INTEGRATED CIRCUITS INCLUDING INDUCTORS

• US 20120212316A1
• Filed: 02/23/2011
• Published: 08/23/2012
• Est. Priority Date: 02/23/2011
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: CHO, Hsiu-Ying
• Granted Patent: US 8,405,482 B2
• Time in Patent Office: Days
• US Class Current: 336/84.M
• CPC Class Codes: H01L 23/5225 Shielding layers formed together with wiring layers
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An integrated circuit includes a substrate having a surface. An inductor is disposed over the surface of the substrate. The inductor is operable to generate a magnetic field through itself that is substantially parallel with the surface.

Claims

1. An integrated circuit comprising:

a substrate having a surface; and

an inductor disposed over the surface of the substrate, the inductor being operable to generate a magnetic field through itself that is substantially parallel with the surface.

2. The integrated circuit of claim 1, wherein the inductor comprises:

a first conductive line disposed over the surface of the substrate;

at least one first conductive structure disposed over and electrically coupled with the first conductive line; and

a second conductive line disposed over and electrically coupled with the at least one first conductive structure.

3. The integrated circuit of claim 2, wherein the inductor further comprises:

at least one second conductive structure disposed between and electrically coupled with the at least one first conductive structure and the second conductive line.

4. The integrated circuit of claim 3, wherein the inductor further comprises:

at least one third conductive structure disposed over and electrically coupled with the first conductive line; and

a third conductive line disposed over and electrically coupled with the at least one third conductive structure.

5. The integrated circuit of claim 4, wherein the inductor further comprises:

at least one fourth conductive structure disposed below and electrically coupled with the third conductive line; and

a fourth conductive line disposed below and electrically coupled with the at least one fourth conductive structure.

6. The integrated circuit of claim 2, further comprising:

a shielding structure disposed over the surface of the substrate, wherein the shielding structure comprises at least one first shielding portion that is disposed between the surface of the substrate and the first conductive line.

7. The integrated circuit of claim 6, wherein the shielding structure further comprises:

at least one second shielding portion that is disposed between the first conductive line and the second conductive line, wherein the at least one second shielding portion is electrically coupled with the first shielding portion.

8. The integrated circuit of claim 6, wherein the shielding structure further comprises:

at least one third shielding portion that is disposed over the second conductive line, wherein the at least one third shielding portion is electrically coupled with the at least one first shielding portion.

9. The integrated circuit of claim 6, wherein the at least one first shielding portion of the shielding structure further comprises:

a plurality of metallic wires which are disposed in a parallel fashion between the substrate and the first conductive line, wherein the metallic wires are routed in a direction that is substantially perpendicular to a routing direction of the first conductive line.

10. An integrated circuit comprising:

a substrate having a surface; and

an inductor disposed over the surface of the substrate, the inductor comprising;

a first conductive line disposed over the surface of the substrate;

at least one first conductive structure disposed over and electrically coupled with the first conductive line;

a second conductive line disposed over and electrically coupled with the at least one first conductive structure;

at least one second conductive structure disposed over and electrically coupled with the first conductive line; and

a third conductive line disposed over and electrically coupled with the at least one second conductive structure.

11. The integrated circuit of claim 10, wherein the inductor further comprises:

at least one third conductive structure disposed below and electrically coupled with the third conductive line, wherein the third conductive line and the second conductive line are disposed in a first metallic layer; and

a fourth conductive line disposed below and electrically coupled with the at least one third conductive structure, wherein the fourth conductive line and the first conductive line are disposed in a second metallic layer.

12. The integrated circuit of claim 10, wherein the third conductive line is disposed between the first conductive line and the second conductive line.

13. The integrated circuit of claim 10, further comprising:

a shielding structure disposed over the surface of the substrate, wherein the shielding structure comprises at least one first shielding portion that is disposed between the surface of the substrate and the first conductive line.

14. The integrated circuit of claim 13, wherein the at least one first shielding portion of the shielding structure further comprises:

a plurality of metallic wires which are disposed in a parallel fashion between the substrate and the first conductive line, wherein the metallic wires are routed in a direction that is substantially perpendicular to a routing direction of the first conductive line.

15. The integrated circuit of claim 13, wherein the shielding structure further comprises:

at least one second shielding portion of the shielding structure that is disposed between the first conductive line and the second conductive line, wherein the at least one second shielding portion is electrically coupled with the at least one first shielding portion.

16. The integrated circuit of claim 13, wherein the shielding structure further comprises:

at least one third shielding portion of the shielding structure that is disposed over the second conductive line, wherein the at least one third shielding portion is electrically coupled with the at least one first shielding portion.

17. The integrated circuit of claim 13, wherein the shielding structure further comprises:

at least one fourth shielding portion of the shielding structure that is disposed between the second conductive line and the third conductive line, wherein the at least one third shielding portion is electrically coupled with the at least one first shielding portion.

18. An integrated circuit comprising:

a substrate having a surface; and

an inductor disposed over the surface of the substrate, the inductor comprising;

a first conductive line disposed over the surface of the substrate;

a plurality of first conductive structures disposed over and electrically coupled with the first conductive line;

a second conductive line disposed over and electrically coupled with the first plurality of conductive structures;

at least one second conductive structure disposed over and electrically coupled with the first conductive line;

a third conductive line disposed over and electrically coupled with the at least one second conductive structure;

a plurality of third conductive structures disposed below and electrically coupled with the third conductive line; and

a fourth conductive line disposed below and electrically coupled with the third conductive structure.

19. The integrated circuit of claim 18, further comprising:

a shielding structure disposed over the surface of the substrate, wherein the shielding structure comprises at least one first shielding portion that is disposed between the surface of the substrate and the first conductive line.

20. The integrated circuit of claim 19, wherein the at least one first shielding portion of the shielding structure further comprises:

a plurality of metallic wires which are disposed in a parallel fashion between the substrate and the first conductive line, wherein the metallic wires are routed in a direction that is substantially perpendicular to a routing direction of the first conductive line.