BUILDING SYSTEM WITH REDUCED WIRING REQUIREMENTS AND APPARATUS FOR USE THEREIN
First Claim
1. An apparatus for use in a building automation system, the apparatus comprising:
- a plurality of microelectromechanical sensors disposed on a single substrate;
a non-volatile memory operable to store configuration information, the configuration information corresponding to a first functionality of the apparatus;
a communication device operable to communicate sensor values to an external device; and
a processing device operably coupled to each of the plurality of microelectromechanical sensors to receive measurement information therefrom, the processing device operable to provide the sensor values to the communication circuit, wherein said sensor values correspond to a select subset of less than all of the plurality of microelectromechanical sensors, the select subset based on the configuration information stored in the non-volatile memory.
8 Assignments
0 Petitions
Accused Products
Abstract
An apparatus for use in a building automation system includes a plurality of microelectromechanical sensors disposed on a single substrate, a non-volatile memory, a communication device, and a processing device. The non-volatile memory stores configuration information corresponding to a first functionality of the apparatus. The communication device is operable to communicate sensor values to an external device. The processing device is operably coupled to each of the plurality of microelectromechanical sensors to receive measurement information therefrom. The processing device operable to provide the sensor values to the communication circuit. The sensor values provided by the processing device correspond to a select subset of less than all of the plurality of microelectromechanical sensors, the select subset based on the configuration information stored in the non-volatile memory.
6 Citations
17 Claims
-
1. An apparatus for use in a building automation system, the apparatus comprising:
-
a plurality of microelectromechanical sensors disposed on a single substrate; a non-volatile memory operable to store configuration information, the configuration information corresponding to a first functionality of the apparatus; a communication device operable to communicate sensor values to an external device; and a processing device operably coupled to each of the plurality of microelectromechanical sensors to receive measurement information therefrom, the processing device operable to provide the sensor values to the communication circuit, wherein said sensor values correspond to a select subset of less than all of the plurality of microelectromechanical sensors, the select subset based on the configuration information stored in the non-volatile memory. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
-
Specification