LIGHT-EMITTING DEVICE

• US 20120242216A1
• Filed: 03/22/2012
• Published: 09/27/2012
• Est. Priority Date: 03/22/2011
• Status: Active Grant

• Current Assignee: Stanley Electric Company Limited
• Original Assignee: Stanley Electric Company Limited
• Inventors: KOTANI, Hiroshi, SAKAI, Takaaki
• Granted Patent: US 8,508,118 B2
• Time in Patent Office: Days
• US Class Current: 313/501
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light-emitting device that suppresses color unevenness can be provided. A transparent member can be disposed on a fluorescence-containing resin layer. Part of excitation light can be emitted upward from an edge surface of the fluorescence-containing resin layer directly and without passing through the transparent member. Thus, fluorescent light emitted in large quantities from a place near an edge surface of the transparent member can be mixed with the excitation light emitted from the edge surface of the fluorescence-containing resin layer directly without passing through the transparent member, thereby suppressing color unevenness at a location near the edge surface of the transparent member.

Claims

1. A light-emitting device, comprising:

a mounting substrate;

a light-emitting element disposed on the mounting substrate;

a fluorescence-containing resin layer disposed on the light-emitting element and containing fluorescent particles; and

a light-transmitting member disposed on the fluorescence-containing resin layer,

wherein the light-emitting element includes a light emitting structure layer and a support substrate supporting the light-emitting structure layer, the light emitting structure layer being at least one semiconductor layer including at least a light-emitting layer,

a size of the light-transmitting member being substantially the same as or smaller than a size of the light-emitting structure layer, the fluorescence-containing resin layer having a sloping edge surface connecting an edge portion of the light-transmitting member and an edge portion of the support substrate.

3. The light-emitting device according to claim 1, wherein a thickness of the fluorescence-containing resin layer directly above an edge portion of the light emitting structure layer is greater than a particle diameter of the fluorescent particles contained in the fluorescence-containing resin layer.

5. The light-emitting device according to claim 1, wherein the edge surface of the fluorescence-containing resin layer forms an angle of 60 degrees or smaller relative to the normal to the support substrate.

7. The light-emitting device according to claim 3, wherein the edge surface of the fluorescence-containing resin layer forms an angle of 60 degrees or smaller relative to the normal to the support substrate.

9. The light-emitting device according to claim 1, wherein a difference between a length of one side of the light-transmitting member and a length of a corresponding side of the light emitting structure layer is 50 μ

m or smaller, and the light-transmitting member is a plate-like member.

11. The light-emitting device according to claim 3, wherein a difference between a length of one side of the light-transmitting member and a length of a corresponding side of the light emitting structure layer is 50 μ

m or smaller.

13. The light-emitting device according to claim 5, wherein a difference between a length of one side of the light-transmitting member and a length of a corresponding side of the light emitting structure layer is 50 μ

m or smaller.

15. The light-emitting device according to claim 1, wherein

an electrode is located on an upper surface of the light emitting structure layer, the electrode being connected through a bonding wire to a mounting electrode pattern on the mounting substrate, and

a sealing resin is located on the electrode, the sealing resin sealing a connection between the electrode and the bonding wire.

17. The light-emitting device according to claim 3, wherein

an electrode is located on an upper surface of the light emitting structure layer, the electrode being connected through a bonding wire to a mounting electrode pattern on the mounting substrate, and

a sealing resin is located on the electrode, the sealing resin sealing a connection between the electrode and the bonding wire.

19. The light-emitting device according to claim 5, wherein

an electrode is located on an upper surface of the light emitting structure layer, the electrode being connected through a bonding wire to a mounting electrode pattern on the mounting substrate, and

a sealing resin is located on the electrode, the sealing resin sealing a connection between the electrode and the bonding wire.

21. The light-emitting device according to claim 1, wherein a light-reflecting resin layer is configured to face the edge surface of the fluorescence-containing resin layer and an edge surface of the light-transmitting member while a predetermined gap is left between the light-reflecting resin layer and the edge surfaces.

23. The light-emitting device according to claim 21, wherein the gap is filled with a transparent material transparent to light emitted from the light-emitting element.

2. A light-emitting device, comprising:

a mounting substrate;

a light-emitting element disposed on the mounting substrate;

a fluorescence-containing resin layer disposed on the light-emitting element and containing fluorescent particles; and

a light-transmitting member disposed on the fluorescence-containing resin layer,

wherein the light-emitting element includes a light emitting structure layer and a support substrate supporting the light emitting structure layer, the light emitting structure layer being at least one semiconductor layer including at least a light emitting layer,

a size of the light-transmitting member being substantially the same as or smaller than a size of the light emitting structure layer, the fluorescence-containing resin layer having an edge surface disposed on the outer side than a side surface of the light-transmitting member.

4. The light-emitting device according to claim 2, wherein a thickness of the fluorescence-containing resin layer directly above an edge portion of the light emitting structure layer is greater than a particle diameter of the fluorescent particles contained in the fluorescence-containing resin layer.

6. The light-emitting device according to claim 2, wherein the edge surface of the fluorescence-containing resin layer forms an angle of 60 degrees or smaller relative to the normal to the support substrate.

8. The light-emitting device according to claim 4, wherein the edge surface of the fluorescence-containing resin layer forms an angle of 60 degrees or smaller relative to the normal to the support substrate.

10. The light-emitting device according to claim 2, wherein a difference between a length of one side of the light-transmitting member and a length of a corresponding side of the light emitting structure layer is 50 μ

m or smaller, and the light-transmitting member is a plate-like member.

12. The light-emitting device according to claim 4, wherein a difference between a length of one side of the light-transmitting member and a length of a corresponding side of the light emitting structure layer is 50 μ

m or smaller.

14. The light-emitting device according to claim 6, wherein a difference between a length of one side of the light-transmitting member and a length of a corresponding side of the light emitting structure layer is 50 μ

m or smaller.

16. The light-emitting device according to claim 2, wherein

an electrode is located on an upper surface of the light emitting structure layer, the electrode being connected through a bonding wire to a mounting electrode pattern on the mounting substrate, and

a sealing resin is located on the electrode, the sealing resin sealing a connection between the electrode and the bonding wire.

18. The light-emitting device according to claim 4, wherein

an electrode is located on an upper surface of the light emitting structure layer, the electrode being connected through a bonding wire to a mounting electrode pattern on the mounting substrate, and

a sealing resin is located on the electrode, the sealing resin sealing a connection between the electrode and the bonding wire.

20. The light-emitting device according to claim 6, wherein

an electrode is located on an upper surface of the light emitting structure layer, the electrode being connected through a bonding wire to a mounting electrode pattern on the mounting substrate, and

a sealing resin is located on the electrode, the sealing resin sealing a connection between the electrode and the bonding wire.

22. The light-emitting device according to claim 2, wherein a light-reflecting resin layer is configured to face the edge surface of the fluorescence-containing resin layer and an edge surface of the light-transmitting member while a predetermined gap is left between the light-reflecting resin layer and the edge surfaces.

24. The light-emitting device according to claim 22, wherein the gap is filled with a transparent material transparent to light emitted from the light-emitting element.

25. A light-emitting device, comprising:

a mounting substrate;

a plurality of light-emitting elements disposed on the mounting substrate;

a fluorescence-containing resin layer disposed on the light-emitting elements and including fluorescent particles; and

one light-transmitting plate-like member disposed on the fluorescence-containing resin layer such that the plate-like member covers all the light-emitting elements,

wherein the light-emitting elements each include a light emitting structure layer and a support substrate supporting the light emitting structure layer, the light emitting structure layer being at least one semiconductor layer including at least a light emitting layer,

the plate-like member having an edge surface located at a position directly above an edge surface of the light emitting structure layer or at a position closer to a center of the light emitting structure layer than the edge surface of the light emitting structure layer, the fluorescence-containing resin layer having a sloping edge surface connecting an edge portion of the plate-like member and an edge portion of the support substrate.

26. A light-emitting device, comprising:

a mounting substrate;

a light-emitting element disposed on the mounting substrate;

a fluorescence-containing resin layer disposed on the light-emitting element and including fluorescent particles; and

a light-transmitting plate-like member disposed on the fluorescence-containing resin layer,

wherein the light-emitting element includes a light emitting structure layer and a support substrate supporting the light emitting structure layer, the light emitting structure layer being at least one semiconductor layer including at least a light emitting layer,

the plate-like member having an edge surface located at a position directly above an edge surface of the light emitting structure layer or at a position closer to a center of the light emitting structure layer than the edge surface of the light emitting structure layer, the fluorescence-containing resin layer having an edge surface disposed on an outer side as compared to a side surface of the plate-like member as viewed from above.