MULTI-STACK SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
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Accused Products
Abstract
The invention relates to a multi-stack semiconductor integrated circuit device where communication between semiconductor chips can be efficiently carried out by bypassing a number of chips. Each semiconductor chip that forms a multi-stack semiconductor integrated circuit device having a stack structure where four or more semiconductor chips having the same shape are stacked on top of each other is provided with: a first coil for transmission/reception for communication between chips over a long distance; and a second coil for transmission/reception for communication between chips over a short distance, of which the size is smaller than that of the above-described first coil for transmission/reception.
17 Citations
11 Claims
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1-6. -6. (canceled)
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7. A multi-stack semiconductor integrated circuit device having a stack structure comprising:
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four or more semiconductor chips having the same shape and being stacked on top of each other, wherein each semiconductor chip comprises; a first coil for transmission/reception for communication between chips over a long distance; and a second coil for transmission/reception for communication between chips over a short distance, of which the size is smaller than that of said first coil for transmission/reception wherein a semiconductor chip, of which the size is smaller than that of said semiconductor chips and which has a different shape and only a third coil for transmission/reception for communication between chips having the same size as that of said second coil for transmission/reception, is stacked on the top or bottom semiconductor chip in said stack structure. - View Dependent Claims (8, 9, 10, 11)
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Specification