SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD

• US 20120235169A1
• Filed: 09/09/2011
• Published: 09/20/2012
• Est. Priority Date: 09/09/2010
• Status: Active Grant

• Current Assignee: Stanley Electric Company Limited
• Original Assignee: Stanley Electric Company Limited
• Inventors: SEKO, Toshihiro, Ito, Kosaburo
• Granted Patent: US 8,373,182 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer encapsulating at least one semiconductor light-emitting chip to emit various colored lights including white light. The semiconductor light-emitting device can include a base board with the chip mounted thereon, a frame located on the base board, a transparent plate located on the wavelength converting layer, a reflective material layer disposed between the frame and both side surfaces of the wavelength converting layer and the transparent plate, and a light-absorbing layer located on the reflective material layer. The semiconductor light-emitting device can be configured to improve light-emitting efficiency and a contrast between a light-emitting and non-light-emitting surfaces by using the transparent material and light-absorbing layer. A wavelength-converted light that is emitted can have a high light-emitting efficiency and a high contrast between a light-emitting and non-light-emitting surface from a small light-emitting surface.

Claims

1. A semiconductor light-emitting device comprising:

a base board having a mounting surface and a conductor pattern located adjacent the mounting surface;

at least one semiconductor light-emitting chip having a top surface, a side surface and a bottom surface, and including chip electrodes adjacent the bottom surface, each of the chip electrodes electrically connected to a respective portion of the conductor pattern of the base board via solder bumps;

a wavelength converting layer having a top surface and a side surface, the wavelength converting layer including at least one phosphor, and encapsulating the at least one semiconductor light-emitting chip so as to surround the solder bumps along with the mounting surface of the base board;

a transparent plate having a top surface, a side surface, a bottom surface and an edge portion located between the top surface and the side surface, and disposed adjacent the top surface of the wavelength converting layer, wherein the side surface of the transparent plate is substantially aligned with the side surface of the wavelength converting layer;

a frame located adjacent the mounting surface of the base board so as to surround the wavelength converting layer and the transparent plate;

a reflective material layer having a top surface and an end of the top surface, disposed between the frame and both the side surface of the wavelength converting layer and the side surface of the transparent plate so that the end of the top surface of the reflective material layer contacts with the side surface of the transparent plate, and the top surface of the reflective material layer including one of a concave meniscus shape and a convex meniscus shape;

a light-absorbing layer having a top surface and an end of the top surface, and disposed on the one of the concave meniscus shape and the convex meniscus shape of the reflective material layer, wherein the end of the top surface of the light-absorbing layer contacts with the side surface of the transparent plate at a position that is higher relative to the base board than the end of the top surface of the reflective material layer.

2. The semiconductor light-emitting device according to claim 1, further comprising:

a transparent material layer having a side surface located between the bottom surface of the transparent plate and the top surface of the wavelength converting layer, wherein the side surface of the transparent material layer is substantially aligned with both the side surface of the wavelength converting layer and the side surface of the transparent plate.

5. The semiconductor light-emitting device according to claim 1, further comprising:

an other reflective material layer having a top surface and an end of the top surface, disposed on the top surface of the light-absorbing layer, and covering the top surface of the light-absorbing layer with the other reflective material layer, and the end of the top surface of the other reflective material layer contacting with one of a lower position on the side surface of the transparent plate than the edge portion of the transparent plate and a substantially same position as the edge portion of the transparent plate.

8. The semiconductor light-emitting device according to claim 1, wherein at least a part of the end of the top surface of the light-absorbing layer is located substantially at the edge portion of the transparent plate.

11. The semiconductor light-emitting device according to claim 1, wherein the reflective material layer includes particles of titanium oxide and a density of the particles of titanium oxide included in the reflective material layer is between 8 weight percent and 30 weight percent.

12. The semiconductor light-emitting device according to claim 1, wherein the light-absorbing layer includes a carbon material and a light-absorbing ratio of the light-absorbing layer is 60 percent or more.

13. The semiconductor light-emitting device according to claim 1, wherein the at least one light-emitting chip includes a blue light-emitting chip and the at least one phosphor of the wavelength converting layer is selected from the group consisting of a yellow phosphor, and two phosphors including a red phosphor layer and a green phosphor layer.

16. A vehicle headlight including the semiconductor light-emitting device according to claim 1, further comprising:

at least one parabolic reflector having a focus and an opening, the focus of the at least one parabolic reflector located substantially at the top surface of the transparent plate of the semiconductor light-emitting device; and

an outer lens located in front of the opening of the at least one parabolic reflector.

17. A vehicle headlight including the semiconductor light-emitting device according to claim 1, further comprising:

a projector lens having an incident surface, an optical axis and a focus located on the optical axis toward the incident surface, the focus of the projector lens located substantially at the top surface of the transparent plate, and the incident surface of the projector lens facing the top surface of the transparent plate.

18. A method for manufacturing the semiconductor light-emitting device according to claim 2, comprising:

providing the base board;

connecting each of the chip electrodes of the at least one semiconductor light-emitting chip to a respective portion of the conductor pattern of the base board via the solder bumps;

encapsulating the at least one semiconductor light-emitting chip with an uncured wavelength converting material;

disposing an uncured transparent material on the wavelength converting layer;

mounting the transparent plate on the transparent material layer;

disposing an uncured reflective material between the frame and the side surfaces of the wavelength converting layer, the transparent material layer and the transparent plate; and

disposing an uncured light-absorbing material on the one of the concave meniscus shape and the convex meniscus shape of the reflective material layer.

3. A semiconductor light-emitting device, comprising:

a base board having a mounting surface and a conductor pattern located adjacent the mounting surface;

at least one semiconductor light-emitting chip having a top surface, a side surface and a bottom surface, and including chip electrodes adjacent the bottom surface, each of the chip electrodes electrically connected to a respective portion of the conductor pattern of the base board via solder bumps;

a wavelength converting layer having a top surface, a side surface, a bottom surface and an edge portion located between the top surface and the side surface, the wavelength converting layer including at least one phosphor, and located over the top surface of the at least one semiconductor light-emitting chip so that the bottom surface of the wavelength converting layer covers the top surface of the at least one semiconductor light-emitting chip;

a transparent material layer having a side surface disposed between the bottom surface of the wavelength converting layer and the side surface of the at least one semiconductor light-emitting chip so that the side surface of the transparent material layer extends from the side surface of the at least one semiconductor light-emitting chip toward the bottom surface of the wavelength converting layer;

a frame located adjacent the mounting surface of the base board so as to surround the at least one semiconductor light-emitting chip, the transparent material layer and the wavelength converting layer;

a reflective material layer having a top surface, a side slant surface and an end of the top surface, disposed at least between the frame and both the side surface of the wavelength converting layer and the side surface of the transparent material layer and between the bottom surface of the at least one semiconductor light-emitting chip and the mounting surface of the base board while surrounding the solder bumps, the side slant surface of the reflective material layer contacting with the side surface of the transparent material layer and extending from the side surface of the at least one semiconductor light-emitting chip toward the bottom surface of the wavelength converting layer, the end of the top surface of the reflective material layer contacting with the side surface of the wavelength converting layer, and the top surface of the reflective material layer including one of a concave meniscus shape and a convex meniscus shape; and

a light-absorbing layer having a top surface and an end of the top surface, and disposed on the one of the concave meniscus shape and the convex meniscus shape of the reflective material layer, wherein the end of the top surface of the light-absorbing layer contacts with the side surface of the transparent plate at a position that is higher relative to the base board than the end of the top surface of the reflective material layer.

6. The semiconductor light-emitting device according to claim 3, further comprising:

an other reflective material layer having a top surface and an end of the top surface, disposed on the top surface of the light-absorbing layer, and covering the top surface of the light-absorbing layer with the other reflective material layer, and the end of the top surface of the other reflective material layer contacting with one of a lower position on the side surface of the wavelength converting layer than the edge portion of the wavelength converting layer and a substantially same position as the edge portion of the wavelength converting layer.

9. The semiconductor light-emitting device according to claim 3, wherein at least a part of the end of the top surface of the light-absorbing layer is located substantially at the edge portion of the wavelength converting layer.

14. The semiconductor light-emitting device according to claim 3, wherein the side slant surface of the reflective material layer is formed in at least one of a substantially linear shape and a convex shape having a curvature of 5 or less extending in a direction toward the at least one semiconductor light-emitting chip between the side surface of the at least one semiconductor light-emitting chip and the bottom surface of the wavelength converting layer.

19. A method for manufacturing the semiconductor light-emitting device according to claim 3, comprising:

providing the base board;

connecting each of the chip electrodes of the at least one semiconductor light-emitting chip to a respective portion of the conductor pattern of the base board via the solder bumps;

disposing an uncured transparent material on the top surface of the at least one semiconductor light-emitting chip;

mounting the wavelength converting layer on the uncured transparent material;

disposing an uncured reflective material at least between the frame and both the side surface of the wavelength converting layer and the side surface of the transparent material layer and between the bottom surface of the at least one semiconductor light-emitting chip and the mounting surface of the base board; and

disposing an uncured light-absorbing material on the one of the concave meniscus shape and the convex meniscus shape of the reflective material layer.

4. A semiconductor light-emitting device, comprising:

a base board having a mounting surface and a conductor pattern located adjacent the mounting surface;

at least one semiconductor light-emitting chip having a top surface, a side surface and a bottom surface, and including chip electrodes adjacent the bottom surface, each of the chip electrodes electrically connected to a respective portion of the conductor pattern of the base board via solder bumps;

a transparent plate having a top surface, a side surface, a bottom surface and an edge portion located between the top surface and the side surface, and located over the top surface of the at least one semiconductor light-emitting chip so that the bottom surface of the transparent plate covers the top surface of the at least one semiconductor light-emitting chip;

a wavelength converting layer having a side surface and including at least one phosphor, the wavelength converting layer disposed between the bottom surface of the transparent plate and the side surface of the at least one semiconductor light-emitting chip so that the side surface of the wavelength converting layer extends from the side surface of the at least one semiconductor light-emitting chip toward the bottom surface of the transparent plate;

a frame located adjacent the mounting surface of the base board so as to surround the at least one semiconductor light-emitting chip, the wavelength converting layer and the transparent plate;

a reflective material layer having a top surface, a side slant surface and an end of the top surface, disposed at least between the frame and both the side surface of the transparent plate and the side surface of the wavelength converting layer and between the bottom surface of the at least one semiconductor light-emitting chip and the mounting surface of the base board while surrounding the solder bumps, the side slant surface of the reflective material layer contacting with the side surface of the wavelength converting layer and extending from the side surface of the at least one semiconductor light-emitting chip toward the bottom surface of the transparent plate, the end of the top surface of the reflective material layer contacting with the side surface of the transparent plate, and the top surface of the reflective material layer including one of a concave meniscus shape and a convex meniscus shape; and

a light-absorbing layer having a top surface and an end of the top surface, and disposed on the one of the concave meniscus shape and the convex meniscus shape of the reflective material layer, wherein the end of the top surface of the light-absorbing layer contacts with the side surface of the transparent plate at a position that is higher relative to the base board than the end of the top surface of the reflective material layer.

7. The semiconductor light-emitting device according to claim 4, further comprising:

an other reflective material layer having a top surface and an end of the top surface, disposed on the top surface of the light-absorbing layer, and covering the top surface of the light-absorbing layer with the other reflective material layer, and the end of the top surface of the other reflective material layer contacting with one of a lower position on the side surface of the transparent plate than the edge portion of the transparent plate and a substantially same position as the edge portion of the transparent plate.

10. The semiconductor light-emitting device according to claim 4, wherein at least a part of the end of the top surface of the light-absorbing layer is located substantially at the edge portion of the transparent plate.

15. The semiconductor light-emitting device according to claim 4, wherein the side slant surface of the reflective material layer is formed in at least one of a substantially linear shape and a convex shape having a curvature of 5 or less extending in a direction toward the at least one semiconductor light-emitting chip between the side surface of the at least one semiconductor light-emitting chip and the bottom surface of the transparent plate.

20. A method for manufacturing the semiconductor light-emitting device according to claim 4, comprising:

providing the base board;

connecting each of the chip electrodes of the at least one semiconductor light-emitting chip to a respective portion of the conductor pattern of the base board via the solder bumps;

disposing an uncured wavelength converting material on the top surface of the at least one semiconductor light-emitting chip;

mounting the transparent plate on the uncured wavelength converting material;

disposing an uncured reflective material at least between the frame and both the side surface of the wavelength converting layer and the side surface of the transparent plate and between the bottom surface of the at least one semiconductor light-emitting chip and the mounting surface of the base board; and

disposing an uncured light-absorbing material on the one of the concave meniscus shape and the convex meniscus shape of the reflective material layer.