Component support and assembly having a mems component on such a component support

• US 20120212925A1
• Filed: 02/22/2012
• Published: 08/23/2012
• Est. Priority Date: 02/23/2011
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Ehrenpfordt, Ricardo, Scholz, Ulrike, ZOELLIN, Jochen
• Granted Patent: US 8,902,604 B2
• Time in Patent Office: Days
• US Class Current: 361/807
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 2207/096 through the substrate
• CPC Class Codes: B81B 2207/097 Interconnects arranged on the substrate or the lid, and covered by the package seal
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 2203/0154 Moulding a cap over the MEMS device
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: G01L 19/141 Monolithic housings, e.g. molded or one-piece housings
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H04R 1/086 Protective screens, e.g. all weather or wind screens
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence

Abstract

A component support allows cost-effective, space-saving and low-stress packaging of MEMS components having a sensitive structure. The component support is suited, in particular, for MEMS components, which are mounted in the cavity of a housing and are intended to be electrically contacted. The component support is produced as a composite part in the form of a hollow body open on one side, the composite part being made essentially of a three-dimensionally shaped carrier foil flexible in its shaping, and an encasing material. The encasing material is molded onto one side of the carrier foil, so that the carrier foil is situated on the inner wall of the component support. At least one mounting surface for at least one component is formed on the inner wall having the carrier foil. The carrier foil is also provided with contact surfaces and insulated conductive paths for electrically contacting the at least one component.

Claims

1. A component support, for at least one MEMS component, which is mounted in the cavity of a housing and electrically contacted, comprising:

a component support arrangement, including;

a composite part that is essentially made up of a three-dimensionally shaped carrier foil flexible in its shaping and an encasing material, which is molded onto the carrier foil on one side, so that the carrier foil is situated on the inner wall of the component support arrangement; and

at least one mounting surface for at least one component, wherein the at least one mounting surface is formed on the inner wall having the carrier foil;

wherein the carrier foil has contact surfaces and insulated conductive paths for electrically contacting the at least one component, and

wherein the component support is produced as the composite part in the form of a hollow body open on one side.

2. The component support of claim 1, wherein the inner wall having the carrier foil is formed in the shape of a trough having at least one step, so that mounting surfaces are formed on different levels of the inner wall.

3. The component support of claim 1, wherein the inner wall is formed in the shape of a trough having at least one step in the upper edge region, the step being used as a receptacle for a cover piece.

4. The component support of claim 1, wherein a port in the form of a media opening for the MEMS component is formed in the composite part.

5. The component support of claim 1, wherein the composite part is provided with electrical vias, which start out from the contact surfaces or conductive paths of the carrier foil and are run through the encasing material onto the outside of the composite part.

6. The component support of claim 1, wherein the carrier foil includes a polyimide foil.

7. The component support of claim 1, wherein the carrier foil is made up of a plurality of layers, and wherein the layer construction of the carrier foil includes at least one metallic layer as electromagnetic shielding for the at least one component.

8. A method for manufacturing a component support, which has the shape of a hollow body open on one side, the method comprising:

using at least one molding tool part to determine the shape of the inner wall, and whose shape corresponds to the desired three-dimensional shape of the inner wall of the component support;

using at least one second molding tool part to determine the shape of the outside of the component support;

inserting a carrier foil into the first molding tool part;

pressing the carrier foil against the tool mold by the molding stream flowing in, so that after the curing of the molding material, the carrier foil covers at least some regions of the inner wall of the component support;

wherein the component support is for at least one MEMS component, which is mounted in the cavity of a housing and electrically contacted, and includes;

a component support arrangement, including;

a composite part that is essentially made up of the carrier foil, which is a three-dimensionally shaped carrier foil flexible in its shaping and an encasing material, which is molded onto the carrier foil on one side, so that the carrier foil is situated on the inner wall of the component support arrangement; and

at least one mounting surface for at least one component, wherein the at least one mounting surface is formed on the inner wall having the carrier foil;

wherein the carrier foil has contact surfaces and insulated conductive paths for electrically contacting the at least one component, and

wherein the component support is produced as the composite part in the form of a hollow body open on one side.

9. A method for manufacturing a component support, which has the shape of a hollow body open on one side, the method comprising:

initially fabricating a molded plastic part having the shape of the hollow body open on one side; and

applying a carrier foil, by cement, to the inner wall;

wherein the component support is for at least one MEMS component, which is mounted in the cavity of a housing and electrically contacted, and includes;

a component support arrangement, including;

a composite part that is essentially made up of the carrier foil, which is a three-dimensionally shaped carrier foil flexible in its shaping and an encasing material, which is molded onto the carrier foil on one side, so that the carrier foil is situated on the inner wall of the component support arrangement; and

at least one mounting surface for at least one component, wherein the at least one mounting surface is formed on the inner wall having the carrier foil;

wherein the carrier foil has contact surfaces and insulated conductive paths for electrically contacting the at least one component, and

wherein the component support is produced as the composite part in the form of a hollow body open on one side.

10. The method as recited in claim 9, wherein the carrier foil is attached to the inner wall by the action of a fluid stream, by directing airflow against it or by suction.

11. An assembly, comprising:

a MEMS component having at least one sensitive structure; and

a housing having a cavity, in which the MEMS component is situated, wherein the housing includes a component support which functions as a housing part;

wherein the component support is for at least one MEMS component, which is mounted in the cavity of a housing and electrically contacted, and includes;

a component support arrangement, including;

a composite part that is essentially made up of the carrier foil, which is a three-dimensionally shaped carrier foil flexible in its shaping and an encasing material, which is molded onto the carrier foil on one side, so that the carrier foil is situated on the inner wall of the component support arrangement; and

at least one mounting surface for at least one component, wherein the at least one mounting surface is formed on the inner wall having the carrier foil;

wherein the carrier foil has contact surfaces and insulated conductive paths for electrically contacting the at least one component, and

wherein the component support is produced as the composite part in the form of a hollow body open on one side.

12. The assembly of claim 11, wherein the carrier foil of the component support extends onto the mounting side of the housing and has electrical terminals for externally contacting the assembly.

13. The assembly of claim 11, wherein the inner wall of the component support is stepped in a trough-like manner and has a plurality of mounting surfaces on different levels, and at least one further component is situated above or below the MEMS component by mechanically fixing it in position on at least one corresponding mounting surface and electrically contacting it.

14. The assembly of claim 11, wherein the housing includes a cover piece for terminating the cavity, the cover piece is made of a plastic material, a metallically-coated plastic material, a metal, a semiconductor material or a metallically-coated semiconductor material, and wherein the cover piece is joined to the component support in a media-tight manner.

15. The assembly of claim 11, wherein the housing includes a foil for terminating the cavity.

16. The assembly of claim 11, wherein the MEMS component includes at least one of a MEMS microphone component, a MEMS loudspeaker component, and a MEMS pressure sensor component.