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LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURE

  • US 20120223351A1
  • Filed: 03/06/2012
  • Published: 09/06/2012
  • Est. Priority Date: 03/06/2011
  • Status: Active Grant
First Claim
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1. A light emitting device, comprising:

  • a semiconductor LED including doped and intrinsic regions thereof;

    a first surface of said semiconductor LED being metallized with an electrically conducting metallization layer over at least a portion of said first surface;

    an optically permissive layer proximal to a second surface of said semiconductor LED, said first and second surfaces of said semiconductor LED being on opposing faces thereof;

    an optically definable material proximal to or within said optically permissive layer that affects an optical characteristic of emitted light passing therethrough; and

    an optically permissive cover substrate covering at least a portion of the above components.

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