TEMPERATURE REGULATION OF MEASUREMENT ARRAYS

• US 20120196759A1
• Filed: 10/18/2011
• Published: 08/02/2012
• Est. Priority Date: 01/27/2011
• Status: Active Grant

• Current Assignee: Roche Sequencing Solutions, Inc. (Roche Holding AG)
• Original Assignee: Genia Technologies, Inc. (Roche Holding AG)
• Inventors: Chen, Roger
• Granted Patent: US 9,110,478 B2
• Time in Patent Office: Days
• US Class Current: 506/7
• CPC Class Codes: B01J 19/0046 Sequential or parallel reactions, e.g. for the synthesis of polypeptides or polynucleotides; Apparatus and devices for combinatorial chemistry or for making molecular arrays synthesis methods per se C40B50/00
• CPC Class Codes: B01J 2219/00495 Means for heating or cooling the reaction vessels
• CPC Class Codes: B01J 2219/00698 Measurement and control of process parameters
• CPC Class Codes: G05D 23/1919 characterised by the type of controller
• CPC Class Codes: G05D 23/2034 the sensing element being a semiconductor
• CPC Class Codes: G05D 23/2037 details of the regulator

Abstract

A system for regulating a temperature of a measurement array is disclosed. The system includes a measurement array including a plurality of sensors, wherein the plurality of sensors are integrated onto an integrated circuit die. The system includes a thermal sensor integrated onto the integrated circuit die, wherein the thermal sensor senses a temperature associated with the plurality of sensors. The system further includes a heat pump coupled to the integrated circuit die, wherein the heat pump is controlled by a feedback control circuit including the thermal sensor.

Claims

1. A system for regulating a temperature of a measurement array, comprising:

a measurement array including a plurality of sensors, wherein the plurality of sensors are integrated onto an integrated circuit die;

a thermal sensor integrated onto the integrated circuit die, wherein the thermal sensor senses a temperature associated with the plurality of sensors; and

a heat pump coupled to the integrated circuit die, wherein the heat pump is controlled by a feedback control circuit including the thermal sensor.

2. The system of claim 1, wherein the measurement array comprises a biochemical measurement array, and wherein each of the plurality of sensors comprises a biochemical sensor.

3. The system of claim 1, wherein the feedback control circuit is configured to maintain the temperature associated with the plurality of sensors at a predetermined temperature, and wherein the predetermined temperature is configurable.

4. The system of claim 1, wherein sensing the temperature associated with the plurality of is sensors comprises sensing a temperature associated with the integrated circuit die.

5. The system of claim 1, wherein the heat pump comprises a Peltier heat pump.

6. The system of claim 1, wherein the heat pump includes a first surface in contact with the integrated circuit die and a second surface in contact with a heat sink, and wherein heat is transferred from one surface to another.

7. The system of claim 1, wherein the feedback control circuit is configured as a linear feedback control circuit.

8. The system of claim 7, wherein the linear feedback control circuit includes an amplifier, and wherein the amplifier is coupled to the thermal sensor.

9. The system of claim 7, wherein the linear feedback control circuit further includes a thermoelectric cooler controller chip.

10. The system of claim 7, wherein the system is configured to form an asymptotically Lyapunov stable linear control loop.

11. The system of claim 7, wherein the system is represented by a thermal model, and wherein the system is configured at least in part based on at least one relationship between two parameters associated with the thermal model.

12. The system of claim 11, wherein the at least one relationship comprises a relationship between a thermal capacitance associated with a heat sink coupled to the heat pump and a thermal capacitance associated with the heat pump.

13. The system of claim 12, wherein the thermal capacitance associated with the heat sink coupled to the heat pump is substantially larger than the thermal capacitance associated with the heat pump.

14. The system of claim 11, wherein the at least one relationship comprises a relationship between a thermal capacitance associated with a heat sink coupled to the heat pump and a thermal capacitance associated with the integrated circuit die.

15. The system of claim 14, wherein the thermal capacitance associated with the heat sink coupled to the heat pump is substantially larger than the thermal capacitance associated with the is integrated circuit die.

16. The system of claim 11, wherein the at least one relationship comprises a relationship between a first thermal resistance and a second thermal resistance, and wherein the first thermal resistance comprises a thermal resistance between the integrated circuit die and ambient air surrounding the integrated circuit die, and wherein the second thermal resistance comprises a thermal resistance between a heat sink coupled to the heat pump and ambient air surrounding the heat sink.

17. The system of claim 16, wherein the first thermal resistance is substantially larger than the second thermal resistance.

18. The system of claim 11, wherein the at least one relationship comprises a relationship between a first thermal resistance and a second thermal resistance, and wherein the first thermal resistance comprises a thermal resistance between the integrated circuit die and ambient air surrounding the integrated circuit die, and wherein the second thermal resistance comprises a thermal resistance between a heat sink coupled to the heat pump and the heat pump.

19. The system of claim 18, wherein the first thermal resistance is substantially larger than the second thermal resistance.

20. The system of claim 11, wherein the at least one relationship comprises a relationship between a first thermal resistance and a second thermal resistance, and wherein the first thermal resistance comprises a thermal resistance between the integrated circuit die and ambient air surrounding the integrated circuit die, and wherein the second thermal resistance comprises a thermal resistance between the heat pump and the integrated circuit die.

21. The system of claim 20, wherein the first thermal resistance is substantially larger than the second thermal resistance.

22. The system of claim 1, wherein the thermal sensor includes one of the following:

a thermal transistor, diode, or other on-chip temperature sensor.

23. The system of claim 1, wherein the feedback control circuit is configured as a bang-bang control circuit.

24. A method for regulating a temperature of a measurement array, comprising:

is integrating a measurement array onto an integrated circuit die, wherein the measurement array includes a plurality of sensors;

integrating a thermal sensor onto the integrated circuit die;

sensing a temperature associated with the plurality of sensors using the thermal sensor; and

controlling a heat pump with a feedback control circuit including the thermal sensor, wherein the heat pump is coupled to the integrated circuit die.