LED DEVICE

• US 20120194067A1
• Filed: 04/13/2012
• Published: 08/02/2012
• Est. Priority Date: 04/30/2009
• Status: Abandoned Application

• Current Assignee: Lite-On Electronics Company Limited (Lite-On Technology Corporation)
• Original Assignee: Lite-On Technology Corporation, Silitek Electronic Company Limited (Lite-On Technology Corporation)
• Inventors: WU, CHIA-HAO, LEE, TIEN-YU
• Application Number:
  US13/447,129
• Publication Number:
  US 20120194067A1
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

Abstract

A LED device includes a base structure having a receiving space, a light-emitting chip, an encapsulating structure, and a phosphor layer. The receiving space is defined by an inner bottom surface of the base structure and an inner side wall surrounding the inner bottom surface. The light-emitting chip is mounted on the bottom of the receiving space. The encapsulating structure is filled into the receiving space to cover the light-emitting chip. The phosphor layer is formed on the encapsulating structure. The dimension of the phosphor layer is more than the dimension of the receiving space and less than 1.5 times that of the receiving space, so as to mount on the top surface of the base structure.

Claims

1. A LED device, comprising:

a lead frame set having a positive conduct element and a negative conduct element spaced from each other;

a casing formed on the lead frame set and isolating the positive conduct element and the negative conduct element from each other, the lead frame set and the casing cooperatively defining a receiving space;

a light emitting chip disposed on one of the positive and the negative conduct elements at the bottom portion of the receiving space and electrically connected to the lead frame set;

an encapsulating unit disposed in the receiving space and covering the top and side surfaces of the light emitting chip;

a macromolecule layer disposed on the encapsulating unit; and

a phosphor layer formed on the macromolecule layer;

wherein the macromolecule layer is solidified after the formation of the phosphor layer, and

wherein the dimension of the phosphor layer is greater than that of the receiving space so as to be mounted coveringly above the receiving space.

2. The LED device as claimed in claim 1, wherein the phosphor layer is a phosphor powder flake or a layer with a macromolecule material and phosphor powder.

3. The LED device as claimed in claim 1, wherein the encapsulating structure has a flat upper surface.

4. The LED device as claimed in claim 1, wherein the upper surface of the encapsulating unit is substantially aligned with the top surface of the casing.