POWER CONVERTER

• US 20120235162A1
• Filed: 12/19/2011
• Published: 09/20/2012
• Est. Priority Date: 06/19/2009
• Status: Abandoned Application

• Current Assignee: Kabushiki Kaisha Yaskawa Denki
• Original Assignee: Kabushiki Kaisha Yaskawa Denki
• Inventors: ISOBE, Tasuku, Kawanami, Yasuhiko, Nakabayashi, Yukihisa, Higuchi, Masato, Higashikawa, Koji, Terazono, Katsushi, Sasaki, Akira, Morihara, Takayuki, Aoki, Takashi, Ito, Tetsuya, Koguma, Kiyonori
• Application Number:
  US13/330,540
• Publication Number:
  US 20120235162A1
• Time in Patent Office: Days
• US Class Current: 257/77
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/06181 On opposite sides of the body
• CPC Class Codes: H01L 2224/29116 Lead [Pb] as principal constituent
• CPC Class Codes: H01L 2224/29118 Zinc [Zn] as principal constituent
• CPC Class Codes: H01L 2224/29144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/29211 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/29216 Lead [Pb] as principal constituent
• CPC Class Codes: H01L 2224/29244 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/29294 with a principal constituent of the material being a liquid not provided for in groups H01L2224/292 - H01L2224/29291
• CPC Class Codes: H01L 2224/29295 with a principal constituent of the material being a gas not provided for in groups H01L2224/292 - H01L2224/29291
• CPC Class Codes: H01L 2224/29324 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/29344 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/29347 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/29411 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/29455 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/30181 On opposite sides of the body
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48 : of an individual wire connector
• CPC Class Codes: H01L 2224/48847 : Copper (Cu) as principal constituent
• CPC Class Codes: H01L 23/3121 : a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3677 : Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/467 : by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 23/473 : by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/49827 : Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/30 : of a plurality of layer connectors
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 25/072 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/115 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/117 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/18 : the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10272 : Silicon Carbide [SiC]
• CPC Class Codes: H01L 2924/1033 : Gallium nitride [GaN]
• CPC Class Codes: H01L 2924/12032 : Schottky diode
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H02M 7/003 : Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

This power converter includes a power-conversion semiconductor element, an electrode conductor having a substantially flat upper end surface, and a sealant. The sealant allows the substantially flat upper end surface of the electrode conductor to be exposed at an upper surface of the sealant, and provides electrical connection with an external device at the upper end surface of the exposed electrode conductor.

Claims

1. A power converter comprising:

a power-converter body portion including

a power-conversion semiconductor element having an electrode,

an electrode conductor electrically connected with the electrode of the power-conversion semiconductor element, and having side surfaces and a substantially flat upper end surface, and

a sealant made of resin and covering the power-conversion semiconductor element and the side surfaces of the electrode conductor,

wherein the sealant allows the substantially flat upper end surface of the electrode conductor to be exposed at an upper surface of the sealant and provides electrical connection with an external device at the substantially flat upper end surface of the exposed electrode conductor; and

a wiring board electrically connected with the substantially flat upper end surface of the electrode conductor exposed from the upper surface of the sealant.

2. The power converter according to claim 1,

wherein a plurality of the electrode conductors are provided, and

wherein a plurality of the substantially flat upper end surfaces of the plurality of electrode conductors exposed from the upper surface of the sealant have substantially equivalent heights.

3. The power converter according to claim 2, wherein the electrode conductor has a columnar shape extending upward, and the columnar shape has a substantially flat upper end surface.

4. The power converter according to claim 1, wherein the substantially flat upper end surface of the electrode conductor exposed from the upper surface of the sealant has a height substantially equivalent to a height of the upper surface of the sealant.

5. The power converter according to claim 1,

wherein the electrode of the power-conversion semiconductor element includes

a front-surface electrode provided on a principal surface of the power-conversion semiconductor element, and

a back-surface electrode provided on a back surface of the power-conversion semiconductor element, and

wherein the electrode conductor includes

a first electrode conductor connected with the front-surface electrode through a joint material at the principal surface of the power-conversion semiconductor element, extending upward, and having a substantially flat upper end surface exposed from the upper surface of the sealant, and

a second electrode conductor electrically connected with the back-surface electrode at the back surface of the power-conversion semiconductor element, extending upward from a position separated from the power-conversion semiconductor element, and having a substantially flat upper end surface exposed from the upper surface of the sealant.

6. The power converter according to claim 5, wherein the sealant forms an outer surface of the power-converter body portion.

7. The power converter according to claim 5, further comprising:

a case portion surrounding the power-conversion semiconductor element and the electrode conductor,

wherein the sealant covers the power-conversion semiconductor element and the side surfaces of the electrode conductor, and the case portion is filled with the sealant such that the substantially flat upper end surface of the electrode conductor is exposed.

8. The power converter according to claim 7, further comprising a radiator member arranged at the back surface of the power-conversion semiconductor element.

9. The power converter according to claim 8, wherein the power-conversion semiconductor element is formed of a semiconductor made of silicon carbide or gallium nitride.

10. The power converter according to claim 1, wherein the substantially flat upper end surface of the electrode conductor exposed from the upper surface of the sealant is electrically connected with the wiring board through a bump electrode.

11. The power converter according to claim 1, wherein the substantially flat upper end surface of the electrode conductor exposed from the upper surface of the sealant is electrically connected with the wiring board through a pin-like terminal.

12. The power converter according to claim 11, wherein the wiring board includes wiring having a cooling structure.

13. The power converter according to claim 12, wherein the cooling structure has a cooling hole formed near the wiring of the wiring board.

14. The power converter according to claim 13, wherein the wiring board includes a wiring portion having a fine wiring portion that is formed of a fine wiring conductor extending in a direction in which high-frequency current flows.

15. The power converter according to claim 14,

wherein the wiring conductor includes a plurality of wiring conductors adjacent to each other in a plane at an interval, and

wherein the wiring board further includes a cooling pipe arranged between the adjacent wiring conductors.

16. The power converter according to claim 15, wherein the fine wiring portion formed of the fine wiring conductor includes a first wiring conductor and a second wiring conductor stacked on each other through an insulating substrate.

17. The power converter according to claim 16, wherein the wiring board further includes a connecting wiring portion that penetrates through the insulating substrate and electrically connects the first wiring conductor and the second wiring conductor stacked on each other through the insulating substrate.

18. The power converter according to claim 17, wherein the wiring board includes a wiring conductor having a protrusion and a recess at an outer surface, the protrusion and recess extending in the direction in which the high-frequency current flows.

19. The power converter according to claim 18, wherein the wiring board further includes an insulator surrounding the periphery of the wiring conductor having the protrusion and the recess.

20. A power converter comprising:

a plurality of power-conversion semiconductor elements including a plurality of electrodes;

a plurality of electrode conductors electrically connected with the plurality of electrodes of the plurality of power-conversion semiconductor elements, having columnar shapes extending upward, and having substantially flat upper end surfaces;

a radiator member arranged at back surfaces of the power-conversion semiconductor elements; and

a sealant made of resin and covering the power-conversion semiconductor elements and side surfaces of the electrode conductors,

wherein the sealant allows the substantially flat upper end surfaces of the plurality of electrode conductors having the columnar shapes to be exposed at an upper surface of the sealant and provides electrical connection with an external device at the upper end surfaces of the exposed electrode conductors, and

wherein heat generated by the power-conversion semiconductor elements can be radiated from both the substantially flat upper end surfaces of the plurality of electrode conductors arranged at principal surfaces of the power-conversion semiconductor elements and the radiator member arranged at the back surfaces of the power-conversion semiconductor elements.