BLACK CURABLE COMPOSITION, LIGHT-SHIELDING COLOR FILTER, LIGHT-SHIELDING FILM AND METHOD FOR MANUFACTURING THE SAME, WAFER LEVEL LENS, AND SOLID-STATE IMAGING DEVICE

• US 20120243099A1
• Filed: 12/03/2010
• Published: 09/27/2012
• Est. Priority Date: 12/11/2009
• Status: Active Grant

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Inventors: Kaneko, Yushi
• Granted Patent: US 9,110,205 B2
• Time in Patent Office: Days
• US Class Current: 359/611
• CPC Class Codes: C08F 2/44 Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
• CPC Class Codes: C08F 2/48 by ultraviolet or visible light
• CPC Class Codes: C08F 222/102 of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
• CPC Class Codes: C08K 3/22 of metals
• CPC Class Codes: C09D 4/06 Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
• CPC Class Codes: G02B 13/0085 employing wafer level optics
• CPC Class Codes: G02B 3/0012 characterised by the manufacturing method
• CPC Class Codes: G02B 5/003 Light absorbing elements
• CPC Class Codes: G03F 7/0007 Filters, e.g. additive colour filters; Components for display devices
• CPC Class Codes: G03F 7/031 Organic compounds not covered by group G03F7/029
• CPC Class Codes: G03F 7/033 the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
• CPC Class Codes: G03F 7/105 having substances, e.g. indicators, for forming visible images

Abstract

A black curable composition for a wafer level lens is provided which exhibits excellent developability during formation of a pattern and imparts excellent adhesion with a lens to a formed light-shielding film. The black curable composition contains an inorganic pigment, a specific dispersion resin, a polymerization initiator, and a polymerizable compound. The inorganic pigment is preferably titanium black.

Claims

1. A black curable composition for a wafer level lens, comprising:

(A1) an inorganic pigment;

(B1) a dispersion resin having a phosphoric acid group or a sulfonic acid group in a molecule thereof;

(C1) a polymerization initiator; and

(D1) a polymerizable compound.

2. The black curable composition according to claim 1, wherein the (A1) inorganic pigment comprises titanium black.

3. The black curable composition according to claim 1, further comprising (E) an organic pigment.

4. The black curable composition according to claim 1, wherein the (B1) dispersion resin comprises a copolymer of a monomer (b1-1) having a phosphoric acid group or a sulfonic acid group with a macromonomer (b1-2) having a weight average molecular weight of from 1,000 to 30,000.

5. The black curable composition according to claim 1, wherein the (B1) dispersion resin comprises a resin represented by the following Formula (I):

6. A wafer level lens, comprising, at a peripheral portion of a lens that is present on a substrate, a light-shielding section obtained using the black curable composition for a wafer level lens according to claim 1.

7. A black curable composition for formation of a light-shielding film, comprising:

(A2) an inorganic pigment;

(B2) a dispersion resin which has at least one of a phosphoric acid group or a sulfonic acid group in a molecule thereof and has an acid value of from 10 mgKOH/g to 100 mgKOH/g;

(C2) a polymerization initiator; and

(D2) a polymerizable compound,

wherein the light-shielding film blocks infrared light and is provided on one surface of a silicon substrate having an imaging device section on an opposite surface thereof.

8. The black curable composition according to claim 7, wherein the (A2) inorganic pigment comprises titanium black.

9. The black curable composition according to claim 7, wherein the (B2) dispersion resin comprises a copolymer of a monomer (b2-1) having at least one of a phosphoric acid group or a sulfonic acid group with a macromonomer (b2-2) having a weight average molecular weight of from 1,000 to 30,000.

10. The black curable composition according to claim 7, wherein the (B2) dispersion resin comprises a resin represented by the following Formula (I):

11. The black curable composition according to claim 7, wherein the (B2) dispersion resin has an acid value of from 20 mgKOH/g to 70 mgKOH/g.

12. The black curable composition according to claim 7, wherein the (C2) polymerization initiator is an oxime ester compound or a hexaarylbiimidazole compound.

13. The black curable composition according to claim 8, wherein the titanium black as the (A2) inorganic pigment has an average primary particle diameter of from 30 nm to 65 nm.

14. The black curable composition according to claim 7, wherein the content of the (B2) dispersion resin in terms of mass ratio is from 0.20 to 0.40 relative to the (A2) inorganic pigment.

15. A light-shielding film, which is formed using the black curable composition according to claim 7 on one surface of a silicon substrate having an imaging device section on an opposite surface thereof.

16. A method for manufacturing a light-shielding film, comprising:

applying the black curable composition according to claim 7 on one surface of a silicon substrate having an imaging device section on an opposite surface thereof to form a black curable composition layer;

subjecting the black curable composition layer to pattern exposure; and

developing the black curable composition layer after exposure to form a pattern.

17. A solid-state imaging device, comprising the light-shielding film according to claim 15 on one surface of a silicon substrate having an imaging device section on an opposite surface thereof.

18. The solid-state imaging device according to claim 17, comprising:

a silicon substrate having an imaging device section on one surface thereof;

a metal electrode provided on an opposite surface of the silicon substrate and electrically connected with the imaging device section; and

the light-shielding film according to claim 15, which is provided on the surface of the silicon substrate having the metal electrode provided thereon, and which is patterned so that at least a part of the metal electrode is exposed.

19. The solid-state imaging device according to claim 18, wherein a solder resist is provided between the metal electrode and the light-shielding film.

20. A black curable composition, comprising:

(A3) an inorganic pigment;

(B3) a chain resin comprising a solvent-compatible moiety and a pigment-adsorbing moiety having an acid group or a basic group;

(C3) a polymerization initiator; and

(D3) a polymerizable compound.

21. The black curable composition according to claim 20, wherein the (A3) inorganic pigment comprises titanium black.

22. The black curable composition according to claim 20, wherein the solvent-compatible moiety comprises repeating units having an I/O value in a range from 0.05 to 1.50 in an amount of 80% by mass or more.

23. The black curable composition according to claim 20, wherein the solvent-compatible moiety comprises a repeating unit represented by the following Formula (I-A) or the following Formula (I-B):

24. The black curable composition according to claim 20, wherein the (C3) polymerization initiator is an oxime ester compound or a hexaarylbiimidazole compound.

25. The black curable composition according to claim 20, further comprising (E3) an alkali-soluble resin that is other than the (B3) chain resin.

26. The black curable composition according to claim 20, further comprising (F3) an organic pigment.

27. A black curable composition for a solid-state imaging device, comprising the black curable composition according to claim 20.

28. A light-shielding color filter for a solid-state imaging device, comprising the black curable composition according to claim 27.

29. A solid-state imaging device, comprising the light-shielding color filter for a solid-state imaging device according to claim 28.

30. A black curable composition for a wafer level lens, comprising the black curable composition according to claim 20.

31. A wafer level lens, comprising, at a peripheral portion of a lens present on a substrate, a light-shielding film obtained using the black curable composition according to claim 30.

32. The black curable composition according to claim 20, which is used for formation of an infrared light-shielding film which blocks infrared light and is provided on one surface of a silicon substrate.

33. An infrared light-shielding film, which is formed, using the black curable composition according to claim 32 and on a silicon substrate having an imaging device section, on an opposite surface to a surface on which the imaging device is provided.

34. A method for manufacturing an infrared light-shielding film, comprising:

applying the black curable composition according to claim 32 to a silicon substrate having an imaging device section, on an opposite surface to a surface on which the imaging device is provided, to form a photosensitive layer;

subjecting the photosensitive layer to pattern exposure; and

developing the photosensitive layer after exposure to form a pattern.

35. A solid-state imaging device, comprising the infrared light-shielding film according to claim 33 provided on a silicon substrate having an imaging device section, at an opposite surface to a surface on which the imaging device is provided.