Side Light Type Backlight Module and Back Plate Heat Dissipation Structure Thereof

• US 20120206941A1
• Filed: 09/30/2010
• Published: 08/16/2012
• Est. Priority Date: 07/12/2010
• Status: Active Grant

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: He, Chengming, Tang, Guofu
• Granted Patent: US 8,419,256 B2
• Time in Patent Office: Days
• US Class Current: 362/613
• CPC Class Codes: G02B 6/0068 Arrangements of plural sources, e.g. multi-colour light sources
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: G02B 6/0085 Means for removing heat created by the light source from the package heat extraction or cooling elements for semiconductor light sources in general H01L33/64

Abstract

The present invention discloses a side light type backlight module and a back plate heat dissipation structure thereof. The back plate heat dissipation structure comprises a bottom part, at least one side wall part and an extension part. The bottom part forms a main body of the back plate heat dissipation structure. The side wall part is formed by at least one edge of the bottom part extending upwards for at least one light source set attached on the inner surface thereof. The extension part is formed by the edge of the bottom part extending upwards. The heat generated by the light source set is conducted to the extension part and the bottom part through the top and the bottom of the side wall part. The total heat dissipation efficiency of the side light type backlight module can be raised by a dual way heat dissipation module.

Claims

1. A side light type backlight module, comprising:

a back plate heat dissipation structure, comprising;

a bottom part and at least one side wall part, and the bottom part is a main body of the back plate heat dissipation structure, and the at least side wall part is formed by at least one edge of the bottom part extending upwards from the bottom part;

a light guide plate, positioned on the back plate heat dissipation structure; and

at least one light source set, positioned at the inner surface of the side wall part and between the side wall part and the light guide plate, characterized in that the back plate heat dissipation structure of the side light type backlight module further comprises an extension part, comprising;

a first horizontal extension part, formed by the top of the side wall part extending outwards horizontally; and

a first vertical extension part, formed by the outer of the first horizontal extension part extending downwards vertically, wherein the heat generated by the at least one light source at the side wall part is conducted to the extension part through the top of the side wall part and conducted to the bottom part through the bottom of the side wall part.

2. A side light type backlight module, comprising:

a back plate heat dissipation structure, comprising;

a bottom part and at least one side wall part, and the bottom part is a main body of the back plate heat dissipation structure, and the at least side wall part is formed by at least one edge of the bottom part extending upwards from the bottom part;

a light guide plate, positioned on the back plate heat dissipation structure; and

at least one light source set, positioned at the inner surface of the side wall part and between the side wall part and the light guide plate;

characterized in that the back plate heat dissipation structure of the side light type backlight module further comprises an extension part, formed by the top of the side wall part of the back plate heat dissipation structure extending outwards, wherein the heat generated by the at least one light source at the side wall part is conducted to the extension part through the top of the side wall part and conducted to the bottom part through the bottom of the side wall part.

3. The side light type backlight module of claim 2, characterized in that the at least one light source comprises a circuit board and a lighting element, and the circuit board is attached to the inner surface of the side wall part, and a light direction of the lighting element is directed toward the light guide plate.

4. A back plate heat dissipation structure of a side light type backlight module, comprising:

a bottom part, forming a main body of the back plate heat dissipation structure; and

at least one side wall part, formed by at least one edge of the bottom part extending upwards from the bottom part, wherein at least one light source set is attached to the inner surface of the side wall part;

characterized in that the back plate heat dissipation structure further comprises an extension part, formed by the top of the side wall part extending outwards, wherein the heat generated by the at least one light source at the side wall part is conducted to the extension part through the top of the side wall part and conducted to the bottom part through the bottom of the side wall part.

5. The back plate heat dissipation structure of the side light type backlight module of claim 4, characterized in that the extension part comprises:

a first horizontal extension part, formed by the top of the side wall part extending outwards horizontally; and

a first vertical extension part, formed by the outer of the first horizontal extension part extending downwards vertically, and a distance exists between the first vertical extension part and the side wall part.

6. The back plate heat dissipation structure of the side light type backlight module of claim 5, characterized in that at least one heat conductive material or at least one heat pipe is positioned between the side wall part and the first vertical extension part.

7. The back plate heat dissipation structure of the side light type backlight module of claim 5, characterized in that a plurality of penetrating thermal vias is positioned on the side wall part and the first vertical extension part for exposing a back side of a circuit board of the at least one light source set.

8. The back plate heat dissipation structure of the side light type backlight module of claim 5, characterized in that the extension part further comprises:

a second horizontal extension part, formed by the bottom of the first vertical extension part extending outwards horizontally; and

a second vertical extension part, formed by the outer of the second horizontal extension part extending upwards vertically.

9. The back plate heat dissipation structure of the side light type backlight module of claim 8, characterized in that at least one heat conductive material or at least one heat pipe is positioned between the first vertical extension part and the second vertical extension part.

10. The back plate heat dissipation structure of the side light type backlight module of claim 8, characterized in that a plurality of penetrating thermal vias is positioned on the side wall part, the first vertical extension part and the second vertical extension part for exposing a back side of a circuit board of the at least one light source set.

11. The back plate heat dissipation structure of the side light type backlight module of claim 5, characterized in that the extension part further comprises:

a second horizontal extension part, formed by the bottom of the first vertical extension part extending inwards horizontally under the bottom part.

12. The back plate heat dissipation structure of the side light type backlight module of claim 11, characterized in that at least one heat conductive material or at least one heat pipe is positioned between the bottom part and the second horizontal extension part.

13. The back plate heat dissipation structure of the side light type backlight module of claim 8, characterized in that the extension part further comprises:

a third horizontal extension part, formed by the top of the second vertical extension part extending outwards horizontally; and

a third vertical extension part, formed by the outer of the third horizontal extension part downwards vertically.

14. The back plate heat dissipation structure of the side light type backlight module of claim 13, characterized in that at least one heat conductive material or at least one heat pipe is positioned between the second vertical extension part and the third vertical extension part.

15. The back plate heat dissipation structure of the side light type backlight module of claim 13, characterized in that a plurality of penetrating thermal vias is positioned on the side wall part, the first vertical extension part, the second vertical extension part and the third vertical extension part for exposing a back side of a circuit board of the at least one light source set.