Ceramic Crack Inspection

• US 20120235693A1
• Filed: 03/20/2011
• Published: 09/20/2012
• Est. Priority Date: 03/20/2011
• Status: Abandoned Application

• Current Assignee: Hong Feng
• Original Assignee: Hong Feng
• Inventors: Feng, Hong
• Application Number:
  US13/052,080
• Publication Number:
  US 20120235693A1
• Time in Patent Office: Days
• US Class Current: 324/693
• CPC Class Codes: G01N 27/20 Investigating the presence of flaws

Abstract

A method and apparatus for non-destructive inspection including detection, quantification, and location of a surface or subsurface crack in a body made of advanced technical ceramics. The method and apparatus can detect all cracks in a ceramic body, including microscopic cracks, with a high sensitivity, accuracy and reliability, by measuring changes in electrical resistances through a plurality pairs of electrodes affixed on surfaces of the ceramic body. The extent of the cracks can be quantified and expressed as numerical data, and the location of the cracks can be identified. An automated inspection process enables a convenient, real-time, cost-effective crack inspection.

Claims

1. A method of detecting a crack in a ceramic body including surfaces and having electrical conductivity and/or semiconductivity, comprising the steps of:

affixing one or a plurality of electrode pairs on one or more surfaces of said ceramic body,

measuring electrical resistance through each pair of said electrode pairs,

comparing said measured resistance value with a respective reference resistance value that is either a previously measured resistance value at said electrode pair or a standard value of the same material involving no crack, and

determining the presence or absence of a crack based on said comparison between said measured and said reference resistance values, for each pair of said electrode pairs,

wherein an increase of resistance over said reference value in one or more of said plurality of electrode pairs indicates the presence of a crack.

2. The method of claim 1, wherein the extent of said crack in said ceramic body is quantified based on the amount of the resistance increase at one or more of said plurality of electrode pairs.

3. The method of claim 1, wherein the location of said crack in said ceramic body is identified by the relative location of said one or more electrode pairs whose measured resistance values increased over their respective reference values.

4. An automated method of detecting, quantifying, and locating a crack in a ceramic body including surfaces and having electrical conductivity and/or semiconductivity, comprising the steps of:

affixing a plurality of electrode pairs on one or more surfaces of said ceramic body,

wiring each of said plurality of electrode pairs to an electrical resistance measurement circuit,

connecting a power supply to the said resistance measurement circuit,

connecting a visual display to said resistance measurement circuit,

connecting a memory to said resistance measurement circuit, wherein said memory stores reference resistance values for all of said plurality of electrode pairs,

connecting a selector to said resistance measurement circuit,

connecting a microprocessor to said resistance measurement circuit,

initiating an inspection process wherein said microprocessor controls the selector to sequentially measure resistance through each of said plurality of electrode pairs,

wherein said microprocessor compares said measured resistance value with a respective reference resistance value stored in said memory, said reference resistance value comprising either a previously measured resistance value at said electrode pair or a standard value of the same material involving no crack,

wherein said microprocessor determines the presence or absence of a crack based on said comparison between said measured and said reference resistance values, for each of the plurality of electrode pairs,

wherein an increase of resistance over a reference value in one or more of said plurality of electrode pairs indicates the presence of a crack,

wherein said microprocessor quantifies the extent of said crack by producing numerical data based on the amount of the resistance increase at one or more of said plurality of electrode pairs,

wherein said microprocessor locates said crack by identifying the electrode pairs whose measured resistance values increased over their respective reference values,

wherein said microprocessor displays the results of crack presence, extent, and location in said visual display.

5. The method of claim 4 wherein said visual display comprises an LCD screen or an LED light.

6. The method of claim 4 wherein said visual display reports the results as numerical values.

7. The method of claim 4 wherein said visual display reports the results as a red light to indicate the presence of a crack or green light to indicate that no crack was detected.

8. The method of claim 4 wherein said visual display and said power supply are contained in a separate unit that is plugged into said resistance measurement circuit through a connector to initiate the automated inspection process and to display the inspection results in said visual display.

9. The method of claim 4 wherein said visual display and said power supply are contained in a separate unit that is wirelessly plugged into said resistance measurement circuit to initiate the automated inspection process and to display the inspection results in said visual display.

10. An apparatus for detecting, quantifying, and locating a crack in a ceramic body including surfaces and having electrical conductivity and/or semiconductivity, comprising:

One or a plurality of pairs of electrodes affixed on one or more surfaces of said ceramic body, and

a circuit for measuring electrical resistance through each said pair of electrodes, wherein said measured resistance is compared with a respective reference resistance value to detect a crack, quantify the extent of said crack, and identify the location of said crack.

11. The apparatus of claim 10 wherein said circuit comprises a multimeter.

12. A sensor unit for automated detection, quantification, and location of a crack in a ceramic body including surfaces and having electrical conductivity and/or semiconductivity, comprising:

a plurality of electrode pairs affixed on one or more surfaces of said ceramic body,

a plurality of electrical wires connecting each of said plurality of electrode pairs to a resistance measurement circuit that contains a memory for storing reference resistance values for all of said plurality of electrode pairs,

a power supply,

a visual display,

a selector, and

a microprocessor,

wherein said microprocessor controls said selector to sequentially measure resistance through each of said plurality of electrode pairs, judges crack existence, quantifies crack extent, and identifies crack location, based on comparison between measured resistance values and said stored reference resistance values according to a preprogrammed algorithm and expresses the results in numerical data and displays said data in said visual display.

13. The apparatus of claim 12 wherein said power supply and said visual display are packaged in a keychain-size device, separated from said sensor unit on said ceramic body, and said keychain-size device is plugged into said sensor unit on said ceramic body through a connector to initiate the automated inspection process and to display the results at said visual display.

14. The apparatus of claim 12 wherein said power supply and said visual display are packaged in a keychain-size device, separated from said sensor unit on said ceramic body, and said keychain-size device is wirelessly connected with said sensor unit on said ceramic body to initiate the automated inspection process and to display the results at said visual display.