MICROSTRUCTURE MANUFACTURING METHOD

• US 20120219916A1
• Filed: 02/17/2012
• Published: 08/30/2012
• Est. Priority Date: 02/24/2011
• Status: Active Grant

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Teshima, Takayuki, Setomoto, Yutaka
• Granted Patent: US 9,040,227 B2
• Time in Patent Office: Days
• US Class Current: 430/311
• CPC Class Codes: A61B 6/4233 using matrix detectors
• CPC Class Codes: A61B 6/4291 the detector being combined with a grid or grating
• CPC Class Codes: A61B 6/484 involving phase contrast X-ray imaging
• CPC Class Codes: C23C 18/1605 by masking
• CPC Class Codes: C23C 18/1651 Two or more layers only obtained by electroless plating
• CPC Class Codes: C25D 3/12 of nickel or cobalt
• CPC Class Codes: C25D 3/38 of copper
• CPC Class Codes: C25D 3/48 of gold
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: C25D 5/10 Electroplating with more than one layer of the same or of different metals for bearings C25D7/10
• CPC Class Codes: C25D 5/12 at least one layer being of nickel or chromium
• CPC Class Codes: C25D 5/615 Microstructure of the layers, e.g. mixed structure
• CPC Class Codes: C25D 7/123 Semiconductors first coated with a seed layer or a conductive layer
• CPC Class Codes: G02B 5/18 Diffraction gratings holographic optical elements G02B5/32, G03H; integrally combined with optical fibres G02B6/02057; for coupling light guides G02B6/34; integrally combined with optical integrated light guides G02B6/12; grating systems G02B27/44
• CPC Class Codes: G03F 7/40 Treatment after imagewise removal, e.g. baking
• CPC Class Codes: G21K 1/10 Scattering devices; Absorbing devices; Ionising radiation filters
• CPC Class Codes: G21K 2207/005 Methods and devices obtaining contrast from non-absorbing interaction of the radiation with matter, e.g. phase contrast

Abstract

A microstructure manufacturing method includes forming a layer of a photosensitive resin on a substrate surface having an electrical conductivity, forming a structure of the photosensitive resin by exposing the layer of the photosensitive resin to light and developing the layer of the photosensitive resin to expose a part of the substrate surface, forming a first plated layer on the exposed part of the substrate surface by soaking the structure of the photosensitive resin in a first plating solution, curing the structure of the photosensitive resin after forming the first plated layer, removing at least part of the first plated layer after curing the structure of the photosensitive resin, and forming a second plated layer on a part where the first plated layer is removed, by soaking the structure of the photosensitive resin in a second plating solution different from the first plating solution.

Claims

1. A microstructure manufacturing method comprising:

forming a layer of a photosensitive resin on a substrate surface having an electrical conductivity;

forming a structure of the photosensitive resin by exposing the layer of the photosensitive resin to light and developing the layer of the photosensitive resin to expose a part of the substrate surface;

forming a first plated layer on the exposed part of the substrate surface by soaking the structure of the photosensitive resin in a first plating solution;

curing the structure of the photosensitive resin after forming the first plated layer;

removing at least part of the first plated layer after curing the structure of the photosensitive resin; and

forming a second plated layer on a part where the first plated layer is removed, by soaking the structure of the photosensitive resin in a second plating solution different from the first plating solution.

2. The microstructure manufacturing method according to claim 1,

wherein the exposed photosensitive resin has an etching resistance against the first plating solution, and

wherein the cured photosensitive resin has an etching resistance against the second plating solution.

3. The microstructure manufacturing method according to claim 1,

wherein an etching resistance of the exposed photosensitive resin against the first plating solution is higher than an etching resistance of the exposed photosensitive resin against the second plating solution, and

wherein the cured photosensitive resin has a higher etching resistance against the second plating solution than the exposed photosensitive resin.

4. The microstructure manufacturing method according to claim 1,

wherein a part of the substrate surface is exposed by removing the at least part of the first plated layer, and

wherein the second plated layer is formed on the exposed part of the substrate surface.

5. The microstructure manufacturing method according to claim 1,

wherein the second plated layer is formed on the first plated layer remained on the substrate surface.

6. The microstructure manufacturing method according to claim 1,

wherein the substrate surface consists essentially of gold.

7. The microstructure manufacturing method according to claim 1,

wherein the first plated layer consists essentially of nickel, copper, iron, tin or an alloy of them.

8. The microstructure manufacturing method according to claim 1,

wherein the second plated layer consists essentially of gold.

9. The microstructure manufacturing method according to claim 1,

wherein the photosensitive resin is a thermosetting resin, and

wherein the structure of the photosensitive resin is cured by heating.

10. The microstructure manufacturing method according to claim 1,

wherein the layer of the photosensitive resin is exposed to synchrotron radiation light.