Packaging Structure for Plural Bare Chips
First Claim
1. A packaging structure for plural bare chips, comprising:
- a substrate having a supporting surface;
a plurality of bare light-emitting chips supported by the supporting surface;
a reflective layer arranged on the supporting surface and adjacent to the bare light-emitting chips; and
a transparent light guide covering the bare light-emitting chips and the reflective layer, with the transparent light guide having a light-outputting layer on a side of the transparent light guide facing away from the supporting surface, and with the light-outputting layer having a light gathering member.
1 Assignment
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Accused Products
Abstract
A packaging structure for plural bare chips, which includes a substrate, a plurality of bare light-emitting chips, and a transparent light guide, is provided. The substrate has a supporting surface; the bare light-emitting chips are disposed on the supporting surface of the substrate; the transparent light guide covers and seals up the bare light-emitting chips, with a side of the transparent light guide facing away from the supporting surface forming a light-outputting layer with a light gathering member. Alternatively, a reflective layer can be arranged on the supporting surface and covered by the transparent light guide. Accordingly, a packaging structure for plural bare chips with high illuminous efficiency, high heat-dissipating efficiency, and low cost of manufacture is provided.
76 Citations
19 Claims
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1. A packaging structure for plural bare chips, comprising:
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a substrate having a supporting surface; a plurality of bare light-emitting chips supported by the supporting surface; a reflective layer arranged on the supporting surface and adjacent to the bare light-emitting chips; and a transparent light guide covering the bare light-emitting chips and the reflective layer, with the transparent light guide having a light-outputting layer on a side of the transparent light guide facing away from the supporting surface, and with the light-outputting layer having a light gathering member. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A packaging structure for plural bare chips, comprising:
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a substrate having a supporting surface; a reflective layer arranged on the supporting surface and having a plurality of through holes; a plurality of bare light-emitting chips arranged on the reflective layer and corresponding to the through holes; and a transparent light guide covering the bare light-emitting chips and the reflective layer, with the transparent light guide having a light-outputting layer on a side of the transparent light guide facing away from the supporting surface, and with the light-outputting layer having a light gathering member. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A packaging structure for plural bare chips, comprising:
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a substrate having a supporting surface; a plurality of bare light-emitting chips supported by the supporting surface; and a transparent light guide covering the bare light-emitting chips, with the transparent light guide having a light-outputting layer on a side of the transparent light guide facing away from the supporting surface, and with the light-outputting layer having a light gathering member, wherein the light gathering member is in a form of plural ridges, and an included angle of a tip of each ridge is in a range between a first angle and a second angle, with the first angle being twice a sum of a critical angle and 20 degrees, with the second angle being twice a difference of the critical angle and 20 degrees, wherein the critical angle is in the transparent light guide for boundary between the transparent light guide and the air. - View Dependent Claims (16, 17, 18, 19)
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Specification