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INTERPOSER HAVING AN INDUCTOR

  • US 20120248569A1
  • Filed: 03/29/2011
  • Published: 10/04/2012
  • Est. Priority Date: 03/29/2011
  • Status: Active Grant
First Claim
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1. A multichip module, comprising:

  • a semiconductor die;

    an interposer having conductive layers, dielectric layers, and a substrate;

    a plurality of internal interconnect structures that couple the semiconductor die to the interposer;

    a plurality of external interconnect structures that are for coupling the interposer to an external device;

    a first inductor that comprises at least a portion of one or more of the conductive layers of the interposer;

    a first end of the first inductor coupled to an internal interconnect structure of the plurality of internal interconnect structures; and

    a second end of the first inductor coupled to an external interconnect structure of the plurality of external interconnect structures.

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