Devices Having Anisotropic Conductivity Heatsinks, and Methods of Making Thereof
First Claim
Patent Images
1. A device comprising:
- a circuit board having a thermally conductive core layer;
a chip disposed over the circuit board; and
a heat sink disposed over the chip, wherein a thermal conductivity of the heat sink along a first direction is larger than a thermal conductivity along a second direction, the first direction being perpendicular to the second direction, and wherein the heat sink is thermally coupled to the thermally conductive core layer.
1 Assignment
0 Petitions
Accused Products
Abstract
In accordance with an embodiment of the present invention, a device includes a circuit board with a thermally conductive core layer and a chip disposed over the circuit board. The device further includes a heat sink disposed over the chip. The thermal conductivity of the heat sink along a first direction is larger than a thermal conductivity along a second direction. The first direction is perpendicular to the second direction. The heat sink is thermally coupled to the thermally conductive core layer.
-
Citations
25 Claims
-
1. A device comprising:
-
a circuit board having a thermally conductive core layer; a chip disposed over the circuit board; and a heat sink disposed over the chip, wherein a thermal conductivity of the heat sink along a first direction is larger than a thermal conductivity along a second direction, the first direction being perpendicular to the second direction, and wherein the heat sink is thermally coupled to the thermally conductive core layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
-
-
17. A printed circuit board assembly comprising:
-
a substrate having a thermally conductive core layer; a semiconductor device disposed over the substrate; and a heat sink having an anisotropic thermal conductivity disposed over the semiconductor device, wherein a bottom surface of the heat sink is thermally coupled to the thermally conductive core layer, the bottom surface of the heat sink being closer to the semiconductor device than an opposite top surface of the heat sink. - View Dependent Claims (18, 19, 20, 21)
-
-
22. A method for forming a printed circuit board assembly, the method comprising:
-
placing a semiconductor device over a substrate, the substrate having a thermally conductive core layer; placing a heat sink having an anisotropic thermal conductivity over the semiconductor device; and thermally coupling a bottom surface of the heat sink to the thermally conductive core layer, the bottom surface of the heat sink being closer to the semiconductor device than an opposite top surface of the heat sink. - View Dependent Claims (23, 24, 25)
-
Specification