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TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS

  • US 20120206160A1
  • Filed: 02/11/2011
  • Published: 08/16/2012
  • Est. Priority Date: 02/11/2011
  • Status: Active Grant
First Claim
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1. A test structure for performing electrical tests of devices under one or more microbumps, comprising:

  • at least one device; and

    a metal pad connected to an interconnect for the at least one device, the metal pad comprising;

    a first portion forming at least one microbump pad, wherein a width of the at least one microbump pad is equal to or less than about 50 μ

    m, anda second portion forming a test pad connected to the at least one microbump pad, wherein the test pad has a size large enough to allow circuit probing of the at least first device, and wherein a width of the test pad is greater than the at least one microbump pad.

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