FLEXIBLE CIRCUIT ASSEMBLY WITHOUT SOLDER

• US 20120211265A1
• Filed: 04/27/2012
• Published: 08/23/2012
• Est. Priority Date: 05/08/2007
• Status: Active Grant

• Current Assignee: Joseph Charles Fjelstad
• Original Assignee: Occam Portfolio LLC
• Inventors: Fjelstad, Joseph C.
• Granted Patent: US 8,404,977 B2
• Time in Patent Office: Days
• US Class Current: 174/251
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/31 Structure, shape, material or disposition of the layer connectors after the connecting process
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: H05K 1/189 : characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/09481 : Via in pad; Pad over filled via if used for surface mounting H05K1/113
• CPC Class Codes: H05K 2203/1316 : Moulded encapsulation of mounted components
• CPC Class Codes: H05K 2203/1469 : Circuit made after mounting or encapsulation of the components
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/32 : electrically connecting electric components or wires to printed circuits
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1057 : Subsequent to assembly of laminae

Abstract

The present invention provides an electronic assembly. The assembly uses no solder. Components or component packages with I/O leads are mounted on a flexible substrate and encapsulated with an electrically insulating material. Vias connect through the substrate to the components'"'"' leads.

Claims

1. A circuit assembly comprising:

a flexible substrate;

an electrical component with a conductive pathway;

the electrical component located on the flexible substrate;

an electrically insulating material encapsulant attached to at least one side of the component;

the encapsulant attached to the flexible substrate; and

a via extending through the flexible substrate to the conductive pathway;

wherein an extraction extends through the encapsulant to a level proximate to a surface of the flexible substrate.

2. The assembly of claim 1 wherein the circuit assembly further comprises the via having an inclusion of electrically conductive material, the material in electrical communication with the pathway.

3. The assembly of claim 2 wherein a trace comprising electrically conductive material located on the flexible substrate 2016 is in electrical communication with the material.

4. The assembly of claim 3 wherein the trace is covered by electrically insulating material.

5. The assembly of claim 4 wherein the flexible substrate is flexed within a void created by the extraction.

6. The assembly of claim 1 wherein the flexible substrate is flexed within a void created by the extraction.

7. The assembly of claim 1 wherein the extraction has a taper at the level proximate to the surface of the flexible substrate.

8. The assembly of claim 1 wherein the component is pre-tested and burned in prior to locating the component on the flexible substrate.

29. The assembly of claim 1 wherein the electrical component is an electro-optical component.

31. The assembly of claim 29 wherein the conductive pathway is disposed to conduct signals by light.

9. A circuit assembly comprising:

an electrical component with a conductive pathway;

a flexible electrically insulating material encapsulant attached to at least one side of the component;

a conductive pathway of the component exposed to a surface of the encapsulant; and

a trace located on the surface of the encapsulant in communication with the conductive pathway;

wherein an extraction extends partially through the encapsulant.

10. The assembly of claim 9 wherein the trace is covered by electrically insulating material.

11. The assembly of claim 9 wherein the assembly is flexed at a point on a surface of the extraction.

12. The assembly of claim 10 wherein the assembly is flexed at a point on a surface of the extraction.

13. The assembly of claim 9 wherein the component is pre-tested and burned in prior to encapsulant being attached to at least one side of the component.

14. The assembly of claim 10 wherein the component is pre-tested and burned in prior to the encapsulant being attached to at least one side of the component.

15. The assembly of claim 9 wherein an edge of the extraction has a taper.

30. The assembly of claim 9 wherein the electrical component is an electro-optical component.

32. The assembly of claim 30 wherein the conductive pathway is disposed to conduct signals by light.

16-28. -28. (canceled)