Infrared gesture recognition device and method

• US 20120200486A1
• Filed: 02/09/2011
• Published: 08/09/2012
• Est. Priority Date: 02/09/2011
• Status: Abandoned Application

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Meinel, Walter B., Lazarov, Kalin V., Kalthoff, Timothy V.
• Application Number:
  US12/931,783
• Publication Number:
  US 20120200486A1
• Time in Patent Office: Days
• US Class Current: 345/156
• CPC Class Codes: G06F 3/017 Gesture based interaction, e.g. based on a set of recognized hand gestures interaction based on gestures traced on a digitiser G06F3/04883
• CPC Class Codes: H04N 5/33 Transforming infrared radiation cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20

Abstract

A system for generating tracking coordinate information in response to movement of an information-indicating element includes an array (55) of IR sensors (60-x,y) disposed along a surface (55A) of the array. Each IR sensor includes first (7) and second (8) thermopile junctions connected in series to form a thermopile (7,8) within a dielectric stack (3) of a radiation sensor chip (1). The first thermopile junction is more thermally insulated from a substrate (2) of the radiation sensor chip than the second thermopile junction. A sensor output signal between the first and second thermopile junctions is coupled to a bus (63). A processing device (64) is coupled to the bus for operating on information representing temperature differences between the first and second thermopile junctions of the various IR sensors, respectively, caused by the presence of the information-indicating element to produce the tracking coordinate information as the information-indicating element moves along the surface.

Claims

1. A system for generating tracking coordinate information in response to movement of an information-indicating element, comprising:

(a) an array of IR (infrared) sensors disposed along a surface of the array;

(b) each IR sensor including

first and second thermopile junctions connected in series to form a thermopile within a dielectric stack of a radiation sensor chip, the first thermopile junction being more thermally insulated from a substrate of the radiation sensor chip than the second thermopile junction, a sensor output signal between the first and second thermopile junctions being coupled to a bus; and

(c) a processing device coupled to the bus for receiving information representing temperature differences between the first and second thermopile junctions of the various IR sensors, respectively, caused by the presence of the information-indicating element, the processing device operating on the information representing the temperature differences to produce the tracking coordinate information as the information-indicating element moves along the surface.

2. The system of claim 1 wherein the surface lies along surfaces of the substrates of the radiation sensor chips.

3. The system of claim 1 wherein each first thermopile junction is insulated from the substrate by means of a corresponding cavity between the substrate and the dielectric stack.

4. The system of claim 1 wherein a plurality of bonding pads coupled to the thermopile are disposed on the radiation sensor chip, and a plurality of bump conductors are attached to the bonding pads, respectively, for physically and electrically coupling the radiation sensor chip to conductors on a circuit board.

5. The system of claim 1 wherein the dielectric stack is a CMOS semiconductor process dielectric stack including a plurality of SiO₂ sublayers and various polysilicon traces, titanium nitride traces, tungsten contacts, and aluminum metalization traces between the various sublayers patterned to provide the first and second thermopile junctions connected in series to form the thermopile, and wherein each IR sensor includes CMOS circuitry coupled between first and second terminals of the thermopile to receive and operate on a thermoelectric voltage generated by the thermopile in response to infrared (IR) radiation received by the radiation sensor chip, the CMOS circuitry also being coupled to the bonding pads.

6. The system of claim 5 wherein the CMOS circuitry converts the thermoelectric voltage to digital information in an PC format and sends the digital information to the processing device via the bus.

7. The system of claim 5 wherein the processing device operates on the digital information to generate a sequence of vectors that indicate locations and directions of the information-indicating element as it moves along the surface.

8. The system of claim 7 wherein the information-indicating element includes at least part of a human hand, and the processing device operates on the vectors to interpret gestures represented by the movement of the hand along the surface.

9. The system of claim 1 wherein the IR sensors are represented by measured pixels which are spaced apart along the surface.

10. The system of claim 1 wherein the IR sensors are disposed along a periphery of a display to produce temperature differences between the first and second thermopile junctions of the various IR sensors caused by the presence of the information-indicating element as it moves along the surface of the display.

11. The system of claim 1 wherein the IR sensors are represented by measured pixels which are spaced apart along the surface, and wherein the processing device interpolates values of various interpolated pixels located between various measured pixels.

12. The system of claim 1 wherein the substrate is composed of silicon to pass infrared radiation to the thermopile and block visible radiation, and further including a passivation layer disposed on the dielectric stack, a plurality of generally circular etchant openings located between the various traces and extending through the passivation layer and the dielectric layer to the cavity for introducing silicon etchant to produce the cavity by etching the silicon substrate.

13. The system of claim 1 wherein the processing device includes a microprocessor.

14. The system of claim 1 wherein the radiation sensor chip is part of a WCSP (wafer chip scale package).

15. A method for generating tracking coordinate information in response to movement of an information-indicating element, the method comprising:

(a) providing an array of IR (infrared) sensors disposed along a surface of the array, each IR sensor including first and second thermopile junctions connected in series to form a thermopile within a dielectric stack of a radiation sensor chip, the first thermopile junction being more thermally insulated from a substrate of the radiation sensor chip than the second thermopile junction, a sensor output signal between the first and second thermopile junctions being coupled to a bus;

(b) coupling a processing device to the bus;

(c) operating the processing device to receive information representing temperature differences between the first and second thermopile junctions of the various IR sensors, respectively, caused by the presence of the information-indicating element; and

(d) causing the processing device to operate on the information representing the temperature differences to produce the tracking coordinate information as the information-indicating element moves along the surface.

16. The method of claim 15 wherein the substrate is composed of silicon to pass infrared radiation to the thermopile and block visible radiation, and wherein step (a) includes providing the surface along surfaces of the substrates of the IR sensors and providing a cavity between the substrate and the first thermopile junction to thermally insulate the first thermopile junction from the substrate.

17. The method of claim 15 wherein step (a) includes providing the radiation sensor chip as part of a WCSP (wafer chip scale package).

18. The method of claim 15 wherein the bus is an I²C bus, and wherein step (a) includes providing I²C interface circuitry coupled between the I²C bus and first and second terminals of the thermopile.

19. The method of claim 18 wherein step (a) includes providing CMOS circuitry which includes the I²C interface circuitry in each IR sensor coupled between the first and second terminals of the thermopile to receive and operate on a thermoelectric voltage generated by the thermopile in response to infrared (IR) radiation received by the radiation sensor chip.

20. A system for generating tracking coordinate information in response to movement of an information-indicating element, comprising:

(a) an array of IR (infrared) sensors disposed along a surface of the array, each IR sensor including first and second thermopile junctions connected in series to form a thermopile within a dielectric stack of a radiation sensor chip, the first thermopile junction being more thermally insulated from a substrate of the radiation sensor chip than the second thermopile junction, a sensor output signal between the first and second thermopile junctions being coupled to a bus; and

(b) processing means coupled to the bus for operating on information representing temperature differences between the first and second thermopile junctions of the various IR sensors, respectively, caused by the presence of the information-indicating element to produce the tracking coordinate information as the information-indicating element moves along the surface.