Sensor, Sensor Pad and Sensor Array for Detecting Infrasonic Acoustic Signals

• US 20120232427A1
• Filed: 06/23/2011
• Published: 09/13/2012
• Est. Priority Date: 06/24/2010
• Status: Active Grant

• Current Assignee: CVR Global, Inc. (CVR Medical Corp.)
• Original Assignee: CVR Global, Inc. (CVR Medical Corp.)
• Inventors: Kline, Bret, Bakema, Peter, Langston, Alan, Stephen, Gary
• Granted Patent: US 9,101,274 B2
• Time in Patent Office: Days
• US Class Current: 600/586
• CPC Class Codes: A61B 2562/0204 Acoustic sensors
• CPC Class Codes: A61B 7/00 Instruments for auscultation
• CPC Class Codes: A61B 7/003 Detecting lung or respiration noise
• CPC Class Codes: A61B 7/02 Stethoscopes acoustic details thereof G10K11/00
• CPC Class Codes: A61B 7/04 Electric stethoscopes microphones, acoustic transducers therefor H04R
• CPC Class Codes: B06B 1/06 operating with piezoelectric effect or with electrostriction piezoelectric or electrostrictive devices per se H10N30/00

Abstract

A sensor, sensor pad and sensor array for detecting infrasonic signals in a living organism is provided. The sensor, sensor pad and/or array can be utilized for detecting, determining and/or diagnosing level of stenosis, occlusion, or aneurysm in arteries, or other similar diagnosis. The sensor can include unique circuitry in the form of a piezoelectric plate or element sandwiched between two conductive O-rings.

Claims

1. A sensor pod for sensing acoustic signals comprising:

a housing having an interior chamber and a circular opening;

a piezoelectric element in the form of a circular disk having a first side and an opposing second side contained in the interior chamber of the housing and aligned with the circular opening;

a first O-ring positioned on and in contact with the first side of the piezoelectric element; and

,

a second O-ring positioned on and in contact with the second side of the piezoelectric element.

2. The sensor pod of claim 1 wherein the housing comprises a first upper housing portion connected to a second lower housing portion.

3. The sensor pod of claim 1 further comprising an acoustic coupling pad having a flat surface contacting the first side of the piezoelectric element and a body contacting portion extending through the circular opening in the housing.

4. The sensor pod of claim 3 further comprising an amplifier circuit electrically coupled to the piezoelectric element contained in the interior chamber of the housing.

5. The sensor pod of claim 1 wherein the first O-ring comprises an electrically conductive material.

6. The sensor pod of claim 5 wherein the first O-ring is a metalized rubber.

7. The sensor pod of claim 5 wherein the second O-ring is a metalized rubber.

8. The sensor pod of claim 5 having a first conductive contact element in the housing electronically coupled to the first O-ring for transmitting signals generated by the piezoelectric element.

9. The sensor pod of claim 1 wherein the piezoelectric element comprises a metal plate with a ceramic material contacting a side of the plate.

10. The sensor pod of claim 1 further comprising a swivel connector extending from a bottom portion of the housing.

11. A sensor pod for sensing infrasonic acoustic signals comprising:

a sensor housing having an internal chamber and an opening;

a piezoelectric element mounted in the internal chamber, the piezoelectric element comprising a metal plate having a first side and an opposing second side, the first side having a piezo-type material coating at least a portion of the first side, wherein the piezoelectric element spans across the opening dividing the internal chamber into an outer chamber portion configured to receive an acoustic coupling pad and an inner chamber portion; and

,

an amplifier circuit mounted in the inner chamber portion of the housing and electrically coupled to the piezoelectric element wherein the housing comprises a metal surface around the inner chamber portion such that the metal surface of the housing and the metal plate of the piezoelectric element form a faraday cage around the amplifier circuit.

12. The sensor pod of claim 11 wherein the housing comprises a first housing portion and a second housing portion connected to the first housing portion.

13. The sensor pod of claim 12 wherein the inner chamber portion is formed in the second housing potion.

14. The sensor pod of claim 12 further comprising a swivel connector extending from a portion of the second housing portion.

15. The sensor pod of claim 11 wherein the piezoelectric element is a circular disk

16. The sensor pod of claim 15 further comprising a first O-ring positioned on the first side of the piezoelectric element and a second O-ring positioned on the second side of the piezoelectric element.

17. The sensor pod of claim 16 wherein the first and second O-rings comprise an electrically conductive material.

18. The sensor pod of claim 17 wherein the first and second O-rings are formed from a metalized rubber.

19. The sensor pod of claim 11 further comprising a low durometer value pad having a bottom wall positioned against the first side of the piezoelectric element and a contacting portion connected to the bottom wall which extends outward through the opening in the housing.

20. The sensor pod of claim 19 wherein the contacting portion of the pad includes an outwardly concave region.

21-66. -66. (canceled)