Anti-Tamper Wrapper Interconnect Method and a Device
First Claim
Patent Images
1. A method for electrically coupling a mesh structure to a module comprising the steps of:
- defining a stud bump on a conductive mesh pad in an anti-tamper mesh,defining a conductive epoxy on a conductive module pad,aligning the stud bump with the conductive epoxy, and,bonding the stud bump to the conductive epoxy to electrically couple the conductive mesh pad to the conductive module pad.
3 Assignments
0 Petitions
Accused Products
Abstract
A method for electrically coupling an anti-tamper mesh to an electronic module or device using wire bonding equipment and a device made from the method. Stud bumps or free air ball bonds are electrically coupled to conductive mesh pads of an anti-tamper mesh. Respective module pads have a conductive epoxy disposed thereon for the receiving of the stud bumps or free air ball bonds, each of which are aligned and bonded together to electrically couple the anti-tamper mesh to predetermined module pads.
12 Citations
10 Claims
-
1. A method for electrically coupling a mesh structure to a module comprising the steps of:
-
defining a stud bump on a conductive mesh pad in an anti-tamper mesh, defining a conductive epoxy on a conductive module pad, aligning the stud bump with the conductive epoxy, and, bonding the stud bump to the conductive epoxy to electrically couple the conductive mesh pad to the conductive module pad.
-
-
2. A method for electrically coupling a mesh structure to a module comprising the steps of:
-
electrically connecting a tail of a free air ball bond on a conductive mesh pad in an anti-tamper mesh, defining a conductive epoxy on a conductive module pad, aligning the free air ball bond with the conductive epoxy, and, bonding the free air ball bond to the conductive epoxy to electrically couple the conductive mesh pad to the conductive module pad.
-
-
3. A electronic device fabricated from a method comprising the steps of:
-
providing an electronic device having a conductive module pad on a surface thereof, defining a stud bump on a conductive mesh pad in an anti-tamper mesh, defining a conductive epoxy on a conductive module pad, aligning the stud bump with the conductive epoxy, and, bonding the stud bump to the conductive epoxy to electrically couple the conductive mesh pad to the conductive module pad. - View Dependent Claims (4, 5, 6)
-
-
7. An electronic device fabricated from a method comprising the steps of:
-
providing an electronic device having a conductive metal pad on a surface thereof, electrically connecting a tail of a free air ball bond on a conductive mesh pad in an anti-tamper mesh, defining a conductive epoxy on a conductive module pad, aligning the free air ball bond with the conductive epoxy, and, bonding the free air ball bond to the conductive epoxy to electrically couple the conductive mesh pad to the conductive module pad. - View Dependent Claims (8, 9, 10)
-
Specification