Capacitive Sensing Button On Chip

• US 20120217982A1
• Filed: 12/29/2011
• Published: 08/30/2012
• Est. Priority Date: 02/28/2011
• Status: Active Grant

• Current Assignee: Cypress Semiconductor Corporation (Infineon Technologies AG)
• Original Assignee: Cypress Semiconductor Corporation (Infineon Technologies AG)
• Inventors: Narayanasamy, Rajagopal, Wright, David, Kolokowsky, Steven, Narayana Swamy, Mahadevan Krishnamurthy
• Granted Patent: US 8,970,230 B2
• Time in Patent Office: Days
• US Class Current: 324/686
• CPC Class Codes: G01D 5/2405 by varying dielectric
• CPC Class Codes: G06F 2203/04101 2.5D-digitiser, i.e. digitiser detecting the X/Y position of the input means, finger or stylus, also when it does not touch, but is proximate to the digitiser's interaction surface and also measures the distance of the input means within a short range in the Z direction, possibly with a separate measurement setup
• CPC Class Codes: G06F 2203/04106 Multi-sensing digitiser, i.e. digitiser using at least two different sensing technologies simultaneously or alternatively, e.g. for detecting pen and finger, for saving power or for improving position detection
• CPC Class Codes: G06F 3/016 Input arrangements with force or tactile feedback as computer generated output to the user
• CPC Class Codes: G06F 3/0443 using a single layer of sensing electrodes
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: H03K 17/602 in integrated circuits
• CPC Class Codes: H03K 17/962 Capacitive touch switches
• CPC Class Codes: H03K 2017/9602 characterised by the type or shape of the sensing electrodes
• CPC Class Codes: H03K 2217/960715 Rc-timing; e.g. measurement of variation of charge time or discharge time of the sensor
• CPC Class Codes: H03K 2217/960725 Charge-transfer
• CPC Class Codes: H03K 2217/960755 Constructional details of capacitive touch and proximity switches

Abstract

An embodiment of an integrated circuit device may comprise an integrated circuit package, a sensor element attached within the integrated circuit package, a capacitance sensor coupled with the sensor element and situated within the integrated circuit package, wherein the capacitance sensor is configured to measure a capacitance of the sensor element, and an output pin positioned at the exterior of the integrated circuit package, wherein the output pin is configured to carry a signal based on the measured capacitance of the sensor element.

Claims

1. An integrated circuit device, comprising:

an integrated circuit package;

a sensor element attached within the integrated circuit package;

a capacitance sensor coupled with the sensor element and situated within the integrated circuit package, wherein the capacitance sensor is configured to measure a capacitance of the sensor element; and

an output pin positioned at the exterior of the integrated circuit package, wherein the output pin is configured to carry a signal based on the measured capacitance of the sensor element.

2. The integrated circuit device of claim 1, further comprising:

a ground pad attached within the integrated circuit package and coupled with the capacitance sensor; and

a ground pin coupled with the ground pad and positioned at an exterior of the integrated circuit package.

3. The integrated circuit device of claim 1, wherein the output pin carries a signal indicating a proximity of a conductive object to the sensor element.

4. The integrated circuit device of claim 1, further comprising a modulation capacitor coupled with the capacitance sensor and attached within the integrated circuit package.

5. The integrated circuit device of claim 1, further comprising processing logic configured to output a signal indicating a direction of movement of a conductive object near the sensor element.

6. The integrated circuit device of claim 1, wherein the integrated circuit package further comprises a top layer overlaying the sensor element.

7. The integrated circuit device of claim 1, wherein the capacitance sensor is formed on a die mounted underneath the sensor element.

8. The integrated circuit device of claim 1, wherein the capacitance sensor is configured to decrease a resistance between the output pin and at least one other pin positioned at the exterior of the integrated circuit package in response to detecting a change in capacitance at the sensor element.

9. An integrated circuit device, comprising:

an integrated circuit package;

a sensor element attached within the integrated circuit package;

an output pin positioned at the exterior of the integrated circuit package, wherein the output pin is configured to carry a signal based on the measured capacitance of the sensor element,

a capacitance sensor coupled with the sensor element and situated within the integrated circuit package, wherein the capacitance sensor is configured to measure a capacitance of the sensor element, and based on the measured capacitance, apply a signal to the output pin.

10. The integrated circuit device of claim 9, wherein the capacitance sensor is further configured to apply the signal to the output pin by connecting the output pin with a signal source.

11. The integrated circuit device of claim 9, wherein the capacitance sensor is further configured to apply the signal to the output pin by changing a signal applied to the output pin.

12. The integrated circuit device of claim 9, wherein the sensor element is one of a plurality of sensor elements.

13. The integrated circuit device of claim 12, further comprising processing logic configured to determine a direction of movement of a conductive object near at least one of the plurality of sensor elements.

14. The integrated circuit device of claim 12, wherein the output pin is configured to output a signal indicating a direction of movement of a conductive object near at least one of the plurality of sensor elements.

15. The integrated circuit device of claim 12, wherein the capacitance sensor is configured to measure a mutual capacitance between each of the plurality of sensor elements.

16. The integrated circuit device of claim 12, wherein each sensor element is aligned with a first other sensor element along a first axis and is aligned with a second other sensor element along a second axis.

17. The integrated circuit device of claim 9, further comprising a tactile feedback element overlaying the sensor element, wherein the tactile feedback element is configured to produce a tactile stimulus in response to pressure applied to the tactile feedback element.

18. A method, comprising:

detecting proximity of a conductive object near an exterior surface of an integrated circuit package; and

signaling the proximity of the conductive object at an output pin at an exterior surface of the package.

19. The method of claim 18, wherein the signaling comprises connecting the output pin to a signal source.

20. The method of claim 18, wherein the signaling comprises changing a signal applied to the output pin.

21. The method of claim 18, further comprising:

detecting a direction of movement of the conductive object; and

signaling the direction of movement at the output pin.