RADIO FREQUENCY PRINTED CIRCUIT BOARD

• US 20120249381A1
• Filed: 06/10/2011
• Published: 10/04/2012
• Est. Priority Date: 03/28/2011
• Status: Active Grant

• Current Assignee: Hongfujin Precision Electronics (Tianjin) Co. Ltd. (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. (Hon Hai Precision Industry Co., Ltd.), Hon Hai Precision Industry Co., Ltd.
• Inventors: WANG, JUN-WEI, TSEN, CHUN-CHIEH
• Granted Patent: US 8,659,489 B2
• Time in Patent Office: Days
• US Class Current: 343/703
• CPC Class Codes: G01R 31/2822 of microwave or radiofrequency circuits of attenuation, gain, e.g. using network analyzers G01R27/28
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/0268 for electrical inspection or testing
• CPC Class Codes: H05K 2203/162 Testing a finished product, e.g. heat cycle testing of solder joints

Abstract

A radio frequency(RF) printed circuit board (PCB) includes an RF circuit for generating high frequency signals. The RF PCB is connected to an EMC measuring device when measuring the EMC thereof. The measuring device includes a probe pin and a shielding barrel surrounding the probe pin. The shielding barrel includes an end surface at a distal end thereof. The RF PCB further includes a test node connected to the RF circuit and a ground node surrounding the test node. The test node contacts the probe pin and outputs the high frequency signals when measuring the EMC of the RF PCB. The ground node corresponds to the end surface and contacts the end surface while the probe pin contacts the test node.

Claims

1. A radio frequency (RF) printed circuit board (PCB) comprising a RF circuit for generating high frequency signals;

the RF PCB adaptable to be connected to a probe of an electromagnetic compatibility (EMC) measuring device when measuring the EMC of the RF PCB, the probe comprising a probe pin and a shielding barrel surrounding the probe pin, the shielding barrel comprising an end surface at a distal end of the shielding barrel, the probe pin extending to a plane that the end surface is in;

the RF PCB further comprising;

a test node connected to the RF circuit, the test node being configured to contact the probe pin and output the high frequency signals when EMC of the RF PCB is measured;

a ground node surrounding the test node, the ground node corresponding to the end surface and configured to contact the end surface while the probe pin contacts the test node.

2. The RF PCB of claim 1, wherein the RF circuit comprises an output node to output the high frequency signals;

the RF PCB further comprises a first surface and a second surface opposite to the first surface, the output node is arranged on the first surface, the test node and the ground node are arranged on the second surface.

3. The RF PCB of claim 1, wherein the ground node is annular.

4. The RF PCB of claim 3, wherein the inner diameter of the ground node is less than that of the end surface, the outer diameter of the ground node is greater than that of the end surface.

5. The RF PCB of claim 3, wherein the ground node centers on the testing port.

6. The RF PCB of claim 1 further comprising an antenna and a socket, wherein the antenna is configured to emit the high frequency signals and detachably connected to the RF circuit through the socket.

7. The RF PCB of claim 1 further comprising an antenna and a switch, wherein the antenna is configured to emit the high frequency signals and connected to the RF circuit through the switch.