CHIP SCALE PACKAGE ASSEMBLY IN RECONSTITUTION PANEL PROCESS FORMAT
First Claim
1. A method, comprising:
- forming a substrate panel that includes a plurality of substrates that each include routing;
testing the substrates in the substrate panel to determine a set of working substrates;
singulating the substrate panel to separate the plurality of substrates;
attaching a subset of the separated substrates to a surface of a carrier, the subset of the separated substrates being the set of working substrates;
mounting one or more dies to each of the substrates on the carrier;
encapsulating the dies and the substrates on the carrier with a molding compound;
detaching the carrier from the encapsulated dies and substrates to form a molded assembly that includes the molding compound encapsulating the dies and substrates;
attaching a plurality of interconnects to each of the substrates at a surface of the molded assembly; and
singulating the molded assembly to form a plurality of integrated circuit packages, each integrated circuit package including at least one of the dies and a substrate having a peripheral ring of the molding compound around an outer edge of the substrate.
6 Assignments
0 Petitions
Accused Products
Abstract
Methods, systems, and apparatuses are described for the assembly of integrated circuit (IC) packages. A substrate panel is formed that includes a plurality of substrates. The substrate panel is singulated to separate the plurality of substrates. At least a subset of the separated substrates is attached to a surface of a carrier. One or more dies are attached to each of the substrates on the carrier. The dies and the substrates are encapsulated on the carrier with a molding compound. The carrier is detached from the encapsulated dies and substrates to form a molded assembly that includes the molding compound encapsulating the dies and substrates. A plurality of interconnects is attached to each of the substrates at a surface of the molded assembly. The molded assembly is singulated to form a plurality of IC packages. Each IC package includes at least one of the dies and a substrate.
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Citations
22 Claims
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1. A method, comprising:
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forming a substrate panel that includes a plurality of substrates that each include routing; testing the substrates in the substrate panel to determine a set of working substrates; singulating the substrate panel to separate the plurality of substrates; attaching a subset of the separated substrates to a surface of a carrier, the subset of the separated substrates being the set of working substrates; mounting one or more dies to each of the substrates on the carrier; encapsulating the dies and the substrates on the carrier with a molding compound; detaching the carrier from the encapsulated dies and substrates to form a molded assembly that includes the molding compound encapsulating the dies and substrates; attaching a plurality of interconnects to each of the substrates at a surface of the molded assembly; and singulating the molded assembly to form a plurality of integrated circuit packages, each integrated circuit package including at least one of the dies and a substrate having a peripheral ring of the molding compound around an outer edge of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 19)
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8. (canceled)
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9. A method, comprising:
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receiving a plurality of separate substrates singulated from a substrate panel and tested to be working substrates; attaching the substrates to a surface of a carrier; mounting one or more dies to each of the substrates on the carrier; encapsulating the dies and the substrates on the carrier with a molding compound; detaching the carrier from the encapsulated dies and substrates to form a molded assembly that includes the molding compound encapsulating the dies and substrates; attaching a plurality of interconnects to each of the substrates at a surface of the molded assembly; and singulating the molded assembly to form a plurality of integrated circuit packages, each integrated circuit package including at least one of the dies and a substrate having a peripheral ring of the molding compound around an outer edge of the substrate. - View Dependent Claims (10, 11, 12, 13, 20)
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14. (canceled)
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15. An integrated circuit package, comprising:
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a substrate that has opposing first and second surfaces; a die mounted to the first surface of the substrate; and molding compound that encapsulates the die on the first surface of the substrate and forms a peripheral ring around an outer edge of the substrate, the peripheral ring of molding compound remaining from saw singulation of the integrated circuit package from a molded assembly and covering the outer edge of the substrate entirely. - View Dependent Claims (16, 17, 18, 21, 22)
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Specification