HIGH-FREQUENCY MODULE

• US 20120208591A1
• Filed: 08/15/2011
• Published: 08/16/2012
• Est. Priority Date: 08/16/2010
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: UEJIMA, Takanori
• Granted Patent: US 8,805,299 B2
• Time in Patent Office: Days
• US Class Current: 455/552.1
• CPC Class Codes: H03H 7/463 Duplexers
• CPC Class Codes: H03H 9/725 Duplexers
• CPC Class Codes: H04B 1/006 using switches for selecting the desired band H04B1/0057 takes precedence

Abstract

In a high-frequency module, a first individual terminal in a switch IC is connected to a first filter and a third filter whose pass bands are far from each other. A low-pass-filter phase circuit including an inductor and a capacitor is connected between the first individual terminal and the first filter. A second individual terminal is connected to a second filter and a fourth filter whose pass bands are far from each other. A low-pass-filter phase circuit is connected between the second individual terminal and the second filter.

Claims

1. A high-frequency module comprising:

a switch IC including a common terminal and a plurality of individual terminals; and

a plurality of filters connected to the individual terminals in the switch IC, for which a pass band is set for each communication signal;

wherein

the plurality of filters at least include a first filter having a frequency of a first communication signal as the pass band, a second filter having a frequency of a second communication signal as the pass band, the frequency band of the first communication signal being close to the frequency band of the second communication signal, and a third filter having a frequency of a third communication signal as the pass band, the frequency of the third communication signal being far from the frequencies of the first communication signal and the second communication signal;

the first filter and the third filter are connected to a first individual terminal in the switch IC; and

the second filter is connected to a second individual terminal in the switch IC.

2. The high-frequency module according to claim 1, wherein, when a plurality of communication signals corresponding to the third communication signal exist, a communication signal whose phase variation within the frequency band is small and which has larger reflection strength for the first filter is set to the third communication signal.

3. The high-frequency module according to claim 1, wherein the frequency of the first communication signal is lower than the frequency of the third communication signal, and a low-pass-filter phase circuit is provided at least one of between the first filter and the first individual terminal and between the second filter and the second individual terminal.

4. The high-frequency module according to claim 1, further comprising a fourth filter having a frequency of a fourth communication signal whose frequency is close to the frequency of the third communication signal as the pass band, wherein the fourth filter is connected to a third individual terminal in the switch IC.

5. The high-frequency module according to claim 1, further comprising a fourth filter having a frequency of a fourth communication signal whose frequency is close to the frequency of the third communication signal as the pass band, wherein the fourth filter is connected to the second individual terminal in the switch IC.

6. The high-frequency module according to claim 4, wherein the frequencies of the first communication signal and the second communication signal are lower than the frequency of the fourth communication signal, and a high-pass-filter phase circuit is provided at least one of between the third filter and the first individual terminal and between the fourth filter and the individual terminal connected to the fourth filter.

7. The high-frequency module according to claim 4, wherein the first filter, the second filter, the third filter, and the fourth filter are mounted filters mounted in a multilayer body including dielectric layers, and the first filter is mounted so as to be close to the third filter, the second filter is mounted so as to be close to the fourth filter, or the first filter is mounted so as to be close to the third filter and the second filter is mounted so as to be close to the fourth filter.

8. The high-frequency module according to claim 7, wherein the first filter and the third filter define a package duplexer, the second filter and the fourth filter define a package duplexer, or the first filter and the third filter define a package duplexer and the second filter and the fourth filter define a package duplexer.