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SEMICONDUCTOR PACKAGE WITH INCORPORATED LIGHT OR TEMPERATURE SENSORS AND TIME MULTIPLEXING

  • US 20120248988A1
  • Filed: 01/23/2009
  • Published: 10/04/2012
  • Est. Priority Date: 01/30/2008
  • Status: Active Grant
First Claim
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1. A package having at least two pins, the package comprisinga semiconductor structure having a first function,an electrical circuit comprising at least one circuit element having a second function, said circuit element having a diode property and being arranged anti-parallel to the semiconductor structure,wherein the structure and the circuit are electrically connected to the pins,wherein the package is operable to perform the first and second function by time multiplexing a first operating signal with a positive polarity and a second operating signal with a negative polarity through the pins, andwherein the first function is a lighting function and the second function is a sensing function.

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