METHOD AND APPARATUS FOR CUTTING A SUBSTRATE

• US 20120241488A1
• Filed: 02/10/2012
• Published: 09/27/2012
• Est. Priority Date: 03/22/2011
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Lee, Hyun-Chul, Lim, Won-Kyu, KANG, Ji-Hyeon
• Granted Patent: US 9,073,777 B2
• Time in Patent Office: Days
• US Class Current: 225/2
• CPC Class Codes: B26F 3/002 Precutting and tensioning or breaking
• CPC Class Codes: B65G 2249/04 Arrangements of vacuum systems or suction cups
• CPC Class Codes: C03B 33/033 Apparatus for opening score lines in glass sheets
• CPC Class Codes: Y02P 40/57 Improving the yield, e-g- reduction of reject rates
• CPC Class Codes: Y10T 225/12 With preliminary weakening
• CPC Class Codes: Y10T 225/371 Movable breaking tool

Abstract

A substrate cutting apparatus for cutting a large size substrate into smaller unit substrates includes a rotating table and a push plate. The rotating table, on which the large size substrate having formed thereon a plurality of cutting lines is mountable, includes rotating shafts at locations corresponding to the cutting lines. The push plate fixes a position of the large size substrate on the rotating table.

Claims

1. A substrate cutting apparatus for cutting a large size substrate into smaller unit substrates, the apparatus comprising:

a rotating table on which the large size substrate having formed thereon a plurality of cutting lines is mountable, the rotating table including rotating shafts at locations corresponding to the cutting lines; and

a push plate that fixes a position of the large size substrate on the rotating table.

2. The substrate cutting apparatus of claim 1, wherein the rotating shafts include:

first rotating shafts for rotating the rotating table into a first angular disposition pointing in a first direction, and

second rotating shafts for rotating the rotating table into a second angular disposition pointing in a second direction, the second direction being opposite to the first direction.

3. The substrate cutting apparatus of claim 2, wherein the first rotating shafts and the second rotating shafts are alternately arranged on the rotating table.

4. The substrate cutting apparatus of claim 1, wherein the rotatable table has mountable thereon the large size substrate that includes the cutting lines alternately formed on a top surface and a bottom surface of the large size substrate.

5. The substrate cutting apparatus of claim 1, further comprising a suction pump for applying suction force via penetration holes in the rotating table toward the large size substrate mountable on the rotating table.

6. A method of cutting a substrate, the method comprising:

performing a scribing operation to form a plurality of cutting lines on a large size substrate according to a size of a plurality of smaller unit substrates to be formed;

performing a fixing operation for fixing the large size substrate, on which the cutting lines are formed, to a rotating table, the rotating table having a plurality of rotating shafts corresponding to the cutting lines; and

performing a cutting operation for cutting the plurality of smaller unit substrates from the large size substrate along the cutting lines by rotating the rotating table around the plurality of rotating shafts.

7. The method of claim 6, wherein the fixing operation further comprises fixing the large size substrate to the rotating table by pushing the large size substrate toward the rotating table.

8. The method of claim 7, further comprising applying suction force to the large size substrate via penetration holes in the rotating table.

9. The method of claim 6, wherein the rotating table is rotated simultaneously around the plurality of rotating shafts.

10. The method of claim 6, wherein the rotating table is rotated around ones of the plurality of rotating shafts at different times.

11. The method of claim 6, wherein the rotating shafts include:

first rotating shafts for rotating the rotating table into a first angular disposition pointing in a first direction, and

second rotating shafts for rotating the rotating table into a second angular disposition pointing in a second direction, the second direction being opposite to the first direction.

12. The method of claim 11, wherein the first rotating shafts and the second rotating shafts are alternately arranged on the rotating table.

13. The method of claim 6, wherein the scribing operation includes alternately forming the cutting lines on a top surface and a bottom surface of the large size substrate.

14. The method of claim 13, wherein the cutting lines are sequentially formed on the top surface and the bottom surface of the large size substrate.

15. The method of claim 13, wherein the cutting lines are simultaneously formed on the top surface and the bottom surface of the large size substrate.