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Anti-Tamper Wrapper Interconnect Method and a Device

  • US 20120205801A1
  • Filed: 02/10/2012
  • Published: 08/16/2012
  • Est. Priority Date: 02/16/2011
  • Status: Active Grant
First Claim
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1. A method for electrically coupling a mesh structure to a module comprising the steps of:

  • defining a stud bump on a conductive mesh pad in an anti-tamper mesh,defining a conductive epoxy on a conductive module pad,aligning the stud bump with the conductive epoxy, and,bonding the stud bump to the conductive epoxy to electrically couple the conductive mesh pad to the conductive module pad.

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