Sensor module and method for manufacturing a sensor module

• US 20120247205A1
• Filed: 03/28/2012
• Published: 10/04/2012
• Est. Priority Date: 03/31/2011
• Status: Abandoned Application

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Hortig, Michael, Schrimpf, Thomas
• Application Number:
  US13/432,159
• Publication Number:
  US 20120247205A1
• Time in Patent Office: Days
• US Class Current: 73/431
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 7/0074 3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
• CPC Class Codes: G01D 11/245 Housings for sensors
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

A sensor module has an electrically conductive part, a first sensor element, and a second sensor element, the first sensor element being situated in a first accommodating area of the conductive part, and the second sensor element being situated in a second accommodating area of the conductive part, and the conductive part furthermore having a bent area situated between the first and the second accommodating areas so that the second accommodating area is oriented at an angle with respect to the first accommodating area.

Claims

1. A sensor module, comprising:

an electrically conductive part;

a first sensor element being situated in a first accommodating area of the conductive part; and

a second sensor element being situated in a second accommodating area of the conductive part;

wherein the conductive part includes a bent area situated between the first and the second accommodating areas so that the second accommodating area is oriented at an angle with respect to the first accommodating area.

2. The sensor module of claim 1, wherein the first accommodating area is angled essentially at 90°

with respect to the second accommodating area.

3. The sensor module of claim 1, wherein the sensor module has a third sensor element, which is situated in a third accommodating area of the conductive part, the conductive part having another bent area situated between the second and the third accommodating areas, so that the third accommodating area is angled with respect to the second accommodating area.

4. The sensor module of claim 1, wherein the third accommodating area is oriented essentially perpendicularly both to the first accommodating area and to the second accommodating area.

5. The sensor module of claim 1, wherein the conductive part is at least partially enclosed by a housing, which includes an injection-molded plastic material.

6. The sensor module of claim 1, wherein the conductive part has at least one of a first fastening clamp for fastening the first sensor element in the first accommodating area, a second fastening clamp for fastening the second sensor element in the second accommodating area, and a third fastening clamp for fastening the third sensor element in the third accommodating area.

7. A method for manufacturing a sensor module, as recited in one of the preceding claims, the method comprising:

(a) providing a conductive part, which has a first accommodating area for accommodating a first sensor element and a second accommodating area for accommodating a second sensor element; and

(b) bending the conductive part in an area situated between the first accommodating area and the second accommodating area so that the second accommodating area is oriented at an angle with respect to the first accommodating area;

wherein the sensor module, includes;

an electrically conductive part;

the first sensor element being situated in the first accommodating area of the conductive part; and

the second sensor element being situated in the second accommodating area of the conductive part.

wherein the conductive part includes a bent area situated between the first and the second accommodating areas so that the second accommodating area is oriented at an angle with respect to the first accommodating area.

8. The method of claim 7, wherein in (a), the conductive part has a third accommodating area for accommodating a third sensor element, further comprising:

(c) bending the conductive part in an additional area situated between the second accommodating area and the third accommodating area so that the third accommodating area is oriented at an angle with respect to the second accommodating area.

9. The method of claim 8, further comprising:

placing at least one of the first sensor element in the first accommodating area, the second sensor element in the second accommodating area, and the third sensor element in the third accommodating area with the aid of at least one of a soldering procedure, a gluing procedure, a clamping procedure, and an insertion procedure.

10. The method of claim 9, further comprising:

extrusion coated using a plastic, for manufacturing a housing, the conductive part, together with at least one of the first sensor element, the second sensor element, and the third sensor element.

11. The method of claim 7, further comprising:

placing at least one of the first sensor element in the first accommodating area, the second sensor element in the second accommodating area, and the third sensor element in the third accommodating area with the aid of at least one of a soldering procedure, a gluing procedure, a clamping procedure, and an insertion procedure.

12. The method of claim 7, further comprising:

extrusion coated using a plastic, for manufacturing a housing, the conductive part, together with at least one of the first sensor element, the second sensor element, and the third sensor element.