in that the surface defined by the connection plates, at the surface of the active integrated circuit having said plates, is greater than ½ of the surface of said surface. The invention can be used, in particular, for RFID objects.

Claims

1. A portable electronic object comprising, on the one hand, an integrated circuit chip and, on the other hand, a substrate having an antenna circuit having two connection terminals, said chip being mounted in a flipped-over state on said substrate, and being provided, on its active side, with two widened connection areas, said connection areas being positioned opposite said terminals and being electrically connected, by ohmic contact, to the latter, and wherein the surface area defined by the connection areas on the active side of the integrated circuit having said connection areas is greater than ½

of the surface area of said side.

2. The portable object according to claim 1, having a contactless mode of operation.

3. The portable object according to claim 1, wherein the widened connection areas are connection plates.

4. The portable object according to claim 1, wherein the surface area defined by the widened connection areas on the active side of the integrated circuit chip provided with said areas is greater than or equal to ⅔

of the surface area of said side.

5. The portable object according to claim 1, wherein the active side of the chip has a surface area in the range between 0.09 mm² and 0.64 mm².

6. The portable object according to claim 1, wherein the surface of the active side of the chip carries contact pads, which reach the surface through a passivation layer of said chip, and wherein said active side is further provided with an insulating layer having the widened connection areas connected to the contact pads.

7. The object according to claim 1, wherein the chip is bonded to the substrate either by means of an anisotropic Z-axis conductive adhesive providing the electrical connection between the widened connection areas and the antenna terminals, or by means of an insulating adhesive.

8. The portable object according to claim 1, wherein said object is a RFID label operating at a high frequency of 13.56 MHz or at ultrahigh frequencies in the range between 860 and 960 MHz.

9. A method for manufacturing a portable electronic object, which comprises the steps of:

providing an integrated circuit chip having an active side, and a substrate having two connection terminals of an antenna circuit;

providing two widened connection areas on the active side of the chip, the surface area defined by said connection areas on the active side of the integrated circuit carrying said connection areas being greater than ½

of the surface area of said side; and

flipping the chip over and mounting the latter on its substrate to electrically connect the widened connection areas, by ohmic contact, to the circuit terminals.

10. The method according to claim 9, wherein the circuit is an antenna circuit and the portable electronic object is a contactless object.

11. The method according to claim 9, wherein the widened connection areas are connection plates.

12. The manufacturing method according to claim 9, wherein the surface of the active side of the chip carries contact pads, which reach its surface through a passivation layer of said chip and wherein said active side is further provided with an insulating layer having the widened connection areas connected to the contact pads.