Optoelectronic Module
First Claim
1. An optoelectronic module, comprisinga carrier having a contact location;
- a radiation-emitting semiconductor chip having a first contact area and a second contact area;
an electrically insulating layer having a first cutout and a second cutout; and
at least one electrically conductive conducting structure;
wherein the first contact area is arranged on a side of the radiation-emitting semiconductor chip that faces away from the carrier,wherein the electrically insulating layer is applied to the carrier and the semiconductor chip at least in places and has the first cutout in a region of the first contact area and a second cutout in the region of the contact location,wherein the electrically conductive conducting structure is arranged on the electrically insulating layer and electrically contact-connects the first contact area to the contact location of the carrier, andwherein the electrically insulating layer is predominantly formed with a ceramic material.
1 Assignment
0 Petitions
Accused Products
Abstract
An optoelectronic module has at least one carrier with at least one contact location. A semiconductor chip emitting radiation includes a first contact surface and a second contact surface. An electrically insulating layer has a first and a second recess. The first contact surface is disposed on the side of the semiconductor chip emitting radiation facing away from the carrier. The electrically insulating layer is applied at least in places to the carrier. The semiconductor chip includes the first recess in the area of the first contact surface and the second recess in the area of the contact location. A electrically conductive conductor structure is disposed on the electrically insulating layer. The first contact surface electrically contacts the contact location of the carrier. The electrically insulating layer is formed predominately from a ceramic material.
10 Citations
20 Claims
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1. An optoelectronic module, comprising
a carrier having a contact location; -
a radiation-emitting semiconductor chip having a first contact area and a second contact area; an electrically insulating layer having a first cutout and a second cutout; and at least one electrically conductive conducting structure; wherein the first contact area is arranged on a side of the radiation-emitting semiconductor chip that faces away from the carrier, wherein the electrically insulating layer is applied to the carrier and the semiconductor chip at least in places and has the first cutout in a region of the first contact area and a second cutout in the region of the contact location, wherein the electrically conductive conducting structure is arranged on the electrically insulating layer and electrically contact-connects the first contact area to the contact location of the carrier, and wherein the electrically insulating layer is predominantly formed with a ceramic material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An optoelectronic module, comprising:
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a carrier having at least one contact location; a radiation-emitting semiconductor chip, wherein the radiation-emitting semiconductor chip has a first contact area and a second contact area; an electrically insulating layer having a first and a second cutout, wherein the electrically insulating layer is radiation-transmissive and covers a radiation exit area of the semiconductor chip at least in places and wherein the electrically insulating layer consists of a ceramic phosphor; and at least one electrically conductive conducting structure, wherein the first contact area is arranged on a side of the radiation-emitting semiconductor chip that faces away from the carrier, wherein the electrically insulating layer is applied to the carrier and the semiconductor chip at least in places and has the first cutout in the region of the first contact area and the second cutout in the region of the contact location, and wherein the electrically conductive conducting structure is arranged on the electrically insulating layer and electrically contact-connects the first contact area to the contact location of the carrier.
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14. An optoelectronic module, comprising
a carrier having at least one contact location; -
a plurality of radiation-emitting semiconductor chips, each radiation-emitting semiconductor chip having a first contact area and a second contact area; an electrically insulating layer arranged between the radiation-emitting semiconductor chips, wherein the electrically insulating layer has a first and a second cutout; and at least one electrically conductive conducting structure; wherein the first contact area is arranged on a side of the radiation-emitting semiconductor chip that faces away from the carrier, wherein the electrically insulating layer is applied to the carrier and at least one of the semiconductor chips at least in places and has the first cutout in the region of the first contact area and the second cutout in the region of the contact location, wherein the electrically conductive conducting structure is arranged on the electrically insulating layer and electrically contact-connects the first contact area to the contact location of the carrier, and wherein the electrically insulating layer is predominantly formed with a ceramic material. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification