LED Packaging Structure and Fabricating Method Thereof

• US 20120211791A1
• Filed: 05/02/2012
• Published: 08/23/2012
• Est. Priority Date: 01/16/2009
• Status: Abandoned Application

• Current Assignee: Everlight Electronics Company Limited
• Original Assignee: Everlight Electronics Company Limited
• Inventors: Weng, Ssu Yuan
• Application Number:
  US13/462,785
• Publication Number:
  US 20120211791A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/52 Encapsulations

Abstract

A light emitting diode (LED) packaging structure includes a base, a LED chip, a gel-blocking structure and a phosphor layer. The LED chip disposed on the base and electrically connected to the base. The LED chip having a substrate and a semiconductor layer formed on the substrate. The gel-blocking structure is disposed on the substrate of the LED chip and surrounding the semiconductor layer. The phosphor layer is filled within a space defined by the gel-blocking structure, the substrate and the semiconductor layer. The present invention also discloses a fabricating method of the LED packaging structure.

Claims

1. A light emitting diode packaging structure, comprising:

a base;

a LED chip disposed on the base and electrically connected to the base, the LED chip having a substrate and at least a semiconductor layer formed on the substrate; and

a gel-blocking structure disposed on the substrate of the LED chip and surrounding the semiconductor layer, the gel-blocking structure including a first metal layer and a second metal layer formed on the first metal layer.

2. A light emitting diode packaging structure according to claim 1, further comprising a phosphor layer filled within a space defined by the gel-blocking structure, the substrate, and the semiconductor layer,

3. A light emitting diode packaging structure according to claim 1, further comprising an encapsulant disposed on the base and covering the LED chip.

4. A light emitting diode packaging structure according to claim 1, wherein the gel-blocking structure is made of material selected from the group consisting of Au, Cr, Cu, Ag, Pt, Ti, Al, and the alloy thereof.

5. A light emitting diode packaging structure according to claim 1, wherein the LED chip further includes a first electrode and a second electrode, wherein the first electrode is disposed on a side of the substrate of the LED chip and electrically connected to the base, and wherein the second electrode is disposed on the semiconductor layer.

6. A light emitting diode packaging structure according to claim 5, wherein the first electrode is electrically connected to the substrate of the LED chip, and wherein the second electrode is electrically connected to a pad on the base.

7. A light emitting diode packaging structure according to claim 6, wherein the second electrode is electrically connected to the pad on the base by a conducting wire.

8. A light emitting diode packaging structure according to claim 1, wherein the LED chip further includes a first electrode and a second electrode, and wherein the first electrode and the second electrode are opposite to each other and are disposed on the semiconductor layer of the LED chip.

9. A light emitting diode packaging structure according to claim 8, wherein the first electrode and the second electrode are each electrically connected to a respective pad on the base by a respective conducting wire.

10. A light emitting diode packaging structure according to claim 1, wherein the phosphor layer includes at least a phosphor powder and an encapsulating gel.

11. A method for fabricating a light emitting diode packaging structure, comprising:

providing a base;

disposing a LED chip on the base and electrically connecting the LED chip to the base, the LED chip including a substrate and a semiconductor layer formed on the substrate; and

disposing a gel-blocking structure on the substrate of the LED chip and surrounding the semiconductor layer by forming a first metal layer by evaporation deposition and forming a second metal layer on the first metal layer by electroplating.

12. A method according to claim 11, further comprising filling a phosphor layer in a space defined by the gel-blocking structure, the substrate, and the semiconductor layer.

13. A method according to claim 11, further comprising forming an encapsulant on the base and covering the LED chip.

14. A method according to claim 11, wherein the gel-blocking structure is made of material selected from the group consisting of Au, Cr, Cu, Ag, Pt, Ti, Al, and the alloy thereof.

15. A method according to claim 11, wherein the LED chip further includes a first electrode and a second electrode, wherein the first electrode is disposed on a side of the substrate of the LED chip and is connected to the base, and wherein the second electrode is disposed on the semiconductor layer.

16. A method according to claim 15, wherein the first electrode is electrically connected to the substrate of the LED chip, and wherein the second electrode is electrically connected to a pad on the base.

17. A method according to claim 16, wherein the second electrode is electrically connected to the pad on the base by a conducting wire.

18. A method according to claim 11, wherein the LED chip further includes a first electrode and a second electrode, and wherein the first electrode and the second electrode are opposite to each other and are disposed on the semiconductor layer of the LED chip.

19. A method according to claim 18, wherein the first electrode and the second electrode are each electrically connected to a pad on the base by a conducting wire.

20. A method according to claim 11, wherein the phosphor layer includes at least a phosphor powder and an encapsulating gel.