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MEMS DEVICE AND MANUFACTURING PROCESS THEREOF

  • US 20120248615A1
  • Filed: 02/21/2012
  • Published: 10/04/2012
  • Est. Priority Date: 03/28/2011
  • Status: Active Grant
First Claim
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1. A MEMS device comprising:

  • a first substrate comprising at least a first circuit disposed on a surface of the first substrate;

    a second substrate having a first surface and a second surface, the second substrate comprising;

    a MEMS component disposed on the surface of the first substrate with the first surface facing towards the first substrate, and electrically connected with the first circuit;

    a conducting part electrically isolated from the MEMS component, and electrically connected with the first circuit; and

    a second circuit disposed on the second surface of the MEMS component, electrically isolated from the MEMS component, and electrically connected with the first circuit via the conducting part;

    a third substrate having a recessed region and a plurality of standoff structures, disposed over the second substrate, and connecting to the first substrate with the standoff structures such that the second substrate is enclosed in the recessed region.

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