CONDUCTIVE SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND TOUCH PANEL

• US 20120241199A1
• Filed: 06/06/2012
• Published: 09/27/2012
• Est. Priority Date: 12/10/2009
• Status: Abandoned Application

• Current Assignee: Toppan Printing Co., Ltd. (TOPPAN Holdings, Inc.)
• Original Assignee: Toppan Printing Co., Ltd. (TOPPAN Holdings, Inc.)
• Inventors: Kobayashi, Hiroshi, Tomikawa, Noritoshi
• Application Number:
  US13/490,112
• Publication Number:
  US 20120241199A1
• Time in Patent Office: Days
• US Class Current: 174/250
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

One embodiment of the present invention is a conductive substrate including: a conductive layer, and a transparent conductive layer on at least one surface of a transparent substrate in this order from the transparent substrate side. According to the present invention, it becomes possible to provide a conductive substrate, wherein positioning of the transparent conductive layer and the metal wiring is easy, a method of manufacturing thereof, and a touch panel, even in the conductive substrate where the shape of the transparent conductive layer pattern is inconspicuous.

Claims

1. A conductive substrate comprising:

a transparent substrate;

a conductive layer on at least one surface of the transparent substrate;

and

a transparent conductive layer on the conductive layer.

2. The conductive substrate according to claim 1,

wherein the transparent conductive layer has a conductive pattern region and a non-conductive pattern region.

3. The conductive substrate according to claim 2,

wherein one or more optical adjustment layers are formed on a front surface of the transparent conductive layer.

4. The conductive substrate according to claim 2,

wherein one or more optical adjustment layers are formed only on a front surface of the conductive pattern region of the transparent conductive layer.

5. The conductive substrate according to claim 3,

further comprising a hard coat layer which is formed between any of the conductive layer, the transparent layer, and the one or more optical adjustment layers, or is formed at a most front surface of the conductive substrate.

6. The conductive substrate according to claim 5,

wherein a sheet resistance value of the conductive layer is equal to or less than 1 Ω

/sq, and the sheet resistance value of the transparent conductive layer is from 100 Ω

/sq to 700 kΩ

/sq.

7. A touch panel including the conductive substrate according to claim 6.

8. The conductive substrate according to claim 2,

wherein the conductive substrate is bonded to another transparent substrate or another conductive substrate via an adhesive layer.

9. The conductive substrate according to claim 8,

wherein a sheet resistance value of the conductive layer is equal to or less than 1 Ω

/sq, and the sheet resistance value of the transparent conductive layer is from 100 Ω

/sq to 700 kΩ

/sq.

10. A touch panel including the conductive substrate according to claim 9.

11. A method of manufacturing a conductive substrate comprising:

forming a conductive layer on at least one surface of a transparent substrate; and

followed by

forming a transparent conductive layer on a front surface of the conductive layer.

12. The method of manufacturing a conductive substrate according to claim 11,

wherein the forming of the transparent conductive layer on the front surface of the conductive layer includes forming the transparent conductive to have a conductive pattern region and a non-conductive pattern region on the front surface of the conductive layer.

13. The method of manufacturing a conductive substrate according to claim 12, further comprising either one or both of:

forming an optical adjustment layer and forming a hard coat layer.

14. The method of manufacturing a conductive substrate according to claim 13,

wherein all of the forming processes are performed by a roll-to-roll system.