Method, System, and Apparatus for RFID Removal Detection

• US 20120218110A1
• Filed: 02/25/2011
• Published: 08/30/2012
• Est. Priority Date: 02/25/2011
• Status: Active Grant

• Current Assignee: Avery Dennison Retail Information Services LLC (Avery Dennison Corporation)
• Original Assignee: Avery Dennison Corporation
• Inventors: Forster, Ian J.
• Granted Patent: US 8,884,764 B2
• Time in Patent Office: Days
• US Class Current: 340/572.1
• CPC Class Codes: G06K 19/07372 by detecting tampering with the circuit
• CPC Class Codes: G06K 19/07381 with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G08B 13/2417 having a radio frequency identification chip
• CPC Class Codes: G08B 13/2431 Tag circuit details
• CPC Class Codes: G08B 13/2448 Tag with at least dual detection means, e.g. combined inductive and ferromagnetic tags, dual frequencies within a single technology, tampering detection or signalling means on the tag
• CPC Class Codes: G08B 29/046 prevention of tampering with detection circuits
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

According to one exemplary embodiment, an apparatus, system and method for forming RFID labels is disclosed. The RFID labels can include an RFID chip, at least one antenna element and at least one conductive material. The RFID chip may then transmit desired signals based upon a coupling of the conductive material to the RFID chip.

Claims

1. A tamper indicating RFID label, comprising:

an RFID chip;

at least one antenna coupled to the RFID chip; and

a conductive material coupled to the RFID chip that influences a response signal sent from the RFID label when it is read.

2. The RFID label of claim 1, wherein the conductive material is a conductive loop that substantially surrounds the RFID chip and the at least one antenna.

3. The RFID label of claim 1, wherein the conductive material encircles the RFID chip and at least one antenna.

4. The RFID label of claim 1, wherein the conductive material is coupled to the RFID chip in such a manner that any cut or tear of the RFID label would sever the conductive loop prior to reaching the RFID label.

5. The RFID label of claim 2, wherein the RFID chip transmits a first signal when interrogated and the conductive loop is intact and a second signal when interrogated and the conductive loop is severed.

6. The RFID label of claim 1, further comprising:

a conductive loop formed from the conductive material;

a first terminal and a second terminal on the RFID chip, with a first end of the conductive loop coupled to the first terminal and a second end of the conductive loop coupled to the second terminal.

7. The RFID label of claim 6, wherein portions of the conductive loop preceding the first end of the conductive loop and the second end of the conductive loop are arranged in a substantially zigzagged pattern.

8. The RFID label of claim 1, wherein the conductive material is a plurality of inter-digital fingers coupled to the RFID chip.

9. The RFID label of claim 8, wherein the inter-digital fingers have an aggressive adhesive disposed on a first side and a weak adhesive disposed on a second side.

10. The RFID label of claim 9, wherein the aggressive adhesive couples the inter-digital fingers to a product and the weak adhesive couples the inter-digital fingers to the RFID chip.

11. The RFID label of claim 1, wherein the conductive material is a pin, a first conduct layer and a second conductive layer.

12. The RFID label of claim 11, further comprising a clutch that couples the pin to the first conductive layer and the second conductive layer, the pin and the clutch further couple the RFID label to a product.

13. The RFID label of claim 1, further comprising an RF block coupled to the conductive loop.

14. The RFID label of claim 1, further comprising at least one capacitor coupled to the conductive loop.

15. The RFID label of claim 1, further comprising at least one inductor coupled to the conductive loop.

16. The RFID label of claim 1, wherein at least a portion of the conductive loop is thinned.

17. A method of preventing tampering to products having RFID tags, comprising:

forming an RFID label with an RFID chip, at least one antenna coupled to the RFID chip and a conductive material coupled to the RFID chip;

sending a first signal from the RFID chip when the coupling between the RFID chip and the conductive material is intact; and

sending a second signal from the RFID chip when the coupling between the RFID chip and at least a portion of the conductive material is not intact.

18. The method of claim 17 wherein the second signal is sent due to breaking, tearing or cutting of the conductive material.

19. The method of claim 17, wherein the conductive material is formed into a conductive loop and the conductive loop encircles the RFID chip.

20. A method of forming a tamper-resistant RFID tag, comprising:

disposing an RFID chip on a substrate;

disposing at least a first antenna element on the substrate;

coupling the at least first antenna element to the RFID chip;

disposing a conductive loop on the substrate; and

connecting a first portion of the conductive loop to a first terminal on the RFID chip and connecting a second portion of the conductive loop to a second terminal on the RFID chip in such a manner that there is no straight-line access from an area outside the RFID tag to the RFID chip.