MEMORY MODULE HAVING MEMORY CHIP AND REGISTER BUFFER
First Claim
1. A memory module comprising:
- a module substrate that includes a plurality of wiring layers including at least first and second wiring layers, and a plurality of contact plugs penetrating through the plurality of wiring layers;
a register buffer that is mounted on the module substrate and includes a plurality of output terminals classified into at least first and second groups; and
a memory chip that is mounted on the module substrate and includes a plurality of input terminals classified into at least first and second groups, whereineach of the output terminals belonging to the first group is connected to an associated one of the input terminals belonging to the first group through associated ones of the plurality of contact plugs and the first wiring layer, andeach of the output terminals belonging to the second group is connected to an associated one of the input terminals belonging to the second group through associated ones of the plurality of contact plugs and the second wiring layer.
3 Assignments
0 Petitions
Accused Products
Abstract
Disclosed herein is a memory module that includes a register buffer and a memory chip each mounted on a module substrate. Each of the command address output terminals belonging to the first group provided on the register buffer is connected to an associated one of the command address input terminals belonging to the first group provided on the memory chip through associated ones of the plurality of contact plugs and the first wiring layer. Each of the command address output terminals belonging to the second group provided on the register buffer is connected to an associated one of the command address input terminals belonging to the second group provided on the memory chip through associated ones of the plurality of contact plugs and the second wiring layer.
40 Citations
17 Claims
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1. A memory module comprising:
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a module substrate that includes a plurality of wiring layers including at least first and second wiring layers, and a plurality of contact plugs penetrating through the plurality of wiring layers; a register buffer that is mounted on the module substrate and includes a plurality of output terminals classified into at least first and second groups; and a memory chip that is mounted on the module substrate and includes a plurality of input terminals classified into at least first and second groups, wherein each of the output terminals belonging to the first group is connected to an associated one of the input terminals belonging to the first group through associated ones of the plurality of contact plugs and the first wiring layer, and each of the output terminals belonging to the second group is connected to an associated one of the input terminals belonging to the second group through associated ones of the plurality of contact plugs and the second wiring layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A module comprising:
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a module substrate includes a plurality of wiring layers including at least first and second wiring layers, and first and second contact plugs, each of the first and second contact plugs penetrating through the wiring layers; a resister buffer mounted on the module substrate and including first and second output terminals; and a plurality of chips mounted on the module substrate, each of the chips including first and second input terminals, wherein the first output terminal of the resister buffer is commonly connected to the first input terminals of the chips through the first contact plug and the first wiring layer, and the second output terminal of the resister buffer is commonly connected to the second input terminals of the chips through the second contact plug and the second wiring layer. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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Specification