LIGHT EMITTING DEVICE-LIGHT RECEIVING DEVICE ASSEMBLY, AND MANUFACTURING METHOD THEREOF

• US 20120248977A1
• Filed: 03/02/2012
• Published: 10/04/2012
• Est. Priority Date: 03/29/2011
• Status: Active Grant

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Ootorii, Hiizu
• Granted Patent: US 9,159,712 B2
• Time in Patent Office: Days
• US Class Current: 313/524
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83874 Ultraviolet [UV] curing
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/15788 Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01S 2301/176 : Specific passivation layers on surfaces other than the emission facet
• CPC Class Codes: H01S 5/02345 : Wire-bonding
• CPC Class Codes: H01S 5/0262 : Photo-diodes, e.g. transceiver devices, bidirectional devices H01S5/0265 takes precedence
• CPC Class Codes: H01S 5/04257 : having positive and negative electrodes on the same side of the substrate
• CPC Class Codes: H01S 5/18305 : with emission through the substrate, i.e. bottom emission
• CPC Class Codes: H01S 5/18388 : Lenses
• CPC Class Codes: Y10T 29/49002 : Electrical device making

Abstract

A light emitting device-light receiving device assembly includes: a mount substrate having first and second surfaces, and including a first base as a raised portion on the first surface; a light receiving device having first and second surfaces, the first surface of the light receiving device being anchored on the first base; and a light emitting device, the light receiving device including a light passage portion allowing for passage of light emitted by the light emitting device, the light emitted by the light emitting device emerging to outside through the light passage portion, the first base, and the mount substrate, the light receiving device receiving externally incident light through the mount substrate and the first base, the light receiving device including an annular second base as a raised portion on the second surface of the light receiving device, and the light emitting device being anchored on the second base.

Claims

1. A light emitting device-light receiving device assembly, comprising:

a mount substrate that has a first surface and a second surface opposite the first surface, and that includes a first base provided as a raised portion on the first surface;

a light receiving device that has a first surface and a second surface opposite the first surface, the first surface of the light receiving device being anchored on the first base; and

a light emitting device,

the light receiving device including a light passage portion that allows for passage of light emitted by the light emitting device,

the light emitted by the light emitting device emerging to outside through the light passage portion of the light receiving device, the first base, and the mount substrate,

the light receiving device receiving externally incident light through the mount substrate and the first base,

the light receiving device including an annular second base provided as a raised portion on the second surface of the light receiving device, and

the light emitting device being anchored on the second base.

2. The light emitting device-light receiving device assembly according to claim 1, wherein the second base is formed of a metal layer or an alloy layer.

3. The light emitting device-light receiving device assembly according to claim 1, wherein the light emitting device is formed of a surface-emitting laser device.

4. The light emitting device-light receiving device assembly according to claim 3, wherein the surface-emitting laser device is a bottom-emission surface-emitting laser device.

5. The light emitting device-light receiving device assembly according to claim 1,

wherein the mount substrate has a lens provided on the second surface of the mount substrate,

wherein the light emitted by the light emitting device emerges to outside through the light passage portion of the light receiving device, the first base, the mount substrate, and the lens, and

wherein the light receiving device receives externally incident light through the lens, the mount substrate, and the first base.

6. The light emitting device-light receiving device assembly according to claim 5,

wherein the lens has a light reflecting member provided at a central portion of the lens,

wherein a part of the emitted light from the light emitting device emerges to outside through the light passage portion of the light receiving device, the first base, the mount substrate, and the lens, and

wherein the remains of the emitted light from the light emitting device are reflected by the light reflecting member into the light receiving device through the mount substrate and the first base.

7. The light emitting device-light receiving device assembly according to claim 5, wherein the center of the lens coincides with the center of the light receiving device and the light emitting device.

8. The light emitting device-light receiving device assembly according to claim 1, wherein the first base has the same outer shape as the first surface of the light receiving device.

9. The light emitting device-light receiving device assembly according to claim 1, wherein the second base has the same outer shape as the first surface of the light emitting device.

10. The light emitting device-light receiving device assembly according to claim 1, wherein the first surface of the light receiving device is anchored on the first base with a transmissive first adhesive layer.

11. The light emitting device-light receiving device assembly according to claim 1, wherein the light emitting device is anchored on the second base with a second adhesive layer.

12. A method for manufacturing a light emitting device-light receiving device assembly that includes

a mount substrate that has a first surface and a second surface opposite the first surface, and that includes a first base provided as a raised portion on the first surface;

a light receiving device that has a first surface and a second surface opposite the first surface, the first surface of the light receiving device being anchored on the first base; and

a light emitting device,

the light receiving device including a light passage portion that allows for passage of light emitted by the light emitting device,

the light emitted by the light emitting device emerging to outside through the light passage portion of the light receiving device, the first base, and the mount substrate,

the light receiving device receiving externally incident light through the mount substrate and the first base,

the light receiving device including an annular second base provided as a raised portion on the second surface of the light receiving device, and

the light emitting device being anchored on the second base,

the method comprising;

preparing the mount substrate that includes the first base provided in a first pitch P₁;

preparing a light receiving device temporarily fastening substrate to which the second surface of the light receiving device is temporarily fastened in a second pitch P₂ (m₂·

P₂=P₁, where m₂ is a positive integer);

preparing a light emitting device temporarily fastening substrate to which the light emitting device is temporarily fastened in a third pitch P₃ (m₂·

P₂=P₁, where m₃ is a positive integer);

disposing the first surface of every m₂ light receiving devices on the first base, and removing the disposed light receiving devices from the light receiving device temporarily fastening substrate; and

disposing every m₃ light emitting devices on the second base provided on the second surface of the light receiving device, and removing the disposed light emitting devices from the light emitting device temporarily fastening substrate.

13. The method according to claim 12, wherein the preparing the light receiving device temporarily fastening substrate includes:

fabricating the light receiving device on a light receiving device fabrication substrate;

temporarily fastening the second surface of the light receiving device to the light receiving device temporarily fastening substrate in the second pitch P₂; and

removing the light receiving device fabrication substrate to expose the first surface of the light receiving device.

14. The method according to claim 12, wherein the preparing the light emitting device temporarily fastening substrate includes:

fabricating the light emitting device on a light emitting device fabrication substrate;

temporarily fastening the second surface of the light emitting device to the light emitting device temporarily fastening substrate in the third pitch P₃; and

removing the light emitting device fabrication substrate to expose a first surface of the light emitting device.

15. The method according to claim 12, wherein the disposing the first surface of every m₂ light receiving devices on the first base, and removing the disposed light receiving devices from the light receiving device temporarily fastening substrate includes:

forming a transmissive first adhesive layer at least on the first base;

disposing the light receiving device on the first base by mounting the light receiving device on the first adhesive layer formed on the first base; and

separating the disposed light receiving device from the light receiving device temporarily fastening substrate.

16. The method according to claim 12, wherein the disposing every m₃ light emitting devices on the second base provided on the second surface of the light receiving device, and removing the disposed light emitting devices from the light emitting device temporarily fastening substrate includes:

forming a second adhesive layer at least on the second base;

disposing the light emitting device on the second base by mounting the light emitting device on the second adhesive layer formed on the second base; and

separating the disposed light emitting device from the light emitting device temporarily fastening substrate.