LED BAR MODULE WITH GOOD HEAT DISSIPATION EFFICIENCY

• US 20120241773A1
• Filed: 11/23/2011
• Published: 09/27/2012
• Est. Priority Date: 03/22/2011
• Status: Abandoned Application

• Current Assignee: Advanced Optoelectronic Technology, Inc.
• Original Assignee: Advanced Optoelectronic Technology, Inc.
• Inventors: CHANG, YU-FEN, KUO, TE-WEN
• Application Number:
  US13/303,169
• Publication Number:
  US 20120241773A1
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An LED bar module includes a lengthwise base and a number of LED chips. The lengthwise base includes a metal layer, a metal circuit layer, and an insulated layer between the metal layer and the metal circuit layer. The insulated layer has a groove in a central thereof to expose a part of the metal layer. The LED chips are placed in the groove and directly contact the exposed part of the metal layer. The metal circuit layer has two connecting portions electrically connecting with the LED chips. The LED chips are arranged in a line which is located between and juxtaposed with the two connecting portions of the metal circuit layer.

Claims

1. An LED bar module, comprising:

a lengthwise base comprising a metal layer, a metal circuit layer, and an insulated layer between the metal layer and the metal circuit layer, the insulated layer defining a groove in a central thereof to expose a part of the metal layer;

a plurality of LED chips placed in the groove and directly contacting the exposed part of the metal layer, the metal circuit layer comprising two connecting portions, the LED chips being located between and electrically connected with the two connecting portions, the LED chips being arranged in a juxtaposed manner with the two connecting portions.

2. The LED bar module of claim 1, wherein the two connecting portions of the circuit layer are located at two opposite sides of the base, each connecting portion comprises a bonding part and an elongated strip connecting the bonding part, the bonding parts of the two connecting portions are symmetrically located at two opposite ends of the base, and the elongated strips of the two connecting portions face and are parallel to each other, the LED chips are arranged between the two elongated strips of the connecting portions.

3. The LED bar module of claim 1, further comprising a reflecting wall located on the metal circuit layer of the base to surround the groove.

4. The LED bar module of claim 3, further comprising an encapsulation filled in the reflecting wall to encapsulate the LED chips therein and parts of the metal circuit layer within the reflecting wall.

5. The LED bar module of claim 3, wherein at least one side surface of the reflecting wall is perpendicular to the base.

6. The LED bar module of claim 1, wherein the metal layer is made of copper.

7. The LED bar module of claim 1, wherein the a thickness of the metal circuit layer is less than that of the metal layer, the thickness of the metal layer ranges from 0.2 mm to 0.3 mm, and the thickness of the metal circuit layer ranges from 0.15 mm to 0.2 mm.

8. An LED bar module, comprising:

a base comprising a metal layer and a metal circuit layer formed on and insulated from the metal layer, the lengthwise base defining a groove through the metal circuit layer;

a plurality of LED chips placed in the groove and directly contacting the metal layer and electrically connecting with the metal circuit layer.

9. The LED bar module of claim 8, wherein the metal circuit layer comprises two opposite connecting portions, each connecting portion comprises a bonding part and an elongated strip connecting the bonding part, the bonding parts of the two connecting portions are symmetrically located at two opposite ends of the base, and the elongated strips of the two connecting portions face each other, the LED chips are arranged between the two elongated strips of the connecting portions.

10. The LED bar module of claim 8, further comprising a reflecting wall located on the metal circuit layer of the base to surround the groove.

11. The LED bar module of claim 10, further comprising an encapsulation filled in the reflecting wall to encapsulate therein the LED chips and parts of metal circuit layer extending within the reflecting wall.

12. The LED bar module of claim 10, wherein at least one side surface of the reflecting wall is perpendicular to the base.

13. The LED bar module of claim 8, wherein the metal layer is made of copper.

14. The LED bar module of claim 8, wherein the a thickness of the metal circuit layer is less than that of the metal layer, the thickness of the metal layer ranges from 0.2 mm to 0.3 mm, and the thickness of the metal circuit layer ranges from 0.15 mm to 0.2 mm.

15. A method for manufacturing an LED bar module, comprising:

providing a lengthwise base, the base comprising a metal layer, a metal circuit layer, and an insulated layer between the metal layer and the metal circuit layer;

forming a groove in a central of the insulated layer to expose a part of the metal layer;

providing a plurality of LED chips in the groove and mounting the plurality of LEDs chips on the exposed part of the metal layer;

wiring bonding the LED chips with the metal circuit layer;

providing a reflecting wall on the metal circuit layer to surround the LED chips; and

providing an encapsulation in the reflecting wall to encapsulate therein the LED chips and parts of the metal circuit layer.