ADVANCED TECHNIQUES FOR BONDING METAL TO PLASTIC

• US 20120250250A1
• Filed: 09/21/2011
• Published: 10/04/2012
• Est. Priority Date: 04/01/2011
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Tatebe, Masashige
• Granted Patent: US 9,280,183 B2
• Time in Patent Office: Days
• US Class Current: 361/679.55
• CPC Class Codes: B29C 2045/14868 Pretreatment of the insert, e.g. etching, cleaning
• CPC Class Codes: B29C 45/14311 using means for bonding the coating to the articles B29C45/14795 takes precedence
• CPC Class Codes: B29K 2081/04 Polysulfides, e.g. PPS, i.e. polyphenylene sulfide or derivatives thereof
• CPC Class Codes: B29K 2705/00 Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
• CPC Class Codes: B29L 2031/3481 Housings or casings incorporating or embedding electric or electronic elements
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: Y10T 29/49982 Coating

Abstract

Techniques for combining a polymer layer and a metal layer to form a multi-layer structure are disclosed. In one embodiment, an intermediate layer having pores, openings or voids is secured to the metal layer, and then the polymer layer is molded to the intermediate layer, whereby the pores, openings or voids in the surface of the intermediate layer serve to facilitate securing of the polymer layer to the metal layer. The multi-layer structure is suitable for use in as a portion of a housing for an electronic device, such as a portable electronic device.

Claims

1. A method for forming a multi-layer structure for an electronic device, the method comprising:

obtaining a metal layer;

placing an intermediate layer on the metal layer, the intermediate layer including openings or voids at least at an exposed surface; and

forming a polymer-based layer on the exposed surface of the intermediate layer.

2. A method as recited in claim 1, wherein the placing of the intermediate layer comprises plating the intermediate layer on the metal layer.

3. A method as recited in claim 1, wherein the forming comprises molding the polymer-based layer on the exposed surface of the intermediate layer.

4. A method as recited in claim 3, wherein the molding is injection molding.

5. A method as recited in claim 1, wherein the metal layer comprises aluminum or stainless steel.

6. A method as recited in claim 1, wherein the intermediate layer comprises Nickel, Zinc and/or Copper.

7. A method as recited in claim 1, wherein the intermediate layer primarily includes Nickel.

8. A method as recited in claim 7, wherein the intermediate layer is porous.

9. A method as recited in claim 7, wherein the intermediate layer has voids.

10. A method as recited in claim 1, wherein the voids are arbitrarily provided in the intermediate layer.

11. A method as recited in claim 1, wherein the voids are designed into the intermediate layer.

12. A method for forming a housing for a portable electronic device, the method comprising:

providing a metal housing layer for the housing for the portable electronic device;

plating the metal layer with a porous metal layer;

molding a polymer housing layer onto the porous metal layer; and

subsequently attaching one or more internal structural components internal to the housing.

13. A method as recited in claim 12, wherein the metal housing layer is an inner layer for the housing, and the polymer housing layer is an outer layer.

14. A method as recited in claim 12, wherein the polymer housing layer is an inner layer, and the metal housing layer is an outer layer for the housing.

15. A method as recited in claim 12, wherein the porous metal layer includes a plurality of pores.

16. A method as recited in claim 12, wherein the porous metal layer includes a plurality of voids or openings.

17. A method as recited in claim 12,

wherein the metal layer comprises aluminum or stainless steel, and

wherein the porous metal layer primarily includes Nickel.

18. A consumer electronic device, comprising:

at least one housing assembly, the at least one housing assembly including at least;

a first housing layer,

a second housing layer, and

an intermediate porous layer interposed between at least a portion of the first housing layer and the second housing layer,

wherein the intermediate porous layer is formed on the first housing layer, and the second housing layer is formed on the intermediate porous layer.

19. A consumer electronic device as recited in claim 18, wherein the intermediate porous layer is formed on the first housing layer by a plating process, and wherein the second housing layer is formed on the intermediate layer by a molding process.

20. A consumer electronic device as recited in claim 18, wherein the consumer electronic device is a computing device.

21. A consumer electronic device as recited in claim 18, wherein the consumer electronic device is a portable computing device.

22. A consumer electronic device as recited in claim 18, the consumer electronic device is a mobile communication device.

23. A consumer electronic device as recited in claim 18, wherein the thickness of the intermediate layer is 0.5-3 microns.

24. A consumer electronic device as recited in claim 18, wherein the second housing layer is polymer that is placed on the intermediate layer by an injection molding process.

25. A consumer electronic device as recited in claim 24, wherein the polymer is Polyphenylene Sulfide.