MRAM DEVICE AND METHOD OF ASSEMBLING SAME
First Claim
1. A method of assembling a semiconductor device, comprising the steps of:
- providing a substrate having a centrally located opening therein;
applying a tape to a first major surface of the substrate;
placing a first magnetic shield onto the tape and within the substrate opening;
applying an adhesive between the first magnetic shield and the substrate so that the first magnetic shield is attached to the substrate; and
removing the tape.
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Accused Products
Abstract
A method of assembling a magnetoresistive random access memory (MRAM) device includes providing a substrate having an opening. A tape is applied to a surface of the substrate and a first magnetic shield is placed onto the tape and within the substrate opening. An adhesive is applied between the first magnetic shield and the substrate to attach the first magnetic shield to the substrate. An MRAM die is attached to the first magnetic shield and bond pads of the MRAM die are connected to pads on the substrate with wires. A second magnetic shield is attached to a top surface of the MRAM die. An encapsulating material is dispensed onto the substrate, the MRAM die, the second magnetic shield and part of the first magnetic shield, cured, and then the tape is removed. Solder balls then may be attached to the substrate.
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Citations
20 Claims
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1. A method of assembling a semiconductor device, comprising the steps of:
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providing a substrate having a centrally located opening therein; applying a tape to a first major surface of the substrate; placing a first magnetic shield onto the tape and within the substrate opening; applying an adhesive between the first magnetic shield and the substrate so that the first magnetic shield is attached to the substrate; and removing the tape. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor device, comprising:
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a substrate having a centrally located opening therein; a first magnetic shield disposed within the opening, wherein the first magnetic shield is attached to the substrate via an adhesive material; a semiconductor die attached to a top surface of the first magnetic shield and electrically coupled to the substrate; a second magnetic shield attached to a top surface of the semiconductor die; and an encapsulating material covering a first major surface of the substrate, the semiconductor die, the second magnetic shield, and a portion of the top surface of the first magnetic shield. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A method of assembling a magnetoresistive random access memory (MRAM) device, comprising the steps of:
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providing a substrate having a centrally located opening therein; applying a tape to a first major surface of the substrate; placing a first magnetic shield onto the tape and within the substrate opening; applying an adhesive between the first magnetic shield and the substrate such that the first magnetic shield is attached to the substrate; curing the adhesive; attaching a semiconductor die to a top surface of the first magnetic shield; electrically connecting bond pads of the MRAM die to corresponding pads on a second major surface, opposite to the first major surface, of the substrate with wires using a wire bonding process; attaching a second magnetic shield to a top surface of the MRAM die; dispensing an encapsulating material onto the second major surface of the substrate, the MRAM die, the second magnetic shield and a portion of the top surface of the first magnetic shield; curing the encapsulating material; removing the tape; and attaching solder balls to the first major surface of the substrate. - View Dependent Claims (18, 19, 20)
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Specification