TEMPERATURE REGULATION OF MEASUREMENT ARRAYS
First Claim
Patent Images
1. A system for regulating a temperature of a measurement array, comprising:
- a measurement array including a plurality of sensors, wherein the plurality of sensors are integrated onto an integrated circuit die;
a thermal sensor integrated onto the integrated circuit die, wherein the thermal sensor senses a temperature associated with the plurality of sensors; and
a heat pump coupled to the integrated circuit die, wherein the heat pump is controlled by a feedback control circuit including the thermal sensor.
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Abstract
A system for regulating a temperature of a measurement array is disclosed. The system includes a measurement array including a plurality of sensors, wherein the plurality of sensors are integrated onto an integrated circuit die. The system includes a thermal sensor integrated onto the integrated circuit die, wherein the thermal sensor senses a temperature associated with the plurality of sensors. The system further includes a heat pump coupled to the integrated circuit die, wherein the heat pump is controlled by a feedback control circuit including the thermal sensor.
40 Citations
24 Claims
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1. A system for regulating a temperature of a measurement array, comprising:
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a measurement array including a plurality of sensors, wherein the plurality of sensors are integrated onto an integrated circuit die; a thermal sensor integrated onto the integrated circuit die, wherein the thermal sensor senses a temperature associated with the plurality of sensors; and a heat pump coupled to the integrated circuit die, wherein the heat pump is controlled by a feedback control circuit including the thermal sensor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method for regulating a temperature of a measurement array, comprising:
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is integrating a measurement array onto an integrated circuit die, wherein the measurement array includes a plurality of sensors; integrating a thermal sensor onto the integrated circuit die; sensing a temperature associated with the plurality of sensors using the thermal sensor; and controlling a heat pump with a feedback control circuit including the thermal sensor, wherein the heat pump is coupled to the integrated circuit die.
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Specification