ANTIMONY-FREE GLASS, ANTIMONY-FREE FRIT AND A GLASS PACKAGE THAT IS HERMETICALLY SEALED WITH THE FRIT

• US 20120222450A1
• Filed: 05/16/2012
• Published: 09/06/2012
• Est. Priority Date: 10/20/2008
• Status: Active Grant

• Current Assignee: Lisa A. Lamberson, Robert M. Morena
• Original Assignee: Lisa A. Lamberson, Robert M. Morena
• Inventors: Lamberson, Lisa A., Morena, Robert M.
• Granted Patent: US 8,434,328 B2
• Time in Patent Office: Days
• US Class Current: 65/43
• CPC Class Codes: C03C 27/06 Joining glass to glass by processes other than fusing fusing C03B23/20; units for use as elements for closing wall or like openings and comprising two or more parallel glass panes in spaced relationship, the panes being permanently secured together E06B3/66
• CPC Class Codes: C03C 3/21 containing titanium, zirconium, vanadium, tungsten or molybdenum
• CPC Class Codes: C03C 8/08 containing phosphorus
• CPC Class Codes: C03C 8/16 with vehicle or suspending agents, e.g. slip
• CPC Class Codes: C03C 8/20 containing titanium compounds; containing zirconium compounds
• CPC Class Codes: C03C 8/24 Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

An antimony-free glass suitable for use in a frit for producing a hermetically sealed glass package is described. The hermetically sealed glass package, such as an OLED display device, is manufactured by providing a first glass substrate plate and a second glass substrate plate and depositing the antimony-free frit onto the first substrate plate. OLEDs may be deposited on the second glass substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first glass substrate plate to the second glass substrate plate and also protects the OLEDs. The antimony-free glass has excellent aqueous durability, good flow, low glass transition temperature and low coefficient of thermal expansion.

Claims

1. A method of forming a glass package comprising:

depositing a frit on a first glass substrate plate;

joining the first glass plate to a second glass substrate plate;

irradiating the frit with an irradiation source to form a hermetic seal between the first and second glass substrate plates; and

wherein the frit includes an antimony-free glass comprising;

V₂O₅ (40-50 mole %)

P₂O₅ (≧

20 mole % and <

25 mole %)

ZnO (0-10 mole %)

Fe₂O₃ (>

0 mole % and <

25 mole %)

TiO₂ (>

0 mole % and <

25 mole %); and

wherein TiO₂+Fe₂O₃ is in the range from 20 mole % to 35 mole %.

2. The method according to claim 1, wherein the antimony-free glass comprises:

V₂O₅ (40 mole %)

P₂O₅ (20 mole %)

ZnO (5 mole %)

Fe₂O₃ (>

0 mole % and <

25 mole %)

TiO₂ (>

0 mole % and <

25 mole %); and

wherein TiO₂+Fe₂O₃ is 35 mole %.

3. The method according to claim 1, wherein the antimony-free glass comprises:

V₂O₅ (50 mole %)

P₂O₅ (20 mole %)

ZnO (10 mole %)

Fe₂O₃ (>

10 mole % and <

15 mole %)

TiO₂ (>

5 mole % and <

10 mole %); and

wherein TiO₂+Fe₂O₃ is 20 mole %.

4. The method according to claim 1, wherein the antimony-free glass comprises:

V₂O₅ (40-50 mole %)

P₂O₅ (≧

20 mole % and <

25 mole %)

ZnO (5-10 mole %)

Fe₂O₃ (>

0 mole % and <

25 mole %)

TiO₂ (>

0 mole % and <

25 mole %); and

wherein TiO₂+Fe₂O₃ is in the range from 20 mole % to 35 mole %.

5. The glass package according to claim 1, wherein the antimony-free glass has a Tg≦

400°

C.

6. The method according to claim 1, wherein the antimony-free glass has a CTE in the range from 35×

10<sup>−

7</sup>/°

C. to 45×

10<sup>−

7</sup>/°

C.

7. The method according to claim 1, wherein the fit comprises a CTE-lowering filler.

8. The glass package according to claim 1, further comprising an organic material disposed between the first and second glass plates.

9. The glass package according to claim 1, wherein the organic material comprises an organic light emitting diode.

10. The method according to claim 1, further comprising presintering the frit to the first glass substrate.

11. A method of forming an organic light emitting diode device comprising:

depositing a frit on a first glass substrate plate;

joining the first glass plate to a second glass substrate plate, there being an organic layer positioned between the first and second glass substrate plates;

irradiating the frit with an irradiation source to form a hermetic seal between the first and second glass substrate plates; and

wherein the frit includes an antimony-free glass comprising;

V₂O₅ (40-50 mole %)

P₂O₅ (≧

20 mole % and <

25 mole %)

ZnO (0-10 mole %)

Fe₂O₃ (>

0 mole % and <

25 mole %)

TiO₂ (>

0 mole % and <

25 mole %); and

wherein TiO₂+Fe₂O₃ is in the range from 20 mole % to 35 mole %.

12. The method according to claim 11, wherein the antimony-free glass comprises:

V₂O₅ (40 mole %)

P₂O₅ (20 mole %)

ZnO (5 mole %)

Fe₂O₃ (>

0 mole % and <

25 mole %)

TiO₂ (>

0 mole % and <

25 mole %); and

wherein TiO₂+Fe₂O₃ is 35 mole %.

13. The method according to claim 11, wherein the antimony-free glass comprises:

V₂O₅ (50 mole %)

P₂O₅ (20 mole %)

ZnO (10 mole %)

Fe₂O₃ (>

10 mole % and <

15 mole %)

TiO₂ (>

5 mole % and <

10 mole %); and

wherein TiO₂+Fe₂O₃ is 20 mole %.

14. The method according to claim 11, wherein the antimony-free glass comprises:

V₂O₅ (40-50 mole %)

P₂O₅ (≧

20 mole % and <

25 mole %)

ZnO (5-10 mole %)

Fe₂O₃ (>

0 mole % and <

25 mole %)

TiO₂ (>

0 mole % and <

25 mole %); and

wherein TiO₂+Fe₂O₃ is in the range from 20 mole % to 35 mole %.

15. The glass package according to claim 11, wherein the antimony-free glass has a Tg≦

400°

C.

16. The method according to claim 11, wherein the antimony-free glass has a CTE in the range from 35×

10<sup>−

7</sup>/°

C. to 45×

10<sup>−

7</sup>/°

C.

17. The method according to claim 11, wherein the frit comprises a CTE-lowering filler.

18. The method according to claim 11, further comprising presintering the frit to the first glass substrate.