MONOLITHIC FULL-COLOR LED MICRO-DISPLAY ON AN ACTIVE MATRIX PANEL MANUFACTURED USING FLIP-CHIP TECHNOLOGY
First Claim
1. A method for manufacturing a monolithic Light Emitting Diode (LED) micro-display panel on an Active Matrix (AM) panel, the LED microarray panel comprising a plurality of LED pixels each including an n-electrode and a p-electrode, with the LED pixels arranged in a matrix including a plurality of rows and a plurality of columns, n-electrodes of LED pixels in a row of the matrix, electrically connected to a bus line, the p-electrode of each LED pixel individually electrically connected to an output of a corresponding driving circuit on the AM panel, the method comprising:
- providing a substrate of the LED micro-display panel;
overlaying a plurality of layers of material on a surface of the substrate, with the plurality of overlaying layers of material configured in combination to emit light when activated;
patterning the plurality of overlaying layers of material by removing a part of each overlaying layers all the way down to the surface of the substrate;
depositing a current spreading layer on the patterned plurality of overlaying layers of material and surface of the substrate;
providing a metal multilayer on the current spreading layer;
patterning the metal multilayer in such a configuration that a first portion of the metal multilayer, which lies on the patterned plurality of overlaying layers of material, and a second portion of the metal multilayer, which lies on the surface of the substrate, and conductively disconnected from the substrate, thereby forming the monolithic LED micro-display panel;
providing a plurality of active control circuits on a surface of the AM panel; and
combining the monolithic LED micro-display panel with the AM panel using conductive solder material, with each of the monolithic LEDs electrically insulated from one another and independently controllable by corresponding ones of the active control circuit chips bonded thereto, with the plurality of active control circuits combined with the monolithic LEDs in such a way that each of the plurality of active control circuits combine with one of the monolithic LEDs of the LED microarray panel via the solder material, wherein the AM panel, pixel size and shape correspond to LED pixels.
1 Assignment
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Accused Products
Abstract
A high-resolution, Active Matrix (AM) programmed monolithic Light Emitting Diode (LED) micro-array is fabricated using flip-chip technology. The fabrication process includes fabrications of an LED micro-array and an AM panel, and combining the resulting LED micro-array and AM panel using the flip-chip technology. The LED micro-array is grown and fabricated on a sapphire substrate and the AM panel can be fabricated using PMOS process, NMOS process, or CMOS process. LED pixels in a same row share a common N-bus line that is connected to the ground of AM panel while p-electrodes of the LED pixels are electrically separated such that each p-electrode is independently connected to an output of drive circuits mounted on the AM panel. The LED micro-array is flip-chip bonded to the AM panel so that the AM panel controls the LED pixels individually and the LED pixels exhibit excellent emission uniformity. According to this constitution, incompatibility between the LED process and the PMOS/NMOS/CMOS process can be eliminated.
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Citations
33 Claims
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1. A method for manufacturing a monolithic Light Emitting Diode (LED) micro-display panel on an Active Matrix (AM) panel, the LED microarray panel comprising a plurality of LED pixels each including an n-electrode and a p-electrode, with the LED pixels arranged in a matrix including a plurality of rows and a plurality of columns, n-electrodes of LED pixels in a row of the matrix, electrically connected to a bus line, the p-electrode of each LED pixel individually electrically connected to an output of a corresponding driving circuit on the AM panel, the method comprising:
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providing a substrate of the LED micro-display panel; overlaying a plurality of layers of material on a surface of the substrate, with the plurality of overlaying layers of material configured in combination to emit light when activated; patterning the plurality of overlaying layers of material by removing a part of each overlaying layers all the way down to the surface of the substrate; depositing a current spreading layer on the patterned plurality of overlaying layers of material and surface of the substrate; providing a metal multilayer on the current spreading layer; patterning the metal multilayer in such a configuration that a first portion of the metal multilayer, which lies on the patterned plurality of overlaying layers of material, and a second portion of the metal multilayer, which lies on the surface of the substrate, and conductively disconnected from the substrate, thereby forming the monolithic LED micro-display panel; providing a plurality of active control circuits on a surface of the AM panel; and combining the monolithic LED micro-display panel with the AM panel using conductive solder material, with each of the monolithic LEDs electrically insulated from one another and independently controllable by corresponding ones of the active control circuit chips bonded thereto, with the plurality of active control circuits combined with the monolithic LEDs in such a way that each of the plurality of active control circuits combine with one of the monolithic LEDs of the LED microarray panel via the solder material, wherein the AM panel, pixel size and shape correspond to LED pixels. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A method for manufacturing an assembly of a monolithic Light Emitting Diode (LED) micro-display panel including a plurality of LEDs thereon and an Active Matrix (AM) panel, comprising:
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providing a substrate of the AM panel; providing active control circuit chips on the substrate of the AM panel, by mounting a plurality of active control circuits on a surface of the AM panel wherein each of the plurality of active control circuits has a two-transistor-one-capacitor (2T1C) structure, which comprises a first transistor (T1) as a switch transistor, a second transistor (T2) as a driving transistor, and a capacitor (C), a gate electrode of the second transistor (T2) electrically connected to a drain electrode of the first transistor (T1) and an end of the capacitor (C); providing conductive solder material on the active control circuit chips; and using flip-chip bonding to mount the active control chips to the plurality of monolithic LEDs via the conductive solder material to combine the AM panel with the monolithic LED micro-display panel. - View Dependent Claims (24, 25, 26)
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27. A Light Emitting Diode (LED) display comprising:
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an Active Matrix (AM) panel mounted with a plurality of active control circuits, the AM panel having a surface with a plurality of active control circuits mounted so that each active control circuit has a two-transistor-one-capacitor (2T1C) structure, which comprises a first transistor (T1) as a switch transistor, a second transistor (T2) as a driving transistor, and a capacitor (C), a gate electrode of the second transistor (T2) electrically connected to a drain electrode of the first transistor (T1) and an end of the capacitor (C); and a LED panel mounted with a plurality of LEDs arranged in rows and columns; and
combined with the AM panel to associate each of the plurality of LEDs with each of the active control circuits, with each pair of an LED and an associated active control circuit electrically insulated from other pairs of LEDs and associated active control circuits in the LED display, and each LED independently controllable by its associated active control circuit. - View Dependent Claims (28, 29, 30, 31, 32)
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33. A method for manufacturing a monolithic Light Emitting Diode (LED) micro-display panel on an Active Matrix (AM) panel, comprising:
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providing a substrate of the LED micro-display panel; overlaying a plurality of layers of material on a surface of the substrate, and configuring the plurality of overlaying layers of material in combination to emit light when activated; patterning the plurality of overlaying layers of material by removing a part of each overlaying layers all the way down to the surface of the substrate; depositing a current spreading layer on the patterned plurality of overlaying layers of material and surface of the substrate; providing a metal multilayer on the current spreading layer; patterning the metal multilayer so as to conductively disconnect a first portion of the metal multilayer, which lies on the patterned plurality of overlaying layers of material, from a second portion of the metal multilayer, which lies on the surface of the substrate, thereby forming the monolithic LED micro-display panel; and combining the monolithic LED micro-display panel with the AM panel, said AM panel comprising a plurality of active control circuit chips with conductive solder material, said combining comprising flip-chip bonding the monolithic LEDs to the active control circuit chips via the conductive solder material, with each of the monolithic LEDs electrically insulated from one another and independently controllable by corresponding ones of the active control circuit chips bonded thereto; grouping the LED display to form pixels in groups of four pixels, with the LEDs emitting a single color of light for all pixels; providing a mold configured to accept phosphors for the individual pixels in each group; applying phosphors to the mold to transmit at least 3 primary transmission colors for respective ones of the pixels in each group; applying phosphors to a fourth pixel in the group to transmit light selected from the group consisting of one of the three primary colors, white light, a non-primary color and a fourth primary color.
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Specification