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METHOD FOR RECYCLING A SOURCE SUBSTRATE

  • US 20120199956A1
  • Filed: 02/07/2012
  • Published: 08/09/2012
  • Est. Priority Date: 02/08/2011
  • Status: Abandoned Application
First Claim
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1. A process for recycling a source substrate comprising a surface region and regions in relief on the surface region, with the regions in relief corresponding to residual regions of a layer of the source substrate that were not separated from the rest of the source substrate during a prior removal step, implementing cleavage at a weakened zone formed by damaged material of the source substrate, wherein the surface region corresponds to part of the weakened zone not separated from the rest of the source substrate during the prior removal step, wherein the recycling process comprises applying selective electromagnetic irradiation to the source substrate at a wavelength such that the damaged material of the surface region absorbs the electromagnetic irradiation to facilitate selective removal of the regions in relief.

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