ATOMIC LAYER DEPOSITION OF SUPER-CONDUCTING NIOBIUM SILICIDE

• US 20120219824A1
• Filed: 02/28/2011
• Published: 08/30/2012
• Est. Priority Date: 02/28/2011
• Status: Abandoned Application

• Current Assignee: UChicago Argonne LLC
• Original Assignee: UChicago Argonne LLC
• Inventors: Elam, Jeffrey, Pellin, Michael J., Prolier, Thomas, Klug, Jeffrey
• Application Number:
  US13/036,952
• Publication Number:
  US 20120219824A1
• Time in Patent Office: Days
• US Class Current: 428/662
• CPC Class Codes: C23C 16/42 Silicides
• CPC Class Codes: C23C 16/45525 Atomic layer deposition [ALD]
• CPC Class Codes: H10N 60/0156 of devices comprising Nb or an alloy of Nb with one or more of the elements of group 4, e.g. Ti, Zr, Hf
• CPC Class Codes: Y10T 428/12 All metal or with adjacent metals
• CPC Class Codes: Y10T 428/12819 Group VB metal-base component

Abstract

A method of preparing a superconducting thin film of niobium silicide using atomic layer deposition (ALD) where the superconducting critical temperature of the film is controllable by modulating the thickness of the thin film. The film is formed by exposing a substrate within an ALD reactor to alternating exposures of a niobium halide (NbQ_x) and a reducing precursor, for example, disilane (Si₂H₆) or silane (SiH₄). A number of ALD cycles are performed to obtain the film thickness and establish the desired superconducting critical temperature between 0.4 K and 3.1 K.

Claims

1. A method of forming on a substrate a niobium silicide (NbSi) superconducting film having a tunable superconducting critical temperature by performing a plurality of atomic layer deposition (ALD) cycles within an ALD reactor, the ALD cycle comprising:

establishing a deposition temperature within the ALD reactor;

exposing the substrate within the deposition chamber to a niobium halide precursor;

purging the deposition chamber with an inert purge gas;

exposing the substrate to a reducing precursor to form a monolayer of NbSi over the substrate, the reducing precursor selected from the group consisting of Si₂H₆, SiH₄, and combinations thereof; and

purging the deposition chamber with the inert purge gas,

wherein the superconducting critical temperature is established between about 0.4 K and about 3.1 K by performing a number of the ALD cycles to obtain a predetermined thickness of the NbSi film on the substrate.

2. The method of claim 1, wherein the niobium halide precursor comprises NbF₅.

3. The method of claim 2, wherein the deposition temperatures is selected as between about 150°

C. and about 300°

C.

4. The method of claim 1, wherein the predetermined thickness is between about 5.2 nm and about 45 nm.

5. The method of claim 1, further comprising forming a seed layer between the substrate and the NbSi film, the seed layer comprising a transition metal and substantially free of oxygen.

6. The method of claim 4, wherein the substrate comprises a high aspect ratio substrate material.

7. The method of claim 1, further comprising annealing the superconducting film at an elevated annealing temperature.

8. A method of preparing a superconducting film having a tunable critical temperature using atomic layer deposition (ALD), comprising:

providing a first metal precursor capable of forming a superconducting film on a substrate, the first metal precursor comprising a first transition metal and a halide;

providing a first reducing precursor, the first reducing precursor comprising silicon and substantially free of oxygen; and

forming at least one superconducting film on the substrate by performing in an ALD reactor a number of ALD cycles at a deposition temperature to obtain the at least one superconducting film comprising the first transition metal and silicon and characterized by a film thickness, each ALD cycle comprises exposing the substrate to the first metal precursor for a first predetermined period, exposing the substrate to the first reducing precursor for a second predetermined period, and purging the ALD reactor after each of the first metal precursor and first reducing precursor exposures,

wherein the superconducting critical temperature of the at least one superconducting film is selectively tunable by modulating the film thickness of the at least one superconducting film.

9. The method of claim 8, wherein the first metal precursor comprises NbF₅.

10. The method of claim 9, wherein the first reducing precursor is selected from the group consisting of:

Si₂H₆ and SiH₄.

11. The method of claim 8, wherein the at least one superconducting film consists essentially of niobium silicide (NbSi).

12. The method of claim 8, wherein the film thickness of the at least one superconducting film is between a single monolayer of the film and a critical thickness, wherein the critical thickness is defined by a thickness where the superconducting critical temperature is maximized.

13. The method of claim 8, further comprising forming a seed layer between the substrate and the at least one superconducting film, the seed layer selected from the group consisting of:

W, NbC, NbN, NbCN, Mo, MbC, MbN, MbCN, and combinations thereof.

14. The method of claim 8, further comprising annealing the superconducting film at an elevated annealing temperature between about 400°

C. and about 600°

C., wherein the annealing process is performed in an atmosphere consisting essentially of Ar or N₂.

15. The method of claim 8, further comprising including the superconducting film in a bolometer.

16. The method of claim 8, wherein forming the at least one superconducting film on the substrate comprises forming a plurality of superconducting films on the substrate, the plurality of superconducting films separated by an interfacial layer, and wherein each of the plurality of superconducting films is characterized by a film thickness defining a unique superconducting critical temperature for each of the respective layers.

17. A film prepared by atomic layer deposition (ALD) having a tunable superconducting critical temperature, comprising:

a metallic thin film of niobium silicide (NbSi) with a substantially 1;

1 stoichiometry characterized by an amorphous structure and a density of about 6.65 g/cm³, the metallic thin film further defined by a substantially uniform film thickness and a superconducting critical temperature selectively tunable between about 0.4 K and about 3.1 K, wherein the superconducting critical temperature is selected by establishing the substantially uniform film thickness between about 5.2 nm and about 45 nm.

18. The film of claim 17, wherein the metallic thin film conformally coats a high aspect ratio substrate.

19. The film of claim 18, further comprising a seed layer film deposed between the high aspect ratio substrate and the metallic thin film, the seed layer film comprising at least one of a metal, a metal carbide, and a metal nitride.

20. The film of claim 17, wherein the metallic thin film defines a portion of a bolometer.