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Devices Having Anisotropic Conductivity Heatsinks, and Methods of Making Thereof

  • US 20120206882A1
  • Filed: 03/24/2011
  • Published: 08/16/2012
  • Est. Priority Date: 02/14/2011
  • Status: Active Grant
First Claim
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1. A device comprising:

  • a circuit board having a thermally conductive core layer;

    a chip disposed over the circuit board; and

    a heat sink disposed over the chip, wherein a thermal conductivity of the heat sink along a first direction is larger than a thermal conductivity along a second direction, the first direction being perpendicular to the second direction, and wherein the heat sink is thermally coupled to the thermally conductive core layer.

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