SEMICONDUCTOR LUMINAIRE

• US 20120218773A1
• Filed: 09/25/2009
• Published: 08/30/2012
• Est. Priority Date: 09/25/2009
• Status: Abandoned Application

• Current Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Eichelberger, Christopher L., Peiler, Kimberly
• Application Number:
  US13/395,667
• Publication Number:
  US 20120218773A1
• Time in Patent Office: Days
• US Class Current: 362/520
• CPC Class Codes: F21S 41/143 the main emission direction of the LED being parallel to the optical axis of the illuminating device
• CPC Class Codes: F21S 41/153 arranged in a matrix
• CPC Class Codes: F21S 45/47 Passive cooling, e.g. using fins, thermal conductive elements or openings
• CPC Class Codes: F21S 45/50 Waterproofing
• CPC Class Codes: F21V 15/01 Housings, e.g. material or assembling of housing parts F21V15/02 takes precedence housings forming signs or letters G09F13/04
• CPC Class Codes: F21V 29/76 with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 31/005 Sealing arrangements therefor
• CPC Class Codes: F21V 5/04 of lens shape
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02B 3/0056 arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses G02B3/0043 takes precedence; miniaturised objectives for electronic devices employing wafer level optics G02B13/0085
• CPC Class Codes: G02B 3/04 with continuous faces that are rotationally symmetrical but deviate from a true sphere , e.g. so called "aspheric" lenses
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

A semiconductor luminaire includes a carrier; an optoelectronic semiconductor chip mounted on the carrier, the semiconductor chip emitting ultraviolet or visible radiation; a luminaire housing not covering the semiconductor chip in a direction of main emittance; an optical cover placed downstream of the semiconductor chip in a direction of mails emittance: and an index matching layer located between the semiconductor chip mid the optical cover, wherein the optical cover provides a radiation exit surface of the luminaire, and wherein radiation running along the direction of main emittance from the semiconductor chip to the radiation exit surface solely propagates in solid or liquid materials.

Claims

1. A semiconductor luminaire comprising:

a carrier;

an optoelectronic semiconductor chip mounted on the carrier, the semiconductor chip emitting ultraviolet or visible radiation;

a luminaire housing not covering the semiconductor chip in a direction of main emittance;

an optical cover placed downstream of the semiconductor chip in a direction of main emittance; and

an index matching layer located between the semiconductor chip and the optical cover,

wherein the optical cover provides a radiation exit surface of the luminaire, and

wherein radiation running along the direction of main emittance from the semiconductor chip to the radiation exit surface solely propagates in solid or liquid materials,

2. The semiconductor luminaire according to claim 1, wherein the optical cover is shaped lens-like at least in parts.

3. The semiconductor luminaire according to claim 1, further comprising a heat sink wherein the carrier is directly provided on the heat sink.

4. The semiconductor luminaire according to claim 1, wherein the optical cover comprises a flange, the optical cover being fixed to the carrier by the luminaire housing and by the flange.

5. The semiconductor luminaire according to claim 1, further comprising a gasket, the gasket located between the optical cover and the luminaire housing to seal the carrier and the semiconductor chip against ambient conditions.

6. The semiconductor luminaire according to claim 5, wherein the gasket, the luminaire housing and the optical cover overlap in a lateral direction.

7. The semiconductor luminaire according to claim 1, wherein the semiconductor chip is directly mounted onto the carrier, the carrier being one item selected from the group consisting of a circuit board, a printed circuit board, a ceramic and a metal core substrate.

8. The semiconductor luminaire according to claim 1, further comprising a chip housing which the semiconductor chip is placed in, the chip housing being directly mounted onto the carrier.

9. The semiconductor luminaire according:

to claim 1, comprising a plurality of semiconductor chips, all semiconductor chips being covered by the optical cover, and the optical cover being one-pieced.

10. The semiconductor luminaire according to claim 1, wherein the optical cover comprises a lens array, each lens and each semiconductor chip being assigned one-to-one to each other.

11. The semiconductor luminaire according to claim 1, comprising a plurality of semiconductor chips and a plurality of optical covers, the optical covers being disposed on the carrier and displaced in a lateral direction and fixed by means of the luminaire housing, each optical cover being assigned to one or more semiconductor chips.

12. The semiconductor luminaire according to claim 1, wherein the radiation exit surface of the optical cover is flush with an outer surface of the luminaire housing.

13. The semiconductor luminaire according to claim 1, wherein the semiconductor chip is located in a recess of the optical cover.

14. A vehicular headlamp comprising the semiconductor luminaire according to claim 1.